Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30-3TQ144I: Xilinx Spartan FPGA IC – Complete Technical Guide & Specifications

Product Details

The XCS30-3TQ144I is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan series. This industrial-grade FPGA delivers exceptional reliability for embedded system design, ASIC replacement applications, and high-volume production environments. Whether you’re developing telecommunications equipment, industrial automation systems, or consumer electronics, the XCS30-3TQ144I offers the flexibility and performance your project demands.


XCS30-3TQ144I Overview and Key Features

The XCS30-3TQ144I belongs to the renowned Xilinx FPGA Spartan family, designed specifically for cost-sensitive applications requiring programmable logic solutions. This FPGA chip provides an ideal balance between performance, power consumption, and cost-effectiveness.

Why Choose the XCS30-3TQ144I FPGA?

This Spartan series FPGA was developed as the first ASIC replacement solution for high-volume production with on-chip RAM. Key advantages include:

  • Streamlined architecture based on proven XC4000 technology
  • High system performance exceeding 80 MHz operation
  • On-chip RAM for flexible memory configurations
  • Industrial temperature range for demanding environments
  • JTAG support for easy programming and testing

XCS30-3TQ144I Technical Specifications

General Product Information

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCS30-3TQ144I
Series Spartan
Category Embedded – FPGAs (Field Programmable Gate Array)
Package Type 144-TQFP / 144-LQFP
Mounting Type Surface Mount (SMD/SMT)
RoHS Status Compliant

XCS30-3TQ144I Logic Resources

Resource Value
Number of CLBs 576
Logic Elements/Cells 1,368
System Gates Up to 40,000
User I/O Pins 113
Total RAM Bits 18,432

Electrical Characteristics

Parameter Specification
Supply Voltage (Vcc) 5V
I/O Voltage 5V Tolerant
Speed Grade -3
Maximum Frequency 80+ MHz System Performance

Operating Conditions

Parameter Specification
Operating Temperature -40°C to +85°C (Industrial)
Temperature Grade I (Industrial)
Package Dimensions 20mm x 20mm (Typical TQFP-144)
Pin Count 144 Pins
Lead Pitch 0.5mm

XCS30-3TQ144I Pin Configuration and Package Details

The XCS30-3TQ144I utilizes a 144-pin Thin Quad Flat Package (TQFP) with gull-wing leads. This surface-mount package offers excellent thermal performance and is compatible with standard SMT assembly processes.

Package Features

Feature Description
Package Code TQ144 (TQFP-144)
Terminal Type Gull Wing
Package Shape Square
Body Material Plastic

XCS30-3TQ144I Architecture and Design Features

FPGA Core Architecture

The XCS30-3TQ144I is built on the Xilinx XC4000-based architecture, providing a proven and reliable foundation for programmable logic designs. The architecture includes:

  • Configurable Logic Blocks (CLBs): 576 CLBs provide the core logic resources
  • Input/Output Blocks (IOBs): 113 user-programmable I/O pins
  • Distributed RAM: 18,432 bits of on-chip RAM
  • Programmable Interconnect: Flexible routing resources

Configuration and Programming Options

Feature Support
JTAG Boundary Scan IEEE 1149.1/1532 Compliant
In-System Programming Supported via Serial PROM
Configuration Memory External PROM Required
Programming Interface JTAG, Serial, Parallel

XCS30-3TQ144I Applications and Use Cases

Industrial Applications

The industrial temperature rating (-40°C to +85°C) makes the XCS30-3TQ144I ideal for:

  • Industrial automation controllers
  • Motor drive systems
  • Process control equipment
  • Factory automation systems
  • PLC (Programmable Logic Controller) designs

Telecommunications Applications

  • Network interface cards
  • Protocol converters
  • Data communication equipment
  • Switching systems

Consumer Electronics

  • Set-top boxes
  • Display controllers
  • Audio/video processing
  • Gaming peripherals

Embedded Systems

  • ASIC prototyping and replacement
  • Custom peripheral interfaces
  • Glue logic consolidation
  • Legacy system upgrades

XCS30-3TQ144I Design Considerations

Power Supply Requirements

Supply Rail Recommended Value
Vccint (Core) 5V ± 5%
Vcco (I/O) 5V
Decoupling 0.1µF per Vcc pin recommended

PCB Layout Guidelines

For optimal performance with the XCS30-3TQ144I:

  1. Use multi-layer PCB with dedicated power and ground planes
  2. Place decoupling capacitors close to power pins
  3. Route high-speed signals with controlled impedance traces
  4. Provide adequate thermal relief for power pins

Development Tools Compatibility

Tool Compatibility
Xilinx ISE Design Suite Fully Supported
JTAG Programmers Standard JTAG Interface
Third-Party EDA Tools Synopsys, Mentor Graphics

XCS30-3TQ144I Ordering Information

Part Number Breakdown

Code Meaning
XCS Xilinx Spartan Family
30 Device Size (30K gates)
-3 Speed Grade
TQ TQFP Package
144 144 Pins
I Industrial Temperature Range

Related Part Numbers

Part Number Description
XCS30-3TQ144C Commercial Temperature (0°C to +70°C)
XCS30-4TQ144I Faster Speed Grade (-4)
XCS30XL-5TQ144I Low-Voltage (3.3V) Version

XCS30-3TQ144I vs. Alternative FPGA Solutions

Comparison with Modern Alternatives

Feature XCS30-3TQ144I Spartan-3 Spartan-6
Technology 0.35µm 90nm 45nm
Core Voltage 5V 1.2V 1.0V/1.2V
Logic Cells 1,368 1,728+ 3,840+
Max I/O 113 124+ 186+
RAM Bits 18,432 72K+ 576K+

Frequently Asked Questions (FAQ)

What is the XCS30-3TQ144I used for?

The XCS30-3TQ144I is a programmable logic device used in industrial automation, telecommunications, consumer electronics, and embedded systems where flexible, reprogrammable logic is required.

Is the XCS30-3TQ144I still in production?

The XCS30-3TQ144I is classified as a mature product. For new designs, consider newer Spartan family devices, though the XCS30-3TQ144I remains available through authorized distributors for legacy support.

What software is needed to program the XCS30-3TQ144I?

The Xilinx ISE Design Suite is the recommended development environment for programming and configuring the XCS30-3TQ144I FPGA.

What is the difference between XCS30-3TQ144I and XCS30-3TQ144C?

The “I” suffix indicates Industrial temperature range (-40°C to +85°C), while “C” indicates Commercial temperature range (0°C to +70°C).


Conclusion

The XCS30-3TQ144I Xilinx Spartan FPGA remains a reliable choice for industrial applications requiring proven programmable logic technology. With 576 CLBs, 1,368 logic cells, and industrial-grade temperature specifications, this FPGA delivers the performance and reliability needed for demanding embedded system designs.

For engineers working on ASIC replacement projects, legacy system maintenance, or cost-sensitive applications, the XCS30-3TQ144I provides an excellent balance of features, performance, and availability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.