Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30-3PQ240C: High-Performance Spartan FPGA Solution for Industrial Applications

Product Details

Product Overview

The XCS30-3PQ240C is a field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan family, delivering exceptional performance and versatility for high-volume production applications. This FPGA provides a cost-effective alternative to traditional ASIC designs while maintaining the flexibility needed for modern digital logic implementations.

As part of the legendary Spartan series, the XCS30-3PQ240C represents the perfect balance between functionality, performance, and affordability. Whether you’re developing industrial automation systems, telecommunications equipment, or consumer electronics, this FPGA offers the programmable logic capabilities you need for successful product deployment.

Key Technical Specifications

Parameter Specification
Part Number XCS30-3PQ240C
Manufacturer AMD (formerly Xilinx)
Product Family Spartan® FPGA
Total Logic Gates 30,000 gates
Typical Gate Range 10,000 to 30,000 gates
Number of CLBs 576 Configurable Logic Blocks
Logic Elements/Cells 1,368 logic cells
Total RAM Bits 18,432 bits
I/O Count 192 user I/O pins
Package Type 240-BFQFP (Plastic Quad Flat Pack)
Package Size 32mm × 32mm
Mounting Type Surface Mount Technology (SMT)
Operating Temperature 0°C to 85°C (Commercial Grade)
Supply Voltage 4.75V to 5.25V
Technology Node 5V CMOS process

Core Features and Capabilities

Advanced Architecture Design

The XCS30-3PQ240C leverages Xilinx’s proven FPGA architecture to deliver:

  • 576 Configurable Logic Blocks (CLBs) arranged in a 24×24 array for optimal routing efficiency
  • 1,368 logic cells providing extensive combinational and sequential logic resources
  • 18,432 bits of distributed RAM enabling efficient data buffering and storage
  • 192 user-configurable I/O pins supporting multiple voltage standards and signaling protocols

Performance Characteristics

Performance Metric Value
Speed Grade -3 (Standard Performance)
Maximum Frequency Up to 125 MHz system clock
Propagation Delay Optimized for fast signal paths
Configuration Time Rapid SRAM-based configuration

Memory and Storage

The integrated memory architecture includes:

  • Distributed RAM using CLB resources
  • Flexible memory implementation options
  • Support for FIFO buffers and small memory arrays
  • Efficient use of logic resources for memory functions

Package Information

240-BFQFP Package Details

Package Attribute Details
Pin Count 240 pins
Package Format Bumpered Plastic Quad Flat Pack (BFQFP)
Body Size 32mm × 32mm
Lead Pitch 0.5mm
Mounting Surface Mount Device (SMD)
Package Height Standard low-profile design
RoHS Status Non-compliant (legacy product)

Target Applications and Use Cases

Industrial Automation Systems

The XCS30-3PQ240C excels in industrial control applications:

  • PLC (Programmable Logic Controller) implementations
  • Motor control and drive systems
  • Factory automation interfaces
  • Process control equipment
  • Industrial communication protocols

Telecommunications Infrastructure

Deploy this FPGA in telecom applications:

  • Protocol converters and bridges
  • Digital signal processing blocks
  • Communication interface cards
  • Line cards and switching matrices
  • Data format conversion

Consumer Electronics

Ideal for various consumer products:

  • Digital video processing
  • Audio equipment controllers
  • Gaming console peripherals
  • Set-top boxes
  • Home automation devices

Embedded Systems

Perfect for embedded computing:

  • Coprocessor implementations
  • Custom peripheral controllers
  • Interface bridge designs
  • Real-time data processing
  • System control logic

Design Advantages

ASIC Replacement Benefits

The XCS30-3PQ240C offers compelling advantages over traditional ASICs:

  1. Zero NRE Costs: Eliminate mask charges and initial tooling expenses
  2. Rapid Time-to-Market: Deploy designs in weeks instead of months
  3. Design Flexibility: Modify and update functionality post-deployment
  4. Risk Mitigation: Avoid the inherent risks of fixed silicon designs
  5. Lower Development Costs: Reduce overall project expenditure

Cost-Effective Scalability

  • Competitive pricing for high-volume production
  • Reduced inventory complexity with single-part flexibility
  • Lower obsolescence risk through reprogrammability
  • Simplified supply chain management

Development and Programming

Design Tools Compatibility

The XCS30-3PQ240C is supported by industry-standard Xilinx FPGA development tools:

  • ISE Design Suite: Complete design environment for Spartan FPGAs
  • VHDL and Verilog: Full HDL language support
  • Schematic Entry: Graphical design capture options
  • Timing Analyzer: Comprehensive timing analysis and verification
  • Simulator: Built-in simulation capabilities

Configuration Methods

Multiple configuration options provide flexibility:

  • Master Serial Mode
  • Slave Serial Mode
  • Boundary Scan (JTAG)
  • SelectMAP parallel interface
  • External PROM devices

Electrical Characteristics

Power Supply Requirements

Parameter Min Typ Max Unit
VCC (Core) 4.75 5.0 5.25 V
VCC (I/O) 4.75 5.0 5.25 V
Power Consumption Varies mW

Thermal Specifications

  • Commercial Temperature Range: 0°C to +85°C (TJ)
  • Package Thermal Resistance: Dependent on PCB design and airflow
  • Recommended Operating Conditions: Adequate cooling and thermal management

Quality and Reliability

Product Status

Important Notice: The XCS30-3PQ240C is currently listed as obsolete by AMD Xilinx. Design engineers should:

  • Consider migration paths to current-generation Spartan devices
  • Plan for long-term availability through authorized distributors
  • Evaluate newer FPGA families for new designs
  • Stock adequate inventory for existing product lifecycles

Manufacturing Standards

  • Manufactured using proven semiconductor processes
  • Quality assurance testing including functional and parametric tests
  • Available through authorized distribution channels
  • Tray packaging for volume production

Competitive Advantages

Why Choose XCS30-3PQ240C?

  1. Proven Track Record: Deployed in thousands of successful designs worldwide
  2. Comprehensive Documentation: Extensive datasheets and application notes available
  3. Strong Ecosystem: Mature development tools and IP cores
  4. Flexible I/O: 192 configurable pins support diverse interface requirements
  5. Reliable Performance: Commercial-grade temperature range for most applications

Comparison with Alternative Solutions

Feature XCS30-3PQ240C ASIC Alternative CPLD Solution
Initial Cost Low Very High Low
Time to Market Fast Slow Fast
Flexibility High None Medium
Gate Density 30K gates Unlimited Limited
Performance High Highest Medium
Power Efficiency Good Best Good

Pin Configuration and I/O Standards

I/O Capabilities

The 192 user I/O pins support:

  • TTL/CMOS voltage levels
  • Programmable slew rates
  • Pull-up and pull-down options
  • Input hysteresis
  • Multiple drive strengths

Pinout Organization

The 240-pin BFQFP package includes:

  • 192 user I/O pins
  • Dedicated configuration pins
  • Power and ground connections
  • Clock input pins
  • Mode selection pins

Design Considerations

PCB Layout Guidelines

For optimal performance, consider:

  • Decoupling: Place 0.1μF capacitors near each power pin
  • Power Distribution: Use adequate copper weight for power planes
  • Signal Integrity: Maintain controlled impedance for high-speed signals
  • Thermal Management: Ensure adequate airflow and cooling
  • Configuration: Route configuration signals with care

Clock Management

  • Multiple global clock networks available
  • Phase-locked loop (PLL) support varies by device
  • Clock distribution network optimized for low skew
  • External clock sources recommended for precise timing

Supply Chain and Availability

Ordering Information

  • Part Number: XCS30-3PQ240C
  • Speed Grade: -3 (standard performance)
  • Package Code: PQ240 (240-pin BFQFP)
  • Temperature Grade: C (Commercial: 0°C to 85°C)
  • Packaging: Tray

Distribution Channels

Available through:

  • Authorized AMD Xilinx distributors
  • Electronic component marketplaces
  • Specialized FPGA suppliers
  • Regional electronics distributors

Technical Support and Resources

Documentation

Complete technical documentation includes:

  • Product datasheet with detailed specifications
  • User guide covering architecture and features
  • Application notes for common design scenarios
  • PCB layout recommendations
  • Configuration guides

Development Support

  • Online technical forums and communities
  • Application engineering assistance
  • Reference designs and example projects
  • IP core libraries for common functions
  • Training materials and tutorials

Migration and Upgrade Paths

Future-Proofing Your Design

Since the XCS30-3PQ240C is obsolete, consider:

  • Spartan-3 Family: Pin-compatible upgrades with enhanced features
  • Spartan-6 Series: Modern low-power alternatives
  • Artix-7 FPGAs: Advanced 28nm technology for new designs
  • Cost-Optimized Solutions: Current-generation cost-effective options

Design Reuse Strategies

  • HDL code typically ports with minimal modifications
  • IP cores may require updates for newer architectures
  • Timing constraints need verification in new devices
  • I/O standards remain compatible across families

Conclusion

The XCS30-3PQ240C remains a capable FPGA solution for applications requiring 30,000 gates of programmable logic in a compact 240-pin BFQFP package. With 192 configurable I/O pins, 18,432 bits of distributed RAM, and proven Spartan architecture, this device offers excellent value for cost-sensitive, high-volume production environments.

While designated as obsolete, the XCS30-3PQ240C continues to serve existing designs and applications where its specifications meet requirements. For new projects, engineers should evaluate current-generation alternatives while leveraging the extensive knowledge base and proven design methodologies established with the Spartan family.

The combination of flexible architecture, comprehensive I/O capabilities, and industry-standard development tools makes the XCS30-3PQ240C an enduring choice for digital logic implementation across industrial, telecommunications, and consumer electronics markets.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.