Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30-4TQ144C: High-Performance Xilinx Spartan FPGA for Embedded Applications

Product Details

Overview of XCS30-4TQ144C Field Programmable Gate Array

The XCS30-4TQ144C is a versatile Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan series, designed to deliver exceptional performance for embedded system designs and digital logic applications. This FPGA component combines flexibility, reliability, and cost-effectiveness, making it an ideal choice for engineers and designers seeking programmable logic solutions.

As part of the Spartan FPGA family, the XCS30-4TQ144C offers a compelling alternative to traditional ASIC designs, providing the programmability needed for rapid prototyping and product development cycles while maintaining competitive pricing for high-volume production runs.

Key Features and Technical Specifications

Core Performance Characteristics

The XCS30-4TQ144C stands out with its robust technical capabilities that address modern embedded design requirements:

Specification Value Benefits
Logic Gates 30,000 gates Sufficient logic capacity for complex digital designs
Logic Elements 1,368 cells Flexible configurable logic blocks for custom implementations
Maximum Frequency 166 MHz High-speed operation for demanding applications
On-Chip RAM 18,432 bits Integrated memory for data buffering and storage
I/O Pins 113 user I/Os Extensive connectivity options for peripheral interfaces
Operating Voltage 2.5V Low-power consumption design
Package Type 144-pin TQFP Surface-mount package for automated assembly

Package and Physical Specifications

Parameter Details
Package Style TQFP (Thin Quad Flat Pack)
Pin Count 144 pins
Mounting Type Surface Mount Technology (SMT)
Temperature Grade Commercial (-4 speed grade)
Lead-Free Status RoHS Compliant

Technical Architecture and Design Capabilities

FPGA Configuration and Logic Resources

The <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> XCS30-4TQ144C incorporates advanced configurable logic blocks (CLBs) that provide designers with exceptional flexibility. Each logic element can be configured to implement various combinational and sequential logic functions, enabling the creation of custom digital circuits tailored to specific application requirements.

The device supports multiple configuration modes, allowing system designers to choose the most appropriate method for their application environment, whether through JTAG boundary-scan, serial PROM, or parallel configuration interfaces.

Memory and Storage Architecture

With 18,432 bits of distributed RAM integrated directly into the FPGA fabric, the XCS30-4TQ144C eliminates the need for external memory components in many applications. This on-chip memory can be utilized for:

  • Data buffering and FIFO implementations
  • Look-up table storage
  • Small embedded memory requirements
  • State machine data storage

Speed Grade and Performance

The “-4” speed grade designation indicates this device is optimized for standard performance applications, offering a maximum system frequency of 166 MHz. This speed grade strikes an excellent balance between performance and power consumption, making it suitable for a wide range of commercial applications.

Application Areas and Use Cases

Digital Signal Processing Applications

The XCS30-4TQ144C excels in digital signal processing (DSP) implementations, including:

  • Digital filtering and signal conditioning
  • Audio processing and codec implementations
  • Communication protocol handlers
  • Data acquisition systems

Industrial Control Systems

For industrial automation and control applications, this FPGA provides:

  • Motor control algorithms
  • PLC (Programmable Logic Controller) functionality
  • Sensor interface implementations
  • Real-time control systems

Communication and Interface Applications

The abundant I/O resources make the XCS30-4TQ144C ideal for:

  • Serial communication protocols (UART, SPI, I2C)
  • Parallel bus interfaces
  • Custom protocol implementations
  • Bridge and gateway applications

Embedded System Integration

As an embedded component, the XCS30-4TQ144C serves effectively in:

  • System-on-Chip (SoC) designs
  • Co-processor implementations
  • Hardware acceleration modules
  • Custom peripheral controllers

Design Tools and Development Support

Xilinx ISE Design Suite

The XCS30-4TQ144C is fully supported by Xilinx’s ISE (Integrated Software Environment) Design Suite, which provides:

  • HDL synthesis and implementation
  • Timing analysis and optimization
  • Place and route tools
  • Configuration bitstream generation

Programming Languages Support

Designers can implement their designs using industry-standard HDL languages:

  • VHDL: IEEE standard hardware description language
  • Verilog: Popular HDL for digital design
  • Schematic Entry: Graphical design capture tools

Comparison with Related Spartan Devices

Spartan Family Positioning

Model Gates I/O Pins RAM (bits) Typical Applications
XCS10 10,000 77 6,144 Simple glue logic, basic interfaces
XCS20 20,000 97 12,288 Medium complexity designs
XCS30-4TQ144C 30,000 113 18,432 Complex digital systems
XCS40 40,000 142 24,576 High-density applications

Quality and Reliability Standards

Manufacturing Excellence

The XCS30-4TQ144C is manufactured using advanced semiconductor processes, ensuring:

  • Consistent electrical performance
  • High reliability and longevity
  • Low defect rates
  • RoHS compliance for environmental standards

Testing and Qualification

Each device undergoes rigorous testing procedures:

  • Functionality verification
  • Speed grade testing
  • Temperature cycling
  • Electrical parameter validation

Design Considerations and Best Practices

Power Supply Requirements

When implementing the XCS30-4TQ144C in your design, consider:

  • 2.5V core voltage with ±5% tolerance
  • Adequate decoupling capacitors (typically 0.1µF ceramic)
  • Power plane design for noise reduction
  • Current capacity planning (varies by design utilization)

Thermal Management

While the TQFP package provides adequate thermal performance for most applications:

  • Monitor junction temperature in high-utilization designs
  • Consider airflow in enclosed systems
  • Use thermal simulation tools for complex implementations
  • Add heat sinks if operating near maximum specifications

PCB Layout Guidelines

For optimal performance and reliability:

  • Maintain controlled impedance on high-speed signals
  • Use ground and power planes
  • Keep configuration signals short and direct
  • Follow Xilinx PCB design guidelines
  • Provide adequate clearance around the TQFP package

Ordering Information and Package Options

Part Number Breakdown

Understanding the XCS30-4TQ144C part number:

  • XCS30: Spartan family, 30,000 gate device
  • -4: Speed grade (standard performance)
  • TQ144: Package type (144-pin TQFP)
  • C: Commercial temperature range

Availability and Lifecycle Status

The XCS30-4TQ144C is classified as a mature product in Xilinx’s portfolio. While it has been superseded by newer Spartan generations (Spartan-3, Spartan-6, Spartan-7), it remains available for:

  • Legacy design support
  • Cost-optimized applications
  • Proven design migrations
  • Long-term availability programs

Migration Path and Future-Proofing

Upgrade Options

For designs requiring additional resources or newer features:

  • Spartan-3 Series: Enhanced performance and density
  • Spartan-6 Series: Advanced I/O standards and DSP blocks
  • Spartan-7 Series: Latest generation with improved power efficiency

Design Portability

When planning for future migrations:

  • Use industry-standard HDL coding practices
  • Modularize design architecture
  • Document design constraints thoroughly
  • Consider pin compatibility when selecting packages

Technical Support and Documentation

Available Resources

Comprehensive technical documentation includes:

  • Product datasheet with electrical specifications
  • User guide for architecture and features
  • Application notes for specific implementations
  • Reference designs and example projects

Community and Support

Access to technical support through:

  • Xilinx/AMD technical support channels
  • Online forums and user communities
  • Third-party FPGA design resources
  • Training materials and tutorials

Competitive Advantages of the XCS30-4TQ144C

Cost-Effectiveness

The XCS30-4TQ144C offers exceptional value through:

  • Competitive pricing in the 30K gate category
  • Reduced time-to-market compared to ASIC development
  • No NRE (Non-Recurring Engineering) costs
  • Field-upgradeable functionality

Proven Technology

Benefits of the mature Spartan architecture:

  • Extensive design ecosystem
  • Well-characterized performance
  • Proven reliability in production
  • Abundant design resources and examples

Flexibility and Scalability

The programmable nature provides:

  • Rapid prototype development
  • Easy design modifications
  • In-field updates capability
  • Risk mitigation through iterative development

Conclusion: Why Choose the XCS30-4TQ144C

The XCS30-4TQ144C represents an excellent choice for embedded system designers seeking a reliable, cost-effective FPGA solution. With 30,000 gates of logic capacity, 113 I/O pins, and integrated memory resources, this device provides the perfect balance of functionality and affordability for a wide range of digital design applications.

Whether you’re developing industrial control systems, communication interfaces, or custom digital logic implementations, the XCS30-4TQ144C delivers the performance and flexibility needed for successful product development. Its mature architecture, extensive tool support, and proven reliability make it a trusted component for both new designs and legacy system maintenance.

For engineers and designers looking to leverage programmable logic technology without the complexity and cost of larger FPGAs, the XCS30-4TQ144C from <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> family stands as a compelling solution that continues to serve the embedded systems community effectively.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.