The XCV100E-7BG560C is a high-performance Xilinx FPGA from the Virtex-E family, designed for demanding logic design applications that require fast, flexible, and high-capacity programmable logic. Built on Xilinx’s advanced 0.18 µm CMOS process with six-layer metal technology, this 1.8V FPGA delivers a powerful combination of speed, density, and I/O flexibility in a 560-pin Ball Grid Array (BGA) package.
Whether you are developing communications systems, embedded processing applications, or high-speed digital interfaces, the XCV100E-7BG560C is a proven, reliable solution from one of the industry’s most trusted FPGA product families.
What Is the XCV100E-7BG560C?
The XCV100E-7BG560C is a member of the Xilinx Virtex-E 1.8V Field Programmable Gate Array (FPGA) family. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XCV100E |
Virtex-E family, 100K system gates |
| -7 |
Speed grade 7 (commercial speed) |
| BG560 |
Ball Grid Array, 560-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
This FPGA belongs to AMD Xilinx’s classic Virtex-E series — a generation that brought dramatic improvements in silicon efficiency, place-and-route optimization, and programmable system features compared to earlier FPGA families.
XCV100E-7BG560C Key Specifications
Core Device Parameters
| Parameter |
Specification |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Virtex-E |
| Part Number |
XCV100E-7BG560C |
| Number of Gates |
~32,400 system gates |
| Logic Cells / CLBs |
2,700 logic cells |
| CLB Rows × Columns |
30 × 30 configurable logic blocks |
| Max Frequency |
400 MHz |
| Supply Voltage (VCCINT) |
1.8V (1.71V – 1.89V) |
| Technology Process |
0.18 µm CMOS, 6-layer metal |
| Mounting Type |
Surface Mount |
| Operating Temperature |
0°C to +85°C (TJ) – Commercial |
Package Information
| Parameter |
Specification |
| Package Type |
BGA (Ball Grid Array) |
| Package Designator |
BG560 |
| Total Pin Count |
560 |
| Package Format |
560-LBGA Exposed Pad, Metal |
| Pitch |
Fine-pitch BGA |
| Tray/Packaging |
Tray (for surface-mount assembly) |
Memory & I/O Resources
| Resource |
Specification |
| Block RAM Bits |
32,768 bits (distributed) |
| Distributed SelectRAM |
Integrated per CLB |
| Max User I/O |
Up to 160 user I/O pins (BG560 package) |
| I/O Standards Supported |
LVTTL, LVCMOS, GTL, GTL+, SSTL, HSTL, PCI, AGP |
| DLL (Delay-Locked Loop) |
4 DLLs for clock management |
XCV100E-7BG560C Architecture Overview
Configurable Logic Blocks (CLBs)
The XCV100E-7BG560C uses Xilinx’s mature and efficient CLB architecture. Each CLB contains four logic cells (LCs) organized into two slices, with each slice containing two 4-input Look-Up Tables (LUTs) and two storage elements (flip-flops). This structure enables highly efficient implementation of combinational and sequential logic functions.
Each CLB also features logic to combine function generators for 5- or 6-input functions, meaning each CLB effectively counts as 4.5 logic cells for gate estimation purposes.
SelectRAM and Block RAM
The Virtex-E architecture integrates distributed SelectRAM within every CLB, allowing any LUT to function as a 16×1-bit synchronous RAM. This provides flexible, fast, on-chip memory without consuming dedicated block RAM resources. The device also features dedicated block RAM resources for larger memory requirements.
I/O Blocks (IOBs) and I/O Standards
Every IOB in the XCV100E-7BG560C supports:
- Programmable input and output delays
- IEEE 1149.1 (JTAG) Boundary Scan compatibility
- Multiple I/O voltage standards within separate I/O banks
- 3-state control for bidirectional data lines
I/O pins are organized into two banks, and each bank’s voltage is set by the VCCO supply pins. This allows mixing of different I/O standards across banks while keeping each bank’s outputs at a consistent voltage.
Clock Management with DLLs
The XCV100E-7BG560C includes four Delay-Locked Loops (DLLs) for advanced clock management. The DLLs eliminate clock distribution skew, support clock multiplication and division, and enable precise phase alignment between internal and external clock signals.
Part Number Decode Table
Understanding the Xilinx Virtex-E part number convention helps identify the right device for your design:
| Field |
Example |
Description |
| Family |
XCV |
Xilinx Virtex |
| Density |
100E |
~100K gates, Virtex-E generation |
| Speed Grade |
-7 |
Timing performance indicator (higher = faster) |
| Package |
BG |
Ball Grid Array |
| Pin Count |
560 |
Number of package pins |
| Temp Range |
C |
Commercial (0°C to +85°C); I = Industrial (-40°C to +100°C) |
XCV100E Virtex-E Family Comparison
The XCV100E is the entry-level device in the Virtex-E series. Below is how it compares to other members of the same family:
| Device |
System Gates |
Logic Cells |
Max User I/O |
Block RAM Bits |
| XCV100E |
~32,400 |
2,700 |
160 |
32,768 |
| XCV200E |
~71,693 |
5,292 |
284 |
65,536 |
| XCV300E |
~139,419 |
6,912 |
316 |
98,304 |
| XCV400E |
~187,132 |
9,216 |
404 |
131,072 |
| XCV600E |
~263,692 |
15,552 |
514 |
229,376 |
| XCV1000E |
~455,696 |
27,648 |
660 |
393,216 |
| XCV1600E |
~732,298 |
44,288 |
784 |
589,824 |
Note: The XCV100E-7BG560C uses the BG560 package, which provides more I/O headroom than smaller packages in the same device family (e.g., FG256), making it well-suited for applications requiring high pin counts.
Available Speed Grades for XCV100E
Xilinx Virtex-E devices are offered in multiple speed grades. Higher speed grades offer faster propagation delays and maximum clock frequencies:
| Speed Grade |
Performance Level |
Common Use Case |
| -6 |
Standard |
Cost-sensitive, moderate-speed applications |
| -7 |
Medium (this device) |
General-purpose high-performance designs |
| -8 |
Fastest |
Highest-speed, timing-critical applications |
The XCV100E-7BG560C at speed grade -7 strikes an excellent balance between performance and cost for most commercial applications.
Configuration Modes
The XCV100E-7BG560C supports four standard Xilinx configuration modes:
| Mode |
Description |
| Master Serial |
FPGA drives configuration clock; bitstream loaded from serial PROM |
| Slave Serial |
External device drives clock; suited for daisy-chaining multiple FPGAs |
| Master Parallel |
Byte-wide data path for fast configuration from parallel flash |
| SelectMAP |
Fastest mode; byte-wide data with BUSY flag handshake |
After configuration, SelectMAP port pins can be repurposed as additional general-purpose I/O.
Boundary Scan (JTAG) Support
The XCV100E-7BG560C is fully compliant with IEEE 1149.1 JTAG Boundary Scan, providing:
- In-circuit testability for board-level debug and verification
- Access to internal signals via unconnected or unused IOBs
- Support for EXTEST, SAMPLE/PRELOAD, BYPASS, IDCODE, USER1, and USER2 instructions
- A full boundary scan register with three bits per IOB (In, Out, 3-State Control)
Design Tools & Software Support
The XCV100E-7BG560C is supported by Xilinx’s legacy design tools:
| Tool |
Function |
| Xilinx ISE Design Suite |
Primary synthesis, implementation, and bitstream generation |
| FPGA Foundation |
HDL-based design entry and synthesis (legacy) |
| XDM Software |
Device programming and configuration |
| TRCE Static Timing Analyzer |
Timing closure and analysis |
| Synopsys FPGA Express |
Third-party synthesis integration |
For HDL design, both VHDL and Verilog are fully supported. The EDIF (Electronic Design Interchange Format) ensures compatibility with third-party EDA tools.
Note: While Xilinx Vivado Design Suite does not support legacy Virtex-E devices, Xilinx ISE 14.7 remains the recommended toolchain for the XCV100E-7BG560C.
Applications of the XCV100E-7BG560C
The XCV100E-7BG560C is widely used across multiple industries and application areas:
| Application Area |
Use Case |
| Communications |
Protocol bridging, SONET/SDH framing, packet processing |
| Industrial Automation |
Motor control, sensor fusion, machine vision interface |
| Embedded Systems |
Custom processor implementation, peripheral controllers |
| Test & Measurement |
Signal capture, pattern generation, data acquisition front-end |
| Aerospace & Defense |
Radiation-tolerant-class logic prototyping, signal processing |
| Consumer Electronics |
Video processing, display controllers, image scaling |
| Medical Devices |
Real-time signal processing, protocol interfaces |
Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCV100E-7BG560C |
| Manufacturer |
Xilinx / AMD |
| Product Series |
Virtex-E |
| Package |
560-Ball BGA |
| Speed Grade |
-7 |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Status |
Check with distributor (legacy part; pre-RoHS era) |
| Minimum Order Quantity |
Typically 1 unit (varies by distributor) |
Related Part Numbers
If the XCV100E-7BG560C does not match your exact requirements, consider these closely related alternatives:
| Part Number |
Difference |
| XCV100E-6BG560C |
Same device, slower speed grade (-6) |
| XCV100E-8BG560C |
Same device, faster speed grade (-8) — where available |
| XCV100E-7BG352C |
Same device and speed, smaller 352-pin BGA package |
| XCV100E-7FG256C |
Same device and speed, 256-pin Fine-pitch BGA |
| XCV200E-7BG560C |
Higher density (200K gates), same package |
| XCV400E-7BG560C |
Higher density (400K gates), same package |
Why Choose the XCV100E-7BG560C?
The XCV100E-7BG560C remains a compelling choice for designers working on legacy-compatible boards, production-proven designs, and cost-efficient FPGA applications where a smaller gate count is sufficient. Key strengths include:
- Proven 0.18 µm silicon with excellent reliability and long-term availability through authorized distributors
- Rich I/O flexibility with 160 user I/Os and support for numerous voltage standards in the BG560 package
- Robust clock management with 4 DLLs for clean, low-skew clock distribution
- Full JTAG boundary scan for simplified board-level testing
- Broad ecosystem of EDA tools, reference designs, and application notes from Xilinx