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XCV1000E-7FG680C: Xilinx Virtex-E FPGA 512 I/O 680FTEBGA – Complete Product Guide

Product Details

The XCV1000E-7FG680C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Virtex®-E family, manufactured under AMD Xilinx. Designed for demanding programmable logic applications, this device combines a 1.8V supply voltage, 0.18 µm CMOS process technology, and an aggressive 680-pin Fine-Pitch Thin Enhanced Ball Grid Array (FTEBGA) package to deliver one of the most capable FPGAs of its generation. Whether you are designing for telecommunications, industrial automation, military systems, or high-speed signal processing, the XCV1000E-7FG680C offers the logic density, I/O count, and speed grade to meet your project’s requirements.

For engineers seeking a broad selection of compatible devices, explore our full range of Xilinx FPGA solutions.


What Is the XCV1000E-7FG680C? Understanding the Part Number

The part number XCV1000E-7FG680C encodes critical information about the device:

Segment Meaning
XCV Xilinx Virtex FPGA family
1000E Virtex-E series, ~1,000,000 system gates capacity
-7 Speed grade -7 (400 MHz max frequency)
FG680 680-pin Fine-Pitch Ball Grid Array (FBGA) package
C Commercial temperature range (0°C to +85°C)

This naming convention makes it straightforward to identify the device’s family, density, speed, package, and temperature grade at a glance.


XCV1000E-7FG680C Key Specifications and Technical Parameters

The table below provides the complete technical specifications for the XCV1000E-7FG680C as sourced from the AMD Xilinx datasheet and distributor data.

Core Electrical and Logic Specifications

Parameter Value
Manufacturer AMD Xilinx (formerly Xilinx, Inc.)
Series Virtex®-E
Part Number XCV1000E-7FG680C
Description IC FPGA 512 I/O 680FTEBGA
Number of Logic Cells 27,648
Number of CLBs (Configurable Logic Blocks) 6,144
Total Equivalent Gates ~1,569,178 (system gates)
Total RAM Bits 393,216 bits
Number of User I/Os 512
Maximum Operating Frequency 400 MHz
Supply Voltage (VCC) 1.71 V – 1.89 V (nominal 1.8 V)
Process Technology 0.18 µm 6-layer metal CMOS
Operating Temperature 0°C to +85°C (TJ) — Commercial Grade

Package and Mounting Specifications

Parameter Value
Package Type 680-FTEBGA (Fine-Pitch Thin Enhanced BGA)
Package Dimensions 40 mm × 40 mm
Pin Count 680 pins
Mounting Type Surface Mount Technology (SMT)
Packaging Format Tray
RoHS Status See current distributor listing for compliance details

Product Status and Classification

Parameter Value
Product Status Obsolete (Not Recommended for New Designs)
Category Embedded – FPGAs (Field Programmable Gate Array)
DigiKey Part Number 122-1219-ND
Distributor Available via independent and legacy distributors

XCV1000E-7FG680C Architecture Overview: Virtex-E Family Deep Dive

What Makes the Virtex-E Architecture Powerful?

The XCV1000E-7FG680C belongs to Xilinx’s Virtex-E family, which represents a major architectural evolution from the original Virtex platform. The Virtex-E family was engineered to maximize silicon efficiency, with optimizations made specifically for place-and-route performance on a state-of-the-art 0.18 µm CMOS process using 6 layers of metal interconnect. This enabled significantly higher logic density, faster routing, and lower power consumption compared to the prior 0.22 µm Virtex generation.

Configurable Logic Blocks (CLBs) and Logic Cells

The XCV1000E-7FG680C contains 6,144 Configurable Logic Blocks (CLBs), each comprising four slices. Each slice includes two 4-input Look-Up Tables (LUTs), flip-flops, carry logic, and dedicated arithmetic functions. This yields 27,648 logic cells total, supporting complex designs including state machines, arithmetic pipelines, and data path logic.

Block RAM Architecture

With 393,216 bits (384 Kb) of on-chip block RAM, the XCV1000E-7FG680C supports a wide range of memory-intensive applications. Block RAM can be configured as:

RAM Mode Description
Single-Port One read/write port per RAM block
Dual-Port Simultaneous read and write access
ROM Hardcoded initialization for lookup tables
FIFO First-In-First-Out buffer implementations

DLL (Delay-Locked Loop) Clock Management

The Virtex-E family integrates on-chip Delay-Locked Loop (DLL) circuits for superior clock distribution and management. DLLs eliminate clock skew, enable clock multiplication/division, and support phase shifting — critical for synchronous high-speed designs.

I/O Standards Support

The 512 user I/O pins of the XCV1000E-7FG680C support a rich set of programmable I/O standards, providing design flexibility when interfacing with external memory, buses, and peripherals:

I/O Standard Description
LVTTL Low Voltage TTL (3.3V)
LVCMOS 3.3V / 2.5V / 1.8V Low voltage CMOS logic
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic (for DDR memory)
SSTL2 / SSTL3 Stub Series Terminated Logic
PCI / PCI-X Peripheral Component Interconnect bus standard
AGP Accelerated Graphics Port
CTT Center-Tap Terminated

XCV1000E-7FG680C Performance Characteristics

Speed Grade -7 Explained

The -7 speed grade designation indicates the performance tier of this FPGA variant. Within the XCV1000E family, the -7 grade achieves a maximum clock frequency of 400 MHz, making it one of the faster variants suited for time-critical logic functions. Higher speed grades (e.g., -8) may support up to 416 MHz, while slower grades (-6) are rated for 357 MHz.

Propagation Delays and Timing

The Virtex-E -7 speed grade provides competitive internal propagation delays for its generation:

Timing Parameter Typical Value
LUT propagation delay ~0.6 ns
Flip-flop clock-to-output ~0.7 ns
Internal routing delay Application-dependent
Maximum clock frequency 400 MHz

Exact timing values should be obtained from the official Xilinx XCV1000E datasheet and confirmed with timing analysis tools.


Typical Applications of the XCV1000E-7FG680C FPGA

Given its combination of high gate count, large block RAM, extensive I/O, and proven Virtex-E architecture, the XCV1000E-7FG680C is well-suited for a broad range of applications:

Communications and Networking

  • Protocol bridging: Implementing proprietary or standard communication protocols
  • Packet processing: Multi-channel data routing and filtering
  • Framing and error correction: FEC encoder/decoder implementations
  • High-speed serial interfaces: LVDS and differential signaling support

Signal Processing and DSP

  • FIR/IIR digital filters: Multi-tap filter banks leveraging block RAM
  • FFT engines: Fast Fourier Transform pipelines for radar and audio
  • Video processing: Real-time pixel manipulation and pipeline acceleration

Industrial and Military Systems

  • Motor control: Precise PWM generation and encoder feedback processing
  • Sensor fusion: Multi-channel ADC data aggregation and filtering
  • Ruggedized computing: Deterministic logic processing for safety-critical environments
  • Custom ASIC prototyping: Gate-level verification before tape-out

Legacy System Maintenance and Repair

Because the XCV1000E-7FG680C is an obsolete part no longer in production, it is frequently sourced for:

  • Board repair and component replacement on existing installed systems
  • Military and aerospace MRO (Maintenance, Repair, and Overhaul)
  • Industrial equipment upgrades with form-fit-function compatibility requirements

XCV1000E-7FG680C vs. Related Xilinx Virtex-E Variants

Understanding how the XCV1000E-7FG680C compares to closely related variants helps engineers select the correct part or identify suitable substitutes.

Speed Grade Variants (Same Package)

Part Number Speed Grade Max Frequency Package
XCV1000E-6FG680C -6 357 MHz 680 FBGA
XCV1000E-7FG680C -7 400 MHz 680 FBGA
XCV1000E-8FG1156C -8 416 MHz 1156 FBGA

Package Variants (Same Speed Grade)

Part Number Package Pin Count I/O Count
XCV1000E-7BG728C BG728 728 ~516
XCV1000E-7FG680C FG680 680 512
XCV1000E-6BG560I BG560 (Industrial) 560 ~404

Density Comparison Within Virtex-E Family

Part Logic Cells CLBs RAM Bits User I/Os
XCV50E 2,352 588 65,536 176
XCV300E 6,912 1,728 131,072 316
XCV600E 15,552 3,888 262,144 512
XCV1000E 27,648 6,144 393,216 512
XCV2000E 46,080 11,520 655,360 660
XCV3200E 73,728 18,432 786,432 756

The XCV1000E sits in the mid-to-upper tier of the Virtex-E density range, offering a balanced combination of logic and memory for demanding mid-range applications.


Design Tools and Programming for XCV1000E-7FG680C

Supported EDA Design Software

The XCV1000E-7FG680C is supported by legacy Xilinx design tools. Because this is an older generation device, it is best served by:

Tool Version Notes
Xilinx ISE Design Suite 14.7 (final release) Primary recommended toolchain for Virtex-E
Vivado Design Suite Not recommended Vivado does not support legacy Virtex-E devices
ModelSim / Questa Any compatible version For RTL and gate-level simulation
Synplify Pro Legacy versions Third-party synthesis support

Configuration Interfaces

The XCV1000E-7FG680C supports multiple configuration modes for flexible board integration:

Configuration Mode Description
Slave Serial Simple single-bit serial interface
Master Serial Self-timed serial using on-chip oscillator
Slave Parallel (SelectMAP) Fast 8-bit parallel loading
JTAG (IEEE 1149.1) Boundary scan and in-circuit debugging
Master Parallel External memory boot configuration

Recommended Configuration Companion ICs

  • Xilinx Platform Flash (XCF): Dedicated serial configuration ROM for Virtex-E
  • Xilinx XC17 series: Parallel configuration PROM
  • Standard SPI Flash: Usable with appropriate interface logic

Power Supply Requirements for XCV1000E-7FG680C

Proper power supply design is critical for reliable FPGA operation. The XCV1000E-7FG680C requires multiple supply rails:

Power Rail Voltage Range Nominal Purpose
VCCINT 1.71 V – 1.89 V 1.8 V Core internal logic
VCCO 1.5 V – 3.3 V (bank-dependent) Various I/O output drivers
VCCAUX 3.135 V – 3.465 V 3.3 V DLL and auxiliary circuits

Key power design considerations:

  • VCCINT must be stable within ±5% of 1.8 V for reliable operation
  • VCCO must match the target I/O standard for each I/O bank
  • Sufficient decoupling capacitors must be placed close to the BGA package
  • Power sequencing: VCCINT should be applied before or simultaneously with VCCO

PCB Design Guidelines for the 680-FTEBGA Package

The 40 mm × 40 mm, 680-ball BGA package of the XCV1000E-7FG680C presents specific PCB layout challenges that must be addressed carefully.

BGA Escape Routing

Parameter Recommendation
Via type Blind vias or through-hole microvias preferred
Trace width (signal) 4–5 mil minimum
Ball pitch 1.0 mm (standard BGA pitch)
Layer stack Minimum 8-layer PCB recommended
Impedance control 50 Ω for high-speed differential pairs

Thermal Management

  • Junction temperature must remain below +85°C under full load
  • Consider heat spreader or heatsink attachment for high-utilization designs
  • Thermal simulation recommended for dense or fanout-heavy configurations

Ordering Information for XCV1000E-7FG680C

Field Details
Full Part Number XCV1000E-7FG680C
Manufacturer AMD Xilinx
DigiKey Part # 122-1219-ND
Package 680-FTEBGA, Tray
Product Status Obsolete – available through independent distributors
Temperature Range Commercial: 0°C to +85°C
RoHS Verify with distributor at time of purchase

Note: As an obsolete component, the XCV1000E-7FG680C is no longer in production by AMD Xilinx. Availability depends on authorized independent distributors, spot market inventory, and MRO supply channels. Always verify authenticity and provenance when purchasing discontinued ICs.


Frequently Asked Questions About XCV1000E-7FG680C

Is the XCV1000E-7FG680C still in production?

No. The XCV1000E-7FG680C has been classified as obsolete by AMD Xilinx. It is not recommended for new designs. However, the part remains widely available through independent electronics distributors for legacy system maintenance and repair.

What is the difference between XCV1000E-7FG680C and XCV1000E-6FG680C?

The primary difference is the speed grade: the -7 version operates at up to 400 MHz, while the -6 version is rated for up to 357 MHz. All other specifications (logic cells, RAM, I/O count, package) remain identical.

What software do I need to program the XCV1000E-7FG680C?

Xilinx ISE Design Suite 14.7 is the recommended toolchain. Vivado does not support Virtex-E family devices. ISE 14.7 is the final version and includes the iMPACT programmer, XST synthesizer, and PAR (Place and Route) tools.

Can the XCV1000E-7FG680C be used in industrial temperature applications?

The “C” suffix indicates a commercial temperature grade (0°C to +85°C). For industrial temperature range (-40°C to +100°C), you would need the “I” suffix variant if available. Verify specifications before deploying in extended temperature environments.

What are the closest modern replacements for XCV1000E-7FG680C?

While there is no direct pin-compatible modern replacement, the Xilinx Virtex-5, Virtex-6, or Kintex-7 families offer far superior performance and density for new designs. Any migration will require schematic and PCB redesign due to different packages and architectures.


Summary: Why Choose XCV1000E-7FG680C for Your Application

The XCV1000E-7FG680C remains a capable FPGA for legacy system support and specialized applications requiring its specific I/O count, logic density, and package footprint. Its 27,648 logic cells, 512 user I/Os, 393,216-bit block RAM, and 400 MHz operation deliver robust performance for mid-to-high complexity programmable logic designs.

For new projects, AMD Xilinx’s current families are recommended. For maintenance, repair, or existing design continuation, the XCV1000E-7FG680C continues to be sourced successfully through the global independent component distribution network.

Browse the complete catalog of Xilinx FPGA devices to find the right solution for your project — from legacy Virtex-E parts to the latest UltraScale+ platforms.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.