Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30XL-5VQ100I: High-Performance Industrial FPGA for Demanding Applications

Product Details

Overview of XCS30XL-5VQ100I Field Programmable Gate Array

The XCS30XL-5VQ100I is a robust industrial-grade Field Programmable Gate Array (FPGA) from AMD/Xilinx’s Spartan-XL family, designed to deliver exceptional performance in harsh operating environments. This programmable logic device features 30,000 system gates and operates across an extended industrial temperature range, making it an ideal solution for mission-critical applications in telecommunications, industrial automation, and embedded systems.

Key Technical Specifications

Core Performance Parameters

Specification Value
Part Number XCS30XL-5VQ100I
Manufacturer AMD (formerly Xilinx)
Product Family Spartan-XL
System Gates 30,000
Logic Cells 1,368
Configurable Logic Blocks (CLBs) 576
Maximum User I/O 77
Total Flip-Flops 1,536
Package Type 100-pin VQFP (Very Quad Flat Pack)
Operating Voltage 3.3V
Speed Grade -5

Temperature and Environmental Specifications

Parameter Value
Temperature Grade Industrial (-40°C to +100°C)
Junction Temperature Range -40°C to +100°C
Package Designation VQ100 (100-pin VQFP)
Mounting Type Surface Mount Technology (SMT)
Lead-Free Status RoHS Compliant

XCS30XL-5VQ100I Architecture and Features

Programmable Logic Resources

The XCS30XL-5VQ100I incorporates a sophisticated architecture optimized for high-density logic implementation. With 576 Configurable Logic Blocks arranged in a 24 x 24 array, this Xilinx FPGA delivers flexible design capabilities for complex digital circuits.

Logic Block Distribution

Resource Type Quantity Description
CLB Array 24 x 24 Configurable Logic Block matrix
Total CLBs 576 Each CLB contains two logic cells
Logic Cells 1,368 Basic programmable logic units
Flip-Flops 1,536 Sequential logic elements
Maximum RAM Bits 18,432 Distributed memory capability

On-Chip Memory Architecture

The XCS30XL-5VQ100I features distributed RAM capabilities within its CLB structure, allowing designers to implement small memory blocks directly within the logic fabric. This architecture enables efficient data buffering and storage without requiring external memory components for many applications.

Performance Characteristics

Timing and Speed Specifications

Performance Metric Specification
Speed Grade -5 (5ns)
Maximum Operating Frequency Up to 166 MHz (design-dependent)
Propagation Delay 5ns typical
Clock Distribution Global and secondary clock networks

Power Consumption Profile

The industrial-grade XCS30XL-5VQ100I operates at 3.3V core voltage, providing a balance between performance and power efficiency. The device features multiple power-saving modes including a power-down state that retains configuration while minimizing current consumption.

Industrial Applications and Use Cases

Primary Application Domains

The XCS30XL-5VQ100I excels in environments requiring reliable operation across extended temperature ranges and harsh conditions:

Industrial Control Systems

  • Process automation controllers
  • Factory automation equipment
  • Programmable logic controllers (PLCs)
  • Motor control applications
  • Real-time monitoring systems

Communications Infrastructure

  • Telecommunications switching equipment
  • Protocol conversion interfaces
  • High-speed data acquisition systems
  • Network interface controllers
  • Digital signal processing applications

Embedded Systems

  • Industrial embedded computing platforms
  • Custom processing engines
  • Sensor interface systems
  • Data logging equipment
  • Test and measurement instruments

Automotive and Transportation

  • Vehicle control units
  • Advanced driver assistance systems (ADAS) interfaces
  • Infotainment system controllers
  • Diagnostic equipment
  • Industrial vehicle systems

Package and Pin Configuration

VQ100 Package Details

Package Attribute Specification
Package Type VQFP (Very Quad Flat Pack)
Total Pins 100
Pin Pitch 0.5mm
Body Size 14mm x 14mm (nominal)
Height Low-profile surface mount
Thermal Performance Enhanced heat dissipation

I/O Configuration Options

The 100-pin package provides up to 77 user-configurable I/O pins, with each I/O supporting multiple voltage standards and offering programmable drive strength, slew rate control, and pull-up/pull-down resistors.

Configuration and Programming

Supported Configuration Modes

Configuration Mode Description
Master Serial FPGA controls external serial PROM
Slave Serial External controller provides bitstream
Master Parallel FPGA controls parallel PROM
Slave Parallel Fast configuration via 8-bit bus
JTAG Boundary Scan IEEE 1149.1 compliant testing and programming

Development Tools Compatibility

The XCS30XL-5VQ100I is supported by Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Engineers can leverage VHDL or Verilog HDL for design implementation.

Quality and Reliability Standards

Industrial Grade Certification

The “I” designation in XCS30XL-5VQ100I indicates industrial temperature grade qualification, ensuring reliable operation from -40°C to +100°C junction temperature. This makes the device suitable for deployment in:

  • Outdoor equipment installations
  • High-temperature industrial environments
  • Automotive under-hood applications
  • Military and aerospace systems (commercial grade)
  • Extended-temperature embedded systems

Manufacturing Quality

Each XCS30XL-5VQ100I undergoes rigorous testing to meet stringent quality standards, including:

  • 100% electrical testing
  • Temperature cycling qualification
  • Moisture sensitivity level (MSL) rating
  • ESD protection verification
  • Long-term reliability testing

Comparison with Related Spartan-XL Devices

XCS30XL Family Variants

Part Number Speed Grade Package Temperature Range Key Difference
XCS30XL-4VQ100I -4 (faster) VQ100 Industrial Higher speed grade
XCS30XL-5VQ100I -5 (standard) VQ100 Industrial Balanced performance
XCS30XL-5VQ100C -5 VQ100 Commercial (0°C to 85°C) Commercial temp range
XCS30XL-5TQ144I -5 TQ144 Industrial More I/O pins available

Design Considerations and Best Practices

Thermal Management

For industrial applications operating at elevated temperatures, proper thermal design is critical. Consider:

  • Adequate PCB copper plane area for heat dissipation
  • Thermal vias connecting to ground planes
  • Airflow considerations in enclosure design
  • Junction-to-ambient thermal resistance calculations

Power Supply Design

Ensure stable 3.3V power delivery with:

  • Low-ESR decoupling capacitors near power pins
  • Separate analog and digital power planes where applicable
  • Current capacity matching expected dynamic power consumption
  • Proper sequencing for multi-voltage systems

Availability and Procurement

The XCS30XL-5VQ100I is available through authorized electronic component distributors worldwide. While the Spartan-XL family is considered a mature product line, it remains in production for legacy system support and cost-sensitive applications where proven reliability is essential.

Storage and Handling Requirements

Requirement Specification
Moisture Sensitivity Level MSL 3
ESD Sensitivity Class 1 (protected)
Storage Temperature -55°C to +150°C
Reflow Temperature 260°C peak for lead-free

Conclusion

The XCS30XL-5VQ100I represents a reliable, cost-effective FPGA solution for industrial applications requiring proven technology and extended temperature operation. With 30,000 system gates, comprehensive I/O capabilities, and industrial-grade reliability, this device continues to serve critical roles in telecommunications, industrial control, automotive, and embedded system applications.

Its combination of adequate logic resources, industrial temperature rating, and mature development tool support makes the XCS30XL-5VQ100I an excellent choice for new designs requiring long-term availability and established design practices, as well as for maintaining existing production systems.

Whether you’re developing industrial control equipment, communications infrastructure, or embedded computing platforms, the XCS30XL-5VQ100I delivers the programmable logic performance and environmental ruggedness needed for demanding real-world applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.