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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCS30-3PG208C: High-Performance Xilinx Spartan FPGA for Industrial Applications

Product Details

Overview of the XCS30-3PG208C Field Programmable Gate Array

The XCS30-3PG208C is a versatile field-programmable gate array (FPGA) from the renowned Xilinx Spartan family, designed to deliver exceptional performance for high-volume production applications. This FPGA chip represents an ideal ASIC replacement solution, offering 30,000 system gates with advanced configuration capabilities and cost-effective implementation for industrial and embedded systems.

Manufactured by AMD (formerly Xilinx), the XCS30-3PG208C combines reliability with flexibility, making it perfect for applications requiring reconfigurable logic, rapid prototyping, and production-ready designs. The device features a 208-pin plastic quad flat pack (PQFP) package, providing excellent I/O density while maintaining ease of PCB integration.

Key Technical Specifications

Core Performance Features

Specification Value
Logic Cells 1,368
System Gates 30,000 maximum
Typical Gate Range 10,000 – 30,000
CLB Matrix 24 x 24
Total CLBs 576 Configurable Logic Blocks
Flip-Flops 1,536
Speed Grade -3 (125 MHz typical)
Distributed RAM Bits 18,432

Package and Physical Characteristics

Parameter Specification
Package Type PG208C – Plastic Quad Flat Pack
Pin Count 208 pins
I/O Pins Up to 192 user I/O
Mounting Type Surface Mount
Operating Temperature Commercial (0°C to +70°C)
Package Form Gull Wing terminals

Architecture and Design Features

Configurable Logic Block (CLB) Architecture

The XCS30-3PG208C employs Xilinx’s proven CLB architecture with three look-up tables (LUTs) per block, enabling efficient implementation of complex logic functions. Each CLB contains:

  • Three function generators implemented as LUTs
  • Two dedicated flip-flops for sequential logic
  • Advanced multiplexer networks for signal routing
  • Support for functions up to nine inputs
  • Distributed RAM capability within each CLB

Memory and Storage Capabilities

This FPGA provides flexible memory options through its distributed RAM architecture, offering 18,432 bits of on-chip RAM that can be configured as:

  • Single-port RAM
  • Dual-port RAM
  • ROM structures
  • Shift register implementations

Advanced Features for Professional Applications

IEEE 1149.1 JTAG Boundary-Scan Support

The XCS30-3PG208C includes comprehensive JTAG support for:

  • In-system programming and configuration
  • Boundary-scan testing capabilities
  • Design debugging and verification
  • Production testing integration
  • Chain-compatible with other JTAG devices

Configuration Options and Flexibility

Configuration Mode Description
Master Mode Self-configures using external PROM
Slave Serial Configuration by external controller
JTAG Programming through boundary-scan interface
Peripheral Mode Microprocessor-based configuration

Internal Oscillator and Timing

Built-in 8 MHz oscillator provides:

  • Configuration clock generation
  • Optional post-configuration clock source
  • Four programmable divider taps
  • Frequency range: 4-10 MHz dependent on process/temperature

Application Areas and Use Cases

Industrial Control Systems

The XCS30-3PG208C excels in industrial automation applications including:

  • Motor control and drive systems
  • Process monitoring and control
  • Industrial networking protocols
  • Sensor interface management
  • Real-time data acquisition systems

Communications and Networking

Ideal for communication applications such as:

  • Protocol conversion and bridging
  • Data encryption and security
  • Network packet processing
  • Signal conditioning and filtering
  • Custom interface implementations

Consumer Electronics

Perfect for high-volume consumer products requiring:

  • Video and audio processing
  • Display control and management
  • User interface implementation
  • System control logic
  • Cost-sensitive ASIC replacement

Design Advantages and Benefits

Cost-Effective ASIC Alternative

The XCS30-3PG208C delivers ASIC-equivalent pricing in high volumes while eliminating:

  • Lengthy NRE (Non-Recurring Engineering) costs
  • Extended development timelines
  • Inventory risk from fixed-function devices
  • Multi-year commitment requirements

Rapid Prototyping and Time-to-Market

Enable faster product development through:

  • Immediate design implementation
  • In-system reprogrammability
  • Iterative design refinement
  • Reduced prototype costs
  • Shortened development cycles

Proven Reliability and Support

Benefit from Xilinx’s industry-leading support:

  • Extensive documentation and datasheets
  • Mature development tools
  • Large designer community
  • Production-proven technology
  • Long-term product availability

Compatible Development Tools

Tool Category Software Options
Design Entry ISE Foundation, Vivado (for newer workflows)
Synthesis XST (Xilinx Synthesis Technology)
Simulation ModelSim, ISim
Implementation PAR (Place and Route) tools
Programming iMPACT, Vivado Hardware Manager

Power Specifications

Operating Conditions

Parameter Typical Maximum Unit
Core Voltage (VCCINT) 5.0 5.25 V
I/O Voltage (VCCO) 5.0 5.25 V
Standby Current 5 10 mA
Active Current 50 150 mA

Note: Actual power consumption varies based on design utilization, switching frequency, and operating conditions.

Quality and Compliance Standards

The XCS30-3PG208C meets rigorous quality standards including:

  • RoHS compliant manufacturing
  • MSL (Moisture Sensitivity Level) rating
  • ESD protection on all pins
  • Automotive-grade variants available
  • ISO 9001 certified production

Related Xilinx FPGA Products

Engineers working with the XCS30-3PG208C may also consider other devices in the Spartan family for different gate count requirements. The Spartan series offers scalable solutions from 5,000 to 40,000 gates, ensuring you can select the optimal device for your specific application needs.

Ordering Information and Part Number Breakdown

XCS30-3PG208C decodes as:

  • XCS30 = Spartan 30,000 gate device
  • -3 = Speed grade (-3 indicates 125 MHz typical performance)
  • PG208 = Plastic quad flat pack, 208 pins
  • C = Commercial temperature range (0°C to +70°C)

Technical Support and Resources

Documentation Available

  • Complete datasheet with AC/DC specifications
  • Application notes for common implementations
  • Reference designs and example code
  • PCB layout guidelines and recommendations
  • Thermal management considerations

Design Considerations

When implementing the XCS30-3PG208C in your design, consider:

  1. Adequate decoupling – Place 0.1µF and 0.01µF capacitors near power pins
  2. Configuration interface – Plan for JTAG or configuration PROM connections
  3. Clock distribution – Use dedicated clock routing resources
  4. I/O standards – Match voltage levels with connected devices
  5. Thermal management – Ensure adequate airflow for sustained operation

Competitive Advantages

Why Choose XCS30-3PG208C?

Performance: 125 MHz system performance with low propagation delays

Flexibility: Fully reconfigurable architecture allows design modifications

Integration: 192 I/O pins support complex system interfaces

Cost: High-volume pricing competitive with mask-programmed devices

Risk Mitigation: Field upgradeable for bug fixes and feature additions

Summary and Conclusion

The XCS30-3PG208C represents a mature, reliable FPGA solution ideal for production applications requiring 30,000 gates of programmable logic. Its combination of proven Spartan architecture, comprehensive I/O capabilities, and cost-effective implementation makes it an excellent choice for industrial control, communications, and consumer electronics applications.

Whether you’re replacing an existing ASIC, developing a new product, or need a flexible logic solution for evolving requirements, the XCS30-3PG208C delivers the performance, reliability, and economic advantages necessary for successful commercial deployment.

With extensive tool support, comprehensive documentation, and the backing of AMD’s engineering expertise, designers can confidently implement complex digital systems while maintaining schedule and budget objectives. The device’s production-proven track record across thousands of applications worldwide demonstrates its capability to meet demanding operational requirements.

For engineers seeking a balance between logic capacity, I/O density, and cost-effectiveness, the XCS30-3PG208C Spartan FPGA continues to be a compelling solution in today’s competitive electronics market.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.