The XCKU115-L1FLVB1760I is a high-performance, low-power Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Designed for demanding signal processing, networking, and industrial applications, this device delivers an exceptional balance of logic density, DSP throughput, and power efficiency in a 1760-pin FCBGA package.

Whether you are working on 100G networking, medical imaging, wireless infrastructure, or data center acceleration, the XCKU115-L1FLVB1760I provides the computational resources and I/O flexibility needed for next-generation designs.

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What Is the XCKU115-L1FLVB1760I?

The XCKU115-L1FLVB1760I is a member of the Kintex UltraScale FPGA family, built on TSMC’s 20nm planar process technology. The “L1” in the part number designates the -1L speed grade — a low-voltage variant screened for reduced static power consumption. This device supports dual VCCINT operating voltages (0.95V and 0.90V), allowing designers to trade off between full -1 speed-grade performance and an ultra-low-power operating mode.

The “FLVB1760” package designator indicates a 1760-pin Flip-chip Low-Voltage Ball Grid Array (FLVBGA), and the “I” suffix confirms an industrial temperature range of –40°C to +100°C, making this part suitable for rugged, real-world deployment environments.

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XCKU115-L1FLVB1760I Key Specifications

Quick Reference Table

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XCKU115-L1FLVB1760I Logic and DSP Resources

Logic Fabric Specifications

The XCKU115-L1FLVB1760I features a massive and flexible logic fabric built on the Xilinx UltraScale architecture. The device uses an ASIC-like interconnect structure that reduces routing delays and improves design closure times compared to prior FPGA generations.

Digital Signal Processing (DSP) Performance

With 5,520 DSP48E2 slices, the XCKU115-L1FLVB1760I delivers outstanding signal processing bandwidth. Each DSP48E2 slice supports a 27×18 multiplier, pre-adder, and accumulator, enabling cascaded DSP chains for FIR filters, FFT engines, matrix operations, and real-time image processing pipelines.

This device is especially well-suited for:

• Software-defined radio (SDR) and baseband processing
• Real-time radar and sonar signal chains
• Next-generation medical imaging (CT, MRI, ultrasound)
• High-resolution video processing up to 8K4K

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XCKU115-L1FLVB1760I High-Speed Transceiver Specifications

GTH Transceiver Summary

The XCKU115-L1FLVB1760I integrates high-speed GTH transceivers capable of supporting a wide range of industry-standard serial protocols.

These high-speed links enable the device to interface with optical modules, FMC daughter cards, memory controllers, and system backplanes without sacrificing signal integrity.

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XCKU115-L1FLVB1760I I/O and Package Details

I/O Bank and Pin Summary

The HP (High Performance) I/O banks support VCCO voltages of 1.0V, 1.2V, 1.35V, 1.5V, and 1.8V, and provide support for DDR3, DDR4, LPDDR4, and QDR memory interfaces. Calibrated on-die termination (DCI) is included for signal integrity optimization.

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XCKU115-L1FLVB1760I Power and Voltage Specifications

Operating Voltage Summary

The -1L speed grade variant distinguishes itself through its dual-voltage flexibility. This makes it highly attractive for power-sensitive applications.

When operating at VCCINT = 0.95V, the -1L device matches the full -1 speed grade performance. When operated at 0.90V, the device achieves significantly lower maximum static power at a modest performance reduction — a compelling trade-off for thermally constrained designs.

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Part Number Decoder: XCKU115-L1FLVB1760I Explained

Understanding the part number helps you quickly identify the device variant and its capabilities.

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XCKU115-L1FLVB1760I vs. Other XCKU115 Variants

The XCKU115 device is available in multiple speed grades and temperature ranges. Understanding how the -L1FLVB1760I compares to related variants helps you select the right part for your application.

The -1L variant is the ideal choice when power efficiency and industrial temperature compliance are both required, without sacrificing the full logic resources of the KU115 die.

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Target Applications for the XCKU115-L1FLVB1760I

Where Is This FPGA Used?

The XCKU115-L1FLVB1760I is designed to serve demanding application segments that require high compute density, flexible I/O, and long-term reliability:

#### 100G Networking and Data Center

The integrated 100G Ethernet MAC blocks and PCIe Gen3 hardened IP make this device a natural fit for line-rate packet processing, deep packet inspection, network function virtualization (NFV), and SmartNIC development.

#### Wireless Infrastructure

With 5,520 DSP slices and 64 GTH transceivers, this FPGA supports beamforming, DPD (digital pre-distortion), CPRI front-haul links, and massive MIMO processing required in 4G LTE and 5G NR base stations.

#### Medical Imaging

Real-time reconstruction pipelines for CT, MRI, and ultrasound systems benefit from the device’s large block RAM, deep DSP cascading capability, and industrial temperature range suitable for medical equipment environments.

#### Defense and Radar

EW (electronic warfare), radar signal processing, SIGINT, and mission-critical communications systems leverage the device’s high I/O count, wide memory bandwidth, and resistance to industrial environmental conditions.

#### Video and Broadcast

8K4K video processing, multi-channel real-time encoding/decoding, and broadcast routing require precisely the combination of logic density, DSP throughput, and high-speed serial interfaces the KU115 provides.

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Design Tools and Support

The XCKU115-L1FLVB1760I is fully supported by the AMD Vivado™ Design Suite, AMD’s industry-standard FPGA design environment. Vivado provides integrated synthesis, implementation, timing closure, and hardware debug capabilities.

Key toolchain support includes:

• Vivado ML Edition – Full synthesis, P&R, and bitstream generation
• Vitis™ HLS – High-level synthesis for C/C++-based accelerator development
• Xilinx Power Estimator (XPE) – Accurate pre- and post-implementation power analysis
• ChipScope Pro / ILA – In-system logic analysis and hardware debugging
• PCIe, DDR4, Ethernet IP – Pre-validated IP cores from the Xilinx IP Catalog

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XCKU115-L1FLVB1760I Ordering Information

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Frequently Asked Questions

What does the “L” mean in XCKU115-L1FLVB1760I?

The “L” denotes the -1L (low-power) speed grade, which allows the device to operate at a reduced VCCINT of 0.90V for lower static power dissipation. At 0.95V, the -1L device matches the standard -1 speed grade performance.

What is the maximum operating temperature of this device?

With the “I” suffix, the XCKU115-L1FLVB1760I is rated for industrial operation from –40°C to +100°C junction temperature.

How many user I/O pins does the XCKU115-L1FLVB1760I have?

The device provides 702 user I/O pins in the 1760-pin FLVB package, supporting multiple memory and logic interface standards.

Is the XCKU115-L1FLVB1760I the same die as the XCKU115-1FLVB1760I?

Yes. Both devices use the same KU115 die. The difference is solely in the VCCINT voltage screening: the -1L variant is tested and binned for low-power operation at 0.90V, whereas the standard -1 runs at 0.95V.

What memory interfaces does this FPGA support?

The HP I/O banks support DDR3, DDR4, LPDDR4, QDR II+, and RLDRAM 3 memory interfaces, enabling high-bandwidth memory subsystems for data-intensive applications.