Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS40-3BG256C: Complete Guide to Xilinx Spartan FPGA Specifications and Applications

Product Details

Meta Description: XCS40-3BG256C is a Xilinx Spartan FPGA with 40K gates, 1862 logic cells, 205 I/O pins in 256-BGA package. Ideal for ASIC replacement and industrial applications.


The XCS40-3BG256C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan family, now manufactured by AMD. This versatile programmable logic device delivers exceptional value for designers seeking ASIC replacement solutions with gate counts up to 40,000. Whether you’re working on industrial automation, automotive infotainment, or embedded systems, this Xilinx FPGA provides the flexibility and performance your project demands.

XCS40-3BG256C Key Features and Benefits

The Spartan series represents Xilinx’s commitment to delivering cost-effective programmable logic solutions. The XCS40-3BG256C combines high gate density with on-chip RAM capabilities, making it suitable for complex digital designs that would traditionally require expensive ASIC development.

Why Choose the XCS40-3BG256C FPGA?

This device eliminates the long development cycles and inherent risks associated with conventional ASICs. Engineers benefit from rapid prototyping capabilities while maintaining production-ready performance levels that meet industrial standards.

XCS40-3BG256C Technical Specifications

Parameter Specification
Part Number XCS40-3BG256C
Manufacturer AMD (formerly Xilinx)
Family Spartan
System Gates 40,000
Logic Cells 1,862
CLB Array 28 × 28 (784 CLBs)
Maximum Frequency 125 MHz
Supply Voltage 5V
User I/O Pins 205
Total RAM Bits 25,088
Flip-Flops 2,016
Package Type 256-Pin BGA

XCS40-3BG256C Package Information

Specification Details
Package Style Ball Grid Array (BGA)
Pin Count 256
Package Dimensions 27 mm × 27 mm
Mounting Type Surface Mount (SMD)
RoHS Compliance Yes (Lead-Free)
Operating Temperature Commercial Grade (0°C to +85°C)

XCS40-3BG256C Architecture Overview

Configurable Logic Blocks (CLBs)

The XCS40-3BG256C features 784 Configurable Logic Blocks arranged in a 28×28 array. Each CLB contains three look-up tables (LUTs) for logic function generation, two flip-flops, and signal steering multiplexers. This architecture enables implementation of Boolean functions with up to nine inputs through LUT combination.

On-Chip Memory Resources

With 25,088 bits of distributed RAM, the XCS40-3BG256C supports data storage requirements without external memory components. The RAM bits integrate seamlessly with the CLB structure, allowing designers to allocate memory resources as needed for their specific applications.

Input/Output Block (IOB) Features

The 205 user I/O pins provide flexible interfacing options for connecting to external components and systems. Each IOB supports multiple I/O standards, enabling compatibility with various voltage levels and signaling protocols used in modern electronic designs.

XCS40-3BG256C Speed Grade Information

Speed Grade Description
-3 Standard speed grade
-4 Enhanced performance grade
-5 High-speed grade

The “-3” designation in XCS40-3BG256C indicates the standard speed grade, providing optimal balance between performance and power consumption for typical applications.

XCS40-3BG256C Application Areas

Industrial Automation

The XCS40-3BG256C excels in motor drive controllers, PLC modules, and sensor interface applications where real-time processing and reliable operation are essential requirements.

Automotive Infotainment Systems

Dashboard displays, navigation systems, and audio processing units benefit from the FPGA’s parallel processing capabilities and flexible I/O configuration options.

Consumer Electronics

Gaming devices, set-top boxes, and personal electronics leverage the XCS40-3BG256C for video processing, user interface management, and peripheral control functions.

Telecommunications Equipment

Protocol conversion, signal processing, and network interface applications utilize the device’s high-speed logic and memory resources.

XCS40-3BG256C Configuration Options

Configuration Mode Description
Master Serial FPGA generates configuration clock
Slave Serial External controller provides clock
Master Parallel 8-bit parallel configuration
Boundary Scan (JTAG) IEEE 1149.1 compliant programming

JTAG Boundary Scan Support

The XCS40-3BG256C includes full JTAG boundary scan capability with IDCODE register support. This feature enables in-circuit testing and device identification during board-level debugging and production testing.

XCS40-3BG256C Design Considerations

Power Supply Requirements

Proper power sequencing and decoupling capacitor placement ensure stable FPGA operation. The 5V supply voltage requires adequate filtering to minimize noise-related configuration errors.

PCB Layout Guidelines

The 256-pin BGA package requires controlled impedance routing for high-speed signals. Maintain proper ground plane integrity beneath the device footprint for optimal signal integrity.

Thermal Management

While the XCS40-3BG256C operates within commercial temperature ranges, adequate airflow or heat spreading may be necessary in thermally constrained enclosures.

XCS40-3BG256C Ordering Information

Order Code Package Temperature
XCS40-3BG256C 256-BGA Commercial (0°C to +85°C)
XCS40-3BG256I 256-BGA Industrial (-40°C to +100°C)

XCS40-3BG256C vs Alternative FPGA Options

Feature XCS40-3BG256C XCS30-3BG256C XCS40-4PQ208C
System Gates 40,000 30,000 40,000
Logic Cells 1,862 1,368 1,862
User I/O 205 205 169
Package 256-BGA 256-BGA 208-PQFP
Speed Grade -3 -3 -4

XCS40-3BG256C Development Tools

Xilinx ISE Design Suite provides comprehensive support for XCS40-3BG256C development. The toolchain includes schematic capture, HDL synthesis, simulation, and device programming capabilities essential for successful FPGA implementation.

Conclusion

The XCS40-3BG256C delivers proven Spartan FPGA technology in a compact 256-BGA package. With 40,000 system gates, 1,862 logic cells, and 205 user I/O pins, this device serves diverse applications from industrial control to consumer electronics. The combination of on-chip RAM, flexible configuration options, and comprehensive development tool support makes the XCS40-3BG256C an excellent choice for cost-sensitive programmable logic designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.