Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30-3PQ208I: High-Performance Spartan FPGA for Industrial Applications

Product Details

Overview of XCS30-3PQ208I Field Programmable Gate Array

The XCS30-3PQ208I is a high-performance field programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan family. This industrial-grade FPGA delivers exceptional programmable logic capabilities with 1,368 logic cells and up to 30,000 system gates, making it an ideal choice for complex digital designs and ASIC replacement applications.

Originally manufactured by Xilinx (now part of AMD), the XCS30-3PQ208I represents a proven solution for engineers requiring reliable, cost-effective programmable logic in industrial temperature environments.

Key Features and Specifications

Core FPGA Specifications

Parameter Specification
Logic Cells 1,368
Maximum System Gates 30,000
Typical Gate Range 10,000-30,000
CLB Matrix 24 x 24
Total CLBs 576
Flip-Flops 1,536
Maximum User I/O 192
Distributed RAM Bits 18,432

Package and Environmental Details

Parameter Specification
Package Type PQFP (Plastic Quad Flat Pack)
Pin Count 208-pin
Package Code PQ208
Operating Temperature Industrial (-40°C to +85°C)
Speed Grade -3 (Standard Performance)
Supply Voltage 5V
Mounting Type Surface Mount

Technical Architecture and Performance

Configurable Logic Blocks (CLBs)

The XCS30-3PQ208I features a robust CLB architecture optimized for versatile digital logic implementation. Each CLB contains:

  • Three Look-Up Tables (LUTs): Function generators for implementing complex combinatorial logic
  • Two Flip-Flops: Register elements for sequential logic design
  • Signal Steering Multiplexers: Flexible routing and logic optimization
  • Distributed RAM Capability: Up to 18,432 bits of distributed memory

This architecture enables the FPGA to implement functions of up to nine inputs, providing exceptional flexibility for complex digital designs.

Programmable Interconnect Resources

The device incorporates a hierarchical routing architecture with:

  • Versatile routing channels between CLBs
  • Programmable Input/Output Blocks (IOBs) surrounding the logic array
  • Long lines for high-speed signal distribution
  • Optimized carry logic chains for arithmetic operations

Input/Output Capabilities

With up to 192 user-configurable I/O pins, the XCS30-3PQ208I supports:

  • Multiple I/O standards
  • Programmable drive strength
  • Individual I/O configuration
  • 3-state buffer capability
  • IEEE 1149.1 JTAG boundary-scan support

Application Areas and Use Cases

Industrial Automation and Control

The XCS30-3PQ208I excels in industrial environments requiring:

  • Motor control and drive systems
  • Process automation controllers
  • Industrial communication interfaces
  • Sensor data acquisition and processing
  • Real-time control algorithms

Communication Systems

Perfect for implementing:

  • Protocol converters and bridges
  • Custom communication interfaces
  • Data encryption/decryption engines
  • Signal processing modules
  • Network interface controllers

Embedded Systems Development

Ideal for:

  • ASIC prototyping and replacement
  • Custom peripheral controllers
  • Glue logic replacement
  • System-on-chip (SoC) development
  • Hardware acceleration modules

Test and Measurement Equipment

Supports applications including:

  • High-speed data acquisition
  • Signal generation and analysis
  • Custom test interfaces
  • Automated test equipment (ATE)
  • Laboratory instrumentation

Design Tools and Development Support

Compatible Development Environments

The XCS30-3PQ208I is supported by industry-standard Xilinx FPGA development tools, including:

  • Xilinx ISE Design Suite
  • FPGA Editor for detailed design placement
  • HDL synthesis tools (VHDL and Verilog)
  • Timing analysis and optimization tools
  • JTAG programming and debugging interfaces

Programming and Configuration

Multiple configuration options available:

  • Master Serial mode
  • Slave Serial mode
  • Boundary-Scan (JTAG) mode
  • In-system programming capability
  • Configuration through external PROM

Performance Characteristics

Speed and Timing

Parameter Value
Speed Grade -3 (Commercial)
System Clock Frequency Up to 100 MHz (design-dependent)
Internal Oscillator 4-10 MHz
Configuration Time < 100ms typical

Power Specifications

The device features low-power operation with:

  • Active power management
  • Power-down mode support
  • Configurable I/O drive strength
  • Optimized core voltage operation

Industrial-Grade Reliability

Temperature Range and Durability

The “I” grade designation indicates industrial temperature rating:

  • Operating Range: -40°C to +85°C
  • Extended reliability for harsh environments
  • Proven performance in demanding applications
  • Long-term availability and support

Quality and Compliance

  • RoHS compliant options available
  • JEDEC standard packaging
  • Comprehensive device testing
  • Industry-standard quality assurance

Comparison with Spartan Family Members

XCS30 vs. Other Spartan Devices

Device Logic Cells System Gates I/O Pins RAM Bits
XCS20 950 20,000 160 12,800
XCS30 1,368 30,000 192 18,432
XCS40 1,862 40,000 224 25,088

The XCS30 offers an optimal balance between logic capacity and cost-effectiveness for mid-range applications.

Package Information and PCB Design

PQ208 Package Dimensions

The 208-pin PQFP package offers:

  • 28mm x 28mm body size
  • 0.5mm lead pitch
  • Industry-standard footprint
  • Excellent thermal characteristics
  • Compatible with standard PCB assembly processes

PCB Design Considerations

When designing with the XCS30-3PQ208I:

  • Provide adequate power supply decoupling
  • Implement proper ground plane design
  • Consider signal integrity for high-speed signals
  • Plan for JTAG programming access
  • Allow thermal management considerations

Ordering Information and Availability

Part Number Breakdown

XCS30-3PQ208I decodes as:

  • XCS30: Spartan family, 30,000-gate device
  • -3: Speed grade (standard performance)
  • PQ208: 208-pin plastic quad flat pack
  • I: Industrial temperature range

Related Part Numbers

Common variants include:

  • XCS30-3PQ208C: Commercial temperature grade
  • XCS30-4PQ208I: Faster speed grade, industrial temp
  • XCS30XL-3PQ208I: Low-power variant

Why Choose XCS30-3PQ208I?

Cost-Effective ASIC Replacement

The XCS30-3PQ208I delivers:

  • Zero NRE costs compared to ASICs
  • Rapid design iteration capability
  • Field-upgradable functionality
  • Production-ready pricing for volume applications
  • Reduced time-to-market

Proven Technology Platform

Benefits of the Spartan architecture:

  • Mature, well-understood design flow
  • Extensive IP core library support
  • Comprehensive documentation
  • Strong community and vendor support
  • Long product lifecycle

Industrial-Grade Reliability

Designed for demanding environments:

  • Extended temperature operation
  • Proven reliability in production systems
  • Comprehensive device characterization
  • Quality manufacturing processes

Getting Started with XCS30-3PQ208I

Design Flow Overview

  1. Requirements Analysis: Define system specifications
  2. HDL Coding: Develop design in VHDL or Verilog
  3. Synthesis: Convert HDL to netlist
  4. Implementation: Place and route design
  5. Timing Analysis: Verify performance requirements
  6. Programming: Configure FPGA device
  7. Verification: Test in target application

Essential Design Resources

Access comprehensive support materials:

  • Complete datasheet and specifications
  • Application notes and design guides
  • Reference designs and IP cores
  • Technical support and community forums
  • Training materials and tutorials

Technical Support and Documentation

For engineers working with the XCS30-3PQ208I, AMD Xilinx provides:

  • Detailed datasheets with AC/DC specifications
  • Application notes covering common design challenges
  • Package mechanical drawings for PCB layout
  • IBIS models for signal integrity simulation
  • Software user guides and tutorials

Conclusion

The XCS30-3PQ208I represents a mature, reliable FPGA solution for industrial applications requiring up to 30,000 gates of programmable logic. With its proven Spartan architecture, industrial temperature rating, and comprehensive development tool support, this device continues to serve as an excellent choice for ASIC replacement, custom logic implementation, and embedded system development.

Whether you’re designing industrial control systems, communication interfaces, or embedded applications, the XCS30-3PQ208I offers the performance, flexibility, and reliability needed for demanding production environments. Its combination of adequate logic resources, extensive I/O capability, and industrial-grade specifications makes it an ideal solution for a wide range of programmable logic applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.