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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCS10XL-4CS144C: High-Performance Spartan-XL FPGA for Cost-Effective ASIC Replacement

Product Details

Overview of XCS10XL-4CS144C FPGA

The XCS10XL-4CS144C is a powerful field-programmable gate array from AMD (formerly Xilinx) that belongs to the renowned Spartan-XL family. This FPGA delivers exceptional performance with 10,000 system gates, 466 logic cells, and operates at speeds up to 217MHz. Housed in a compact 144-pin CSBGA (Chip Scale Ball Grid Array) package, this device provides an ideal solution for high-volume production applications requiring ASIC-level performance without the associated development costs and risks.

The XCS10XL-4CS144C represents a mature, proven technology that combines reliability with cost-effectiveness. Operating on a single 3.3V power supply while maintaining 5V tolerant I/Os, this FPGA offers the perfect balance between modern low-power design and compatibility with legacy systems. For comprehensive information about Xilinx FPGA solutions and design resources, engineers can access detailed technical documentation and support materials.

Key Technical Specifications

Core Performance Parameters

Specification Value
Logic Cells 466
System Gates 10,000
Operating Frequency 217 MHz
Configurable Logic Blocks (CLBs) 196 (14 x 14 matrix)
Flip-Flops 616
Maximum User I/O 112
Distributed RAM 6,272 bits
Supply Voltage 3.3V
Package Type 144-Pin CSBGA
Speed Grade -4

Electrical Characteristics

Parameter Specification
Core Voltage 3.3V ±10%
I/O Voltage Tolerance 5V tolerant inputs
Output Drive Current 12 mA or 24 mA (selectable)
Operating Temperature 0°C to +70°C (Commercial)
PCI Compliance 5V and 3.3V PCI compliant
Environmental Compliance RoHS compliant (Lead-free)

Advanced Features and Capabilities

Configurable Logic Architecture

The XCS10XL-4CS144C utilizes the proven XC4000 architecture, enhanced with Spartan-XL optimizations. Each CLB contains three look-up tables (LUTs) for logic function generation, two flip-flops, and advanced signal steering multiplexers. This architecture enables efficient implementation of complex combinatorial and sequential logic functions.

Key architectural advantages:

  • Enhanced carry logic for high-speed arithmetic operations
  • Flexible high-speed clock network with global and secondary clock buffers
  • Latch capability within CLBs for specialized timing requirements
  • Input fast capture latch for high-speed data acquisition
  • Optional MUX or 2-input function generator on outputs

Memory and Storage Options

The distributed RAM architecture provides 6,272 bits of embedded memory, configurable as synchronous or asynchronous RAM. This on-chip memory eliminates the need for external memory devices in many applications, reducing board complexity and improving system performance.

Clock Management System

The XCS10XL-4CS144C features a sophisticated clock distribution network:

  • Eight global clock buffers (GCK1-GCK8) for low-skew distribution
  • Four secondary global clock buffers (SGCK1-SGCK4) for additional timing domains
  • Internal 8 MHz oscillator with programmable dividers
  • Express Mode configuration for rapid device initialization

Application Areas and Use Cases

Industrial Automation and Control

The XCS10XL-4CS144C excels in industrial control applications where reliability and real-time performance are critical. The device handles motor control algorithms, PLC logic replacement, and industrial protocol interfaces with ease.

Communications Infrastructure

For telecommunications equipment, this FPGA provides the processing power needed for protocol conversion, data packet processing, and signal conditioning. The high-speed I/O capabilities support various communication standards including RS-485, CAN bus, and parallel interfaces.

Automotive Electronics

In automotive applications, the XCS10XL-4CS144C serves as the processing core for infotainment systems, instrument cluster controllers, and body electronics modules. The wide operating temperature range and robust I/O structure make it suitable for harsh automotive environments.

Medical Devices

Medical equipment manufacturers utilize this FPGA for signal processing in diagnostic equipment, patient monitoring systems, and laboratory instruments. The deterministic performance ensures accurate real-time data processing.

Consumer Electronics

From gaming peripherals to point-of-sale terminals, the XCS10XL-4CS144C provides the programmable logic needed for feature-rich consumer products. The low power consumption extends battery life in portable devices.

Design and Development Support

Configuration Options

The XCS10XL-4CS144C supports multiple configuration modes:

  • Master Serial Mode: FPGA generates configuration clock from internal oscillator
  • Slave Serial Mode: External controller provides configuration clock
  • Master Parallel Mode: 8-bit parallel configuration for rapid loading
  • Slave Parallel Mode: External processor controls configuration process
  • Express Mode: Ultra-fast configuration with reduced start-up time
  • Boundary Scan (JTAG): IEEE 1149.1 compliant for in-system programming

Development Tools

Engineers designing with the XCS10XL-4CS144C can leverage comprehensive development tools:

  • ISE Design Suite for synthesis and implementation
  • Vivado compatibility for newer design flows
  • Extensive IP core library for common functions
  • Hardware debugger support through ChipScope
  • Timing analysis tools for performance optimization

Pin Configuration and Package Details

The 144-pin CSBGA package provides excellent signal integrity in a compact footprint. The 0.8mm ball pitch enables high-density PCB layouts while maintaining manufacturability. The package dimensions (15mm x 15mm typical) minimize board space requirements.

Performance Optimization Guidelines

Timing Considerations

Achieving optimal performance with the XCS10XL-4CS144C requires attention to several design factors:

Clock domain management: Separate clock domains should use independent global clock buffers to minimize skew and jitter. The device provides dedicated clock routing resources that deliver sub-nanosecond clock distribution.

Combinatorial path optimization: Long combinatorial paths should be pipelined using the abundant flip-flop resources. The register-rich architecture encourages pipeline-heavy designs for maximum throughput.

I/O timing constraints: Fast input capture latches enable reliable sampling of high-speed external signals. Output delay requirements can be met using the IOB flip-flops located adjacent to each I/O pad.

Power Management

The 3.3V core voltage enables low-power operation compared to older 5V FPGA families. Additional power savings can be achieved through:

  • Clock gating for unused logic sections
  • Power-down mode for standby conditions
  • Selective I/O drive strength configuration
  • Strategic placement of high-activity logic near power sources

Comparison with Related Devices

XCS10XL Family Variants

Part Number Speed Grade Package Max Frequency Key Difference
XCS10XL-3CS144C -3 144-CSBGA 166 MHz Lower cost, slower speed
XCS10XL-4CS144C -4 144-CSBGA 217 MHz Balanced performance
XCS10XL-5CS144C -5 144-CSBGA 250 MHz Premium performance
XCS10XL-4TQ144C -4 144-TQFP 217 MHz Through-hole compatible
XCS10XL-4TQG144C -4 144-TQFP 217 MHz Green/RoHS version

Spartan-XL Family Members

Device Logic Cells CLBs Max I/O Distributed RAM Application Fit
XCS05XL 238 100 77 3,200 bits Simple control
XCS10XL 466 196 112 6,272 bits General purpose
XCS20XL 950 400 160 12,800 bits Complex logic
XCS30XL 1,368 576 192 18,432 bits High-end systems
XCS40XL 1,862 784 224 24,576 bits Maximum capacity

PCB Design Recommendations

Layout Guidelines

Successful implementation of the XCS10XL-4CS144C requires careful PCB design:

Power distribution: Use multiple decoupling capacitors (0.1µF and 0.01µF) placed close to each VCC pin. A solid ground plane provides low-impedance return paths for high-frequency signals.

Signal integrity: Match trace impedances for high-speed signals. Keep clock traces short with controlled impedance. Avoid routing critical signals near noisy power supplies or high-current traces.

Thermal management: The CSBGA package provides excellent thermal performance. A thermal via array beneath the package efficiently conducts heat to internal ground planes. Consider airflow direction in the enclosure design.

BGA Assembly Considerations

The 144-pin CSBGA package requires appropriate assembly processes:

  • X-ray inspection capability for solder joint verification
  • Reflow profile optimized for lead-free solder
  • Pad design following IPC-7351 standards
  • Moisture sensitivity level precautions during storage

Quality and Reliability

Manufacturing Standards

The XCS10XL-4CS144C is manufactured using proven semiconductor processes with comprehensive quality controls:

  • 100% electrical testing of all devices
  • Burn-in testing for extended temperature variants
  • Qualification per JEDEC standards
  • ISO 9001 certified manufacturing facilities

Long-Term Availability

As a mature product in the Spartan-XL family, the XCS10XL-4CS144C has an established supply chain. However, designers should note that this device is classified as “not recommended for new designs” by the manufacturer. For new projects, consider migration paths to current FPGA families while this device remains suitable for production support and legacy system maintenance.

Ordering Information and Support

Part Number Breakdown

XCS10XL-4CS144C decodes as follows:

  • XCS: Spartan family identifier
  • 10: 10,000 system gates
  • XL: Spartan-XL variant
  • -4: Speed grade (-4 = 217 MHz)
  • C: Commercial temperature range
  • S: CSBGA package type
  • 144: Pin count
  • C: Lead-free/RoHS compliant

Technical Resources

Design engineers can access comprehensive support documentation:

  • Complete datasheet with AC/DC specifications
  • Reference designs and application notes
  • IBIS models for signal integrity simulation
  • BSDL files for boundary scan testing
  • Package outline drawings and thermal data

Frequently Asked Questions

Q: What is the configuration bitstream size for the XCS10XL-4CS144C? A: The configuration bitstream is approximately 125 Kbits, varying slightly based on configuration options and Express Mode settings.

Q: Can I use 5V I/O devices with this FPGA? A: Yes, all I/O pins are 5V tolerant when properly configured, enabling direct interface with legacy 5V logic families.

Q: What is the power consumption? A: Typical power consumption ranges from 0.5W to 2W depending on clock frequency, logic utilization, and I/O activity. Precise calculation requires power estimation tools.

Q: Is in-system programming supported? A: Yes, through JTAG boundary scan interface (IEEE 1149.1 compliant), enabling field updates without device removal.

Q: What configuration memory devices are compatible? A: Serial PROMs (XC17S10XL or equivalent) or parallel EPROMs can configure the device. Modern designs typically use SPI flash memory.

Summary

The XCS10XL-4CS144C represents a proven FPGA solution for cost-sensitive, high-volume applications. With 466 logic cells, 217 MHz performance, and comprehensive I/O capabilities in a compact 144-pin CSBGA package, this device delivers ASIC-like functionality with FPGA flexibility. While classified as mature product, it continues to serve as a reliable choice for production systems and legacy equipment support.

The combination of 3.3V low-power operation, 5V tolerant I/Os, and extensive on-chip resources makes the XCS10XL-4CS144C versatile across industrial, automotive, communications, and consumer applications. The well-established design tools, comprehensive documentation, and broad ecosystem support ensure successful project implementation.

For new designs requiring similar capabilities, engineers should evaluate current FPGA families while this device remains an excellent choice for sustaining existing products and cost-optimized designs where the proven Spartan-XL architecture provides sufficient performance and resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.