Overview of XCS30XL-5BG256C Field Programmable Gate Array
The XCS30XL-5BG256C is a 30,000 gate Field Programmable Gate Array (FPGA) from AMD’s Spartan-XL family, offering 192 user I/O pins for versatile digital logic implementations. This high-performance FPGA delivers exceptional flexibility for industrial automation, communications systems, and embedded control applications requiring custom programmable logic.
Key Features and Specifications
The device features 576 Logic Array Blocks (LABs) with 1368 logic elements and 18432 total RAM bits for on-chip memory, making it ideal for complex digital designs. As part of the Xilinx FPGA product line, this component offers reliable performance for mission-critical applications.
Technical Specifications Table
| Specification |
Details |
| Part Number |
XCS30XL-5BG256C |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Spartan-XL |
| System Gates |
30,000 |
| Logic Elements/Cells |
1,368 |
| Configurable Logic Blocks (CLBs) |
576 |
| User I/O Pins |
192 |
| Total RAM Bits |
18,432 |
| Package Type |
256-PBGA (27×27 mm) |
| Supply Voltage |
3.0V – 3.6V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Mounting Type |
Surface Mount |
| Speed Grade |
-5 (High Performance) |
Electrical Characteristics
| Parameter |
Specification |
| Supply Voltage (Vcc) |
3.0V to 3.6V |
| I/O Voltage Standards |
3.3V LVTTL/LVCMOS |
| Maximum Operating Frequency |
Up to 217 MHz |
| Power Consumption |
Low power optimized |
| Logic Technology |
CMOS |
Pin Configuration and Package Information
| Package Details |
Specification |
| Package Style |
Ball Grid Array (BGA) |
| Total Pins |
256 |
| Package Dimensions |
27mm x 27mm |
| Pin Pitch |
Standard BGA spacing |
| Moisture Sensitivity Level |
MSL 3 |
| Mounting |
Surface Mount Technology (SMT) |
XCS30XL-5BG256C Architecture and Design Features
Configurable Logic Block Architecture
The XCS30XL features a robust architecture with 576 CLBs operating at frequencies up to 217MHz, providing substantial logic resources for complex digital implementations. Each CLB contains multiple lookup tables (LUTs), flip-flops, and multiplexers enabling sophisticated combinatorial and sequential logic designs.
On-Chip Memory Resources
The integrated 18,432 bits of distributed RAM allows designers to implement small memory buffers, FIFOs, and lookup tables without requiring external memory components. This on-chip storage significantly reduces board complexity and improves system performance.
I/O Capabilities
With 192 user-programmable I/O pins, the XCS30XL-5BG256C provides extensive interfacing options for:
- Parallel bus interfaces
- Serial communication protocols
- Custom peripheral connections
- Multi-voltage I/O support
- Programmable pull-up/pull-down resistors
Applications and Use Cases
Industrial Automation Applications
The XCS30XL-5BG256C excels in industrial control systems where reliable, custom logic processing is essential:
- Motor control systems
- PLC replacement solutions
- Process automation controllers
- Industrial communication protocol bridges
- Safety interlock systems
Communications and Networking
FPGA implementations for data communications benefit from the device’s high I/O count and performance:
- Protocol converters
- Network switching logic
- Data encryption/decryption engines
- Signal processing applications
- Custom interface adapters
Embedded Systems Development
Engineers designing embedded systems leverage the XCS30XL for:
- Custom co-processor implementations
- Hardware acceleration modules
- Real-time control systems
- Sensor interface controllers
- Digital signal conditioning
Performance Comparison Table
| Feature |
XCS30XL-5BG256C |
Typical ASIC |
Standard Microcontroller |
| Reconfigurability |
Full in-system |
None |
Limited peripherals |
| Development Time |
Days to weeks |
Months to years |
Weeks |
| Logic Flexibility |
Complete custom |
Fixed design |
Firmware limited |
| I/O Customization |
Fully programmable |
Fixed at design |
Fixed pins |
| Performance |
High (217 MHz) |
Very High |
Moderate |
| Unit Cost |
Moderate |
Low (high volume) |
Low |
Design and Development Resources
Programming and Configuration
The XCS30XL-5BG256C supports multiple configuration modes:
- Master Serial configuration
- Slave Serial configuration
- Master Parallel configuration
- Boundary-scan (JTAG) programming
Compatible Design Tools
Designers can utilize industry-standard FPGA development tools:
- Xilinx ISE Design Suite
- Third-party synthesis tools
- Hardware description languages (VHDL, Verilog)
- Schematic capture tools
- Simulation and verification software
Ordering and Availability Information
| Ordering Information |
Details |
| Standard Part Number |
XCS30XL-5BG256C |
| Package Marking |
XCS30XL-5BG256C |
| Packaging Options |
Trays |
| Minimum Order Quantity |
Check with distributor |
| Lead Time |
Varies by availability |
| RoHS Compliance |
RoHS Compliant |
Quality and Reliability Standards
Environmental Compliance
- RoHS compliant manufacturing
- Lead-free package options
- Halogen-free available upon request
- REACH regulation compliant
Reliability Testing
AMD (Xilinx) FPGAs undergo rigorous quality testing:
- Temperature cycling
- High-temperature operating life (HTOL)
- Early life failure rate (ELFR) testing
- Moisture sensitivity testing
- Electrostatic discharge (ESD) protection
Installation and Handling Guidelines
Storage Requirements
- Store in anti-static packaging
- Maintain dry conditions (≤10% RH recommended)
- Avoid exposure to direct sunlight
- Store at room temperature (15-30°C)
PCB Layout Recommendations
For optimal XCS30XL-5BG256C performance:
- Implement proper power plane distribution
- Use adequate decoupling capacitors (0.1µF, 0.01µF)
- Follow BGA routing best practices
- Maintain controlled impedance for high-speed signals
- Provide adequate thermal management
Thermal Management Considerations
| Thermal Parameter |
Specification |
| Junction Temperature (Tj) |
0°C to +85°C |
| Storage Temperature |
-65°C to +150°C |
| Thermal Resistance (θJA) |
Package dependent |
| Recommended Cooling |
Natural convection adequate for most applications |
Support and Documentation
Available Resources
AMD provides comprehensive documentation including:
- Complete datasheet with electrical specifications
- User guide and architecture overview
- Application notes and design guidelines
- Reference designs and example projects
- Technical support through distributor network
Design Support Services
Engineers can access:
- Online technical forums
- Design consultation services
- Training webinars and tutorials
- Third-party IP cores
- Development board recommendations
Frequently Asked Questions
What is the difference between speed grades?
The “-5” speed grade indicates high-performance operation with maximum clock frequencies up to 217 MHz. Lower speed grades (-3, -4) offer reduced performance at potentially lower cost.
Can this FPGA be reprogrammed?
Yes, the XCS30XL-5BG256C is fully reprogrammable, allowing design iterations without hardware changes. Configuration can be updated in-system through supported programming interfaces.
What power supply voltages are required?
The device operates from a supply voltage range of 3V to 3.6V, typically using a standard 3.3V supply. Ensure proper voltage regulation and filtering for reliable operation.
Is this device suitable for new designs?
While the Spartan-XL family represents mature technology, it remains suitable for cost-sensitive applications and legacy design support. For new high-performance projects, consider newer FPGA families with advanced features.
Conclusion: Why Choose XCS30XL-5BG256C
The XCS30XL-5BG256C delivers proven FPGA performance for applications requiring:
- Moderate gate count (30,000 gates)
- Substantial I/O resources (192 pins)
- Reliable 3.3V operation
- Cost-effective programmable logic
- Established design tool support
This Spartan-XL FPGA bridges the gap between simple programmable logic devices and high-end FPGAs, offering an optimal balance of performance, cost, and ease of use for industrial and embedded applications.
