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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCS30XL-4TQG144I: Industrial-Grade FPGA for High-Volume Production Applications

Product Details

The XCS30XL-4TQG144I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Spartan-XL family, engineered for cost-effective ASIC replacement in industrial and commercial applications. This robust programmable logic device delivers exceptional performance with 30,000 system gates and operates reliably in industrial temperature ranges.

Overview of XCS30XL-4TQG144I FPGA

The XCS30XL-4TQG144I features 576 configurable logic blocks, 1,368 logic cells, and operates at frequencies up to 217MHz with a 3.3V supply voltage in a compact 144-pin TQFP package. This industrial-grade variant is specifically designed for applications requiring extended temperature operation from -40°C to +100°C, making it ideal for harsh environmental conditions.

As part of the proven Xilinx FPGA portfolio, the XCS30XL-4TQG144I represents a mature, cost-optimized solution for embedded systems, industrial automation, and legacy system maintenance.

Key Technical Specifications

Electrical and Performance Characteristics

Specification Value
Logic Gates 30,000 system gates
Configurable Logic Blocks (CLBs) 576 CLBs
Logic Cells 1,368 cells
Maximum Frequency 217 MHz
Supply Voltage 3.3V ±5%
Operating Temperature -40°C to +100°C (Industrial)
Speed Grade -4 (standard performance)

Package and I/O Configuration

Feature Specification
Package Type 144-Pin TQFP (Thin Quad Flat Pack)
Package Dimensions 20mm x 20mm
User I/O Pins 113 I/O
Total Pins 144 pins
Mounting Type Surface Mount Technology (SMT)
Terminal Form Gull Wing leads

Memory and Logic Resources

Resource Capacity
Total RAM Bits 18,432 bits on-chip
Distributed RAM Available in CLBs
Configuration Memory SRAM-based
Logic Elements 1,368 programmable cells

Product Features and Benefits

Industrial-Grade Reliability

The XCS30XL-4TQG144I stands out for its extended temperature rating, designed to function reliably in challenging industrial environments where standard commercial-grade components may fail. The industrial temperature range ensures consistent performance across automotive, military, and industrial control applications.

High-Performance Architecture

Built on the established XC4000 architecture, the Spartan-XL family provides streamlined features optimized for high-volume production with on-chip RAM capabilities. The device achieves system performance beyond 80 MHz in typical applications, with internal logic operating at 217 MHz maximum frequency.

Cost-Effective ASIC Alternative

The Spartan-XL family delivers a cost-effective FPGA solution as an ASIC replacement for designs up to 40,000 gates, offering high performance and competitive pricing in volume production. Organizations can avoid the substantial initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC development.

Flexible I/O Configuration

With 113 user-configurable I/O pins, the XCS30XL-4TQG144I provides substantial connectivity options for interfacing with external devices, sensors, and peripherals. The TQFP-144 package offers an optimal balance between I/O count and PCB footprint.

Technical Architecture

Configurable Logic Block (CLB) Structure

Each CLB in the XCS30XL-4TQG144I contains function generators, flip-flops, and routing resources. The symmetrical architecture enables efficient placement and routing algorithms, maximizing design performance and minimizing routing congestion.

On-Chip Memory Resources

The 18,432 bits of distributed RAM can be configured as single-port or dual-port memory, providing flexible storage solutions for buffering, look-up tables, and small data structures without consuming external memory resources.

Clock Distribution Network

The device features dedicated global clock routing networks that ensure low-skew distribution of clock signals throughout the FPGA fabric, critical for high-performance synchronous designs.

Applications and Use Cases

Industrial Automation and Control

The XCS30XL-4TQG144I excels in programmable logic controllers (PLCs), motion control systems, and industrial process monitoring where reliable operation in extreme temperatures is mandatory.

Legacy System Maintenance

For organizations maintaining mature product lines, this FPGA serves as a direct replacement component, ensuring continuity of supply and supporting long product lifecycles in aerospace, defense, and industrial markets.

Embedded Communication Interfaces

The device is well-suited for implementing custom communication protocols, including:

  • Serial interfaces (UART, SPI, I²C)
  • Parallel data acquisition systems
  • Custom industrial fieldbus protocols
  • Real-time data processing

Automotive Electronics

The industrial temperature rating makes the XCS30XL-4TQG144I appropriate for automotive applications such as engine control units (ECU), dashboard electronics, and sensor interface modules.

Medical Instrumentation

In medical devices requiring programmable logic with proven reliability, this FPGA provides the necessary performance and temperature tolerance for diagnostic equipment and patient monitoring systems.

Design Considerations

Power Management

Operating at 3.3V, the XCS30XL-4TQG144I offers reasonable power consumption for battery-powered and embedded applications. Designers should implement proper decoupling capacitors near VCC pins and consider power sequencing requirements.

Thermal Management

While the industrial temperature rating extends operational range, proper thermal design remains essential. The TQFP-144 package facilitates heat dissipation through both the leads and optional thermal vias in the PCB.

Configuration and Programming

The SRAM-based configuration requires external non-volatile memory (typically serial PROM) to store the bitstream. The device supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • Boundary Scan (JTAG) mode

Product Status and Availability

Important Note: While the XCS30XL-4TQG144I remains available through distribution channels, potential users should verify current product status with AMD/Xilinx, as the Spartan-XL family represents a mature product line. Organizations designing new products should evaluate whether this legacy FPGA meets long-term availability requirements.

Package and Ordering Information

Part Number Breakdown

XCS30XL-4TQG144I

  • XCS30XL: Device family and gate count (Spartan-XL, 30K gates)
  • -4: Speed grade (standard performance)
  • TQ: Package type (Thin Quad Flat Pack)
  • G: Package variation indicator
  • 144: Pin count
  • I: Industrial temperature range (-40°C to +100°C)

Package Specifications

Parameter Value
Package Type TQFP (Thin Quad Flat Pack)
Body Size 20mm x 20mm nominal
Pitch 0.5mm between leads
Lead Count 144
Seated Height 1.4mm maximum
Package Material Plastic encapsulation

Development Tools and Resources

Design Software

The XCS30XL-4TQG144I is supported by Xilinx ISE Design Suite (legacy toolchain), which provides:

  • HDL synthesis (VHDL and Verilog)
  • Implementation and place-and-route
  • Timing analysis
  • Bitstream generation
  • In-system debugging capabilities

Programming Tools

Compatible programming hardware includes:

  • Xilinx Platform Cable USB
  • JTAG-compatible programmers
  • In-circuit serial programming solutions

Comparison with Related Devices

Speed Grade Variants

Part Number Speed Grade Max Frequency Temperature Range
XCS30XL-4TQG144I -4 217 MHz Industrial (-40°C to +100°C)
XCS30XL-5TQG144I -5 Higher performance Industrial
XCS30XL-4TQG144C -4 217 MHz Commercial (0°C to +85°C)

Alternative Package Options

For the XCS30XL family with 30K gates, several package alternatives exist:

  • VQ100: 100-pin VQFP (77 I/O) – smaller footprint
  • PQG208: 208-pin PQFP (169 I/O) – maximum I/O count
  • TQG144: 144-pin TQFP (113 I/O) – balanced solution

Quality and Reliability

Manufacturing Standards

AMD (Xilinx) manufactures the XCS30XL-4TQG144I following strict quality control procedures and industry standards, ensuring consistent performance and reliability across production lots.

Environmental Compliance

Designers should verify the specific environmental compliance status (RoHS, REACH) for their regional requirements, as specifications may vary by production date and market.

Technical Support and Documentation

Essential Documentation

Users should reference the following technical documentation:

  • Spartan-XL FPGA Family Data Sheet (DS060)
  • XCS30XL Device Pinout Specifications
  • TQFP-144 Package Mechanical Drawings
  • Spartan-XL Configuration Guide
  • PCB Design Guidelines for TQFP Packages

Design Resources

Access to IP cores, reference designs, and application notes can accelerate development and reduce time-to-market for projects utilizing the XCS30XL-4TQG144I.

Conclusion

The XCS30XL-4TQG144I represents a proven, industrial-grade FPGA solution for applications requiring moderate logic density with extended temperature operation. Its 30,000 gates, 113 I/O pins, and robust TQFP-144 package make it suitable for industrial automation, legacy system support, and embedded control applications where reliability and cost-effectiveness are paramount.

While representing mature technology, the XCS30XL-4TQG144I continues serving critical roles in existing designs and applications where its specific combination of features, performance, and industrial temperature rating provides optimal value. Organizations should conduct thorough long-term availability assessments when incorporating this device into new designs, while existing users benefit from established supply chains and comprehensive design resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.