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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCV100E-7BG560C: Xilinx Virtex-E FPGA – Full Specifications & Datasheet Guide

Product Details

The XCV100E-7BG560C is a high-performance Xilinx FPGA from the Virtex-E family, designed for demanding logic design applications that require fast, flexible, and high-capacity programmable logic. Built on Xilinx’s advanced 0.18 µm CMOS process with six-layer metal technology, this 1.8V FPGA delivers a powerful combination of speed, density, and I/O flexibility in a 560-pin Ball Grid Array (BGA) package.

Whether you are developing communications systems, embedded processing applications, or high-speed digital interfaces, the XCV100E-7BG560C is a proven, reliable solution from one of the industry’s most trusted FPGA product families.


What Is the XCV100E-7BG560C?

The XCV100E-7BG560C is a member of the Xilinx Virtex-E 1.8V Field Programmable Gate Array (FPGA) family. The part number breaks down as follows:

Part Number Segment Meaning
XCV100E Virtex-E family, 100K system gates
-7 Speed grade 7 (commercial speed)
BG560 Ball Grid Array, 560-pin package
C Commercial temperature range (0°C to +85°C)

This FPGA belongs to AMD Xilinx’s classic Virtex-E series — a generation that brought dramatic improvements in silicon efficiency, place-and-route optimization, and programmable system features compared to earlier FPGA families.


XCV100E-7BG560C Key Specifications

Core Device Parameters

Parameter Specification
Manufacturer Xilinx (AMD)
Product Family Virtex-E
Part Number XCV100E-7BG560C
Number of Gates ~32,400 system gates
Logic Cells / CLBs 2,700 logic cells
CLB Rows × Columns 30 × 30 configurable logic blocks
Max Frequency 400 MHz
Supply Voltage (VCCINT) 1.8V (1.71V – 1.89V)
Technology Process 0.18 µm CMOS, 6-layer metal
Mounting Type Surface Mount
Operating Temperature 0°C to +85°C (TJ) – Commercial

Package Information

Parameter Specification
Package Type BGA (Ball Grid Array)
Package Designator BG560
Total Pin Count 560
Package Format 560-LBGA Exposed Pad, Metal
Pitch Fine-pitch BGA
Tray/Packaging Tray (for surface-mount assembly)

Memory & I/O Resources

Resource Specification
Block RAM Bits 32,768 bits (distributed)
Distributed SelectRAM Integrated per CLB
Max User I/O Up to 160 user I/O pins (BG560 package)
I/O Standards Supported LVTTL, LVCMOS, GTL, GTL+, SSTL, HSTL, PCI, AGP
DLL (Delay-Locked Loop) 4 DLLs for clock management

XCV100E-7BG560C Architecture Overview

Configurable Logic Blocks (CLBs)

The XCV100E-7BG560C uses Xilinx’s mature and efficient CLB architecture. Each CLB contains four logic cells (LCs) organized into two slices, with each slice containing two 4-input Look-Up Tables (LUTs) and two storage elements (flip-flops). This structure enables highly efficient implementation of combinational and sequential logic functions.

Each CLB also features logic to combine function generators for 5- or 6-input functions, meaning each CLB effectively counts as 4.5 logic cells for gate estimation purposes.

SelectRAM and Block RAM

The Virtex-E architecture integrates distributed SelectRAM within every CLB, allowing any LUT to function as a 16×1-bit synchronous RAM. This provides flexible, fast, on-chip memory without consuming dedicated block RAM resources. The device also features dedicated block RAM resources for larger memory requirements.

I/O Blocks (IOBs) and I/O Standards

Every IOB in the XCV100E-7BG560C supports:

  • Programmable input and output delays
  • IEEE 1149.1 (JTAG) Boundary Scan compatibility
  • Multiple I/O voltage standards within separate I/O banks
  • 3-state control for bidirectional data lines

I/O pins are organized into two banks, and each bank’s voltage is set by the VCCO supply pins. This allows mixing of different I/O standards across banks while keeping each bank’s outputs at a consistent voltage.

Clock Management with DLLs

The XCV100E-7BG560C includes four Delay-Locked Loops (DLLs) for advanced clock management. The DLLs eliminate clock distribution skew, support clock multiplication and division, and enable precise phase alignment between internal and external clock signals.


Part Number Decode Table

Understanding the Xilinx Virtex-E part number convention helps identify the right device for your design:

Field Example Description
Family XCV Xilinx Virtex
Density 100E ~100K gates, Virtex-E generation
Speed Grade -7 Timing performance indicator (higher = faster)
Package BG Ball Grid Array
Pin Count 560 Number of package pins
Temp Range C Commercial (0°C to +85°C); I = Industrial (-40°C to +100°C)

XCV100E Virtex-E Family Comparison

The XCV100E is the entry-level device in the Virtex-E series. Below is how it compares to other members of the same family:

Device System Gates Logic Cells Max User I/O Block RAM Bits
XCV100E ~32,400 2,700 160 32,768
XCV200E ~71,693 5,292 284 65,536
XCV300E ~139,419 6,912 316 98,304
XCV400E ~187,132 9,216 404 131,072
XCV600E ~263,692 15,552 514 229,376
XCV1000E ~455,696 27,648 660 393,216
XCV1600E ~732,298 44,288 784 589,824

Note: The XCV100E-7BG560C uses the BG560 package, which provides more I/O headroom than smaller packages in the same device family (e.g., FG256), making it well-suited for applications requiring high pin counts.


Available Speed Grades for XCV100E

Xilinx Virtex-E devices are offered in multiple speed grades. Higher speed grades offer faster propagation delays and maximum clock frequencies:

Speed Grade Performance Level Common Use Case
-6 Standard Cost-sensitive, moderate-speed applications
-7 Medium (this device) General-purpose high-performance designs
-8 Fastest Highest-speed, timing-critical applications

The XCV100E-7BG560C at speed grade -7 strikes an excellent balance between performance and cost for most commercial applications.


Configuration Modes

The XCV100E-7BG560C supports four standard Xilinx configuration modes:

Mode Description
Master Serial FPGA drives configuration clock; bitstream loaded from serial PROM
Slave Serial External device drives clock; suited for daisy-chaining multiple FPGAs
Master Parallel Byte-wide data path for fast configuration from parallel flash
SelectMAP Fastest mode; byte-wide data with BUSY flag handshake

After configuration, SelectMAP port pins can be repurposed as additional general-purpose I/O.


Boundary Scan (JTAG) Support

The XCV100E-7BG560C is fully compliant with IEEE 1149.1 JTAG Boundary Scan, providing:

  • In-circuit testability for board-level debug and verification
  • Access to internal signals via unconnected or unused IOBs
  • Support for EXTEST, SAMPLE/PRELOAD, BYPASS, IDCODE, USER1, and USER2 instructions
  • A full boundary scan register with three bits per IOB (In, Out, 3-State Control)

Design Tools & Software Support

The XCV100E-7BG560C is supported by Xilinx’s legacy design tools:

Tool Function
Xilinx ISE Design Suite Primary synthesis, implementation, and bitstream generation
FPGA Foundation HDL-based design entry and synthesis (legacy)
XDM Software Device programming and configuration
TRCE Static Timing Analyzer Timing closure and analysis
Synopsys FPGA Express Third-party synthesis integration

For HDL design, both VHDL and Verilog are fully supported. The EDIF (Electronic Design Interchange Format) ensures compatibility with third-party EDA tools.

Note: While Xilinx Vivado Design Suite does not support legacy Virtex-E devices, Xilinx ISE 14.7 remains the recommended toolchain for the XCV100E-7BG560C.


Applications of the XCV100E-7BG560C

The XCV100E-7BG560C is widely used across multiple industries and application areas:

Application Area Use Case
Communications Protocol bridging, SONET/SDH framing, packet processing
Industrial Automation Motor control, sensor fusion, machine vision interface
Embedded Systems Custom processor implementation, peripheral controllers
Test & Measurement Signal capture, pattern generation, data acquisition front-end
Aerospace & Defense Radiation-tolerant-class logic prototyping, signal processing
Consumer Electronics Video processing, display controllers, image scaling
Medical Devices Real-time signal processing, protocol interfaces

Ordering Information

Attribute Detail
Manufacturer Part Number XCV100E-7BG560C
Manufacturer Xilinx / AMD
Product Series Virtex-E
Package 560-Ball BGA
Speed Grade -7
Operating Temperature Commercial (0°C to +85°C)
RoHS Status Check with distributor (legacy part; pre-RoHS era)
Minimum Order Quantity Typically 1 unit (varies by distributor)

Related Part Numbers

If the XCV100E-7BG560C does not match your exact requirements, consider these closely related alternatives:

Part Number Difference
XCV100E-6BG560C Same device, slower speed grade (-6)
XCV100E-8BG560C Same device, faster speed grade (-8) — where available
XCV100E-7BG352C Same device and speed, smaller 352-pin BGA package
XCV100E-7FG256C Same device and speed, 256-pin Fine-pitch BGA
XCV200E-7BG560C Higher density (200K gates), same package
XCV400E-7BG560C Higher density (400K gates), same package

Why Choose the XCV100E-7BG560C?

The XCV100E-7BG560C remains a compelling choice for designers working on legacy-compatible boards, production-proven designs, and cost-efficient FPGA applications where a smaller gate count is sufficient. Key strengths include:

  • Proven 0.18 µm silicon with excellent reliability and long-term availability through authorized distributors
  • Rich I/O flexibility with 160 user I/Os and support for numerous voltage standards in the BG560 package
  • Robust clock management with 4 DLLs for clean, low-skew clock distribution
  • Full JTAG boundary scan for simplified board-level testing
  • Broad ecosystem of EDA tools, reference designs, and application notes from Xilinx

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.