The XCKU115-L1FLVA2104I is a high-performance, low-power Field Programmable Gate Array (FPGA) from AMD Xilinx, part of the industry-leading Kintex® UltraScale™ family. Built on a cutting-edge 20nm process node, this device delivers exceptional logic density, advanced DSP capability, and next-generation transceiver performance — making it a top choice for demanding applications in industrial, networking, and signal-processing environments.

Whether you are developing 100G networking equipment, high-throughput data acquisition systems, or advanced wireless infrastructure, the XCKU115-L1FLVA2104I offers the performance headroom, I/O flexibility, and power efficiency your design demands. Browse a wide range of Xilinx FPGA options to find the right fit for your next project.

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What Is the XCKU115-L1FLVA2104I?

The XCKU115-L1FLVA2104I is a member of the Kintex UltraScale product family manufactured by AMD (formerly Xilinx). The part number can be decoded as follows:

The -1L speed grade is a unique feature of this variant. It supports dual VCCINT voltage operation at either 0.95V or 0.90V. When operating at 0.95V, timing performance is identical to the standard -1 speed grade. When operating at 0.90V, this device delivers measurably lower static power — ideal for power-sensitive industrial deployments.

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XCKU115-L1FLVA2104I Key Specifications

Core Logic Resources

Memory Resources

DSP and Processing

I/O and Transceivers

Package and Environmental

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XCKU115-L1FLVA2104I vs. Other XCKU115 Variants

The XCKU115 die is shared across several package and speed-grade options. Understanding how the L1FLVA2104I compares to its siblings helps engineers select the right part.

Note: The “A” package variant (FLVA2104) provides the maximum I/O count of 832 pins, making the XCKU115-L1FLVA2104I the best option when both maximum I/O and industrial low-power operation are required.

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Architecture Overview: Kintex UltraScale Technology

UltraScale ASIC-Like Clocking

The XCKU115-L1FLVA2104I leverages Xilinx’s UltraScale architecture, which introduces ASIC-like clocking with fine-grained clock gating across the entire device. This reduces dynamic power by enabling designers to shut down unused logic regions without impacting overall system performance.

Next-Generation GTH Transceivers

With 64 GTH transceivers capable of line rates up to 16.3 Gb/s, this device supports the most demanding high-speed serial protocols, including:

• PCIe Gen3 (×1, ×2, ×4, ×8, ×16)
• 100GbE (IEEE 802.3ba)
• JESD204B for high-speed ADC/DAC interfaces
• Interlaken for chip-to-chip and board-to-board links
• SATA, SAS, and other storage protocols

Stacked Silicon Interconnect (SSI) Technology

The KU115 device is implemented using SSI technology, where multiple super-logic regions (SLRs) are stacked on a silicon interposer. This provides die-to-die bandwidth far exceeding conventional package integration methods, enabling a unified programming model while supporting extreme resource density.

High-Density DSP Architecture

At 5,520 DSP48E2 slices, the XCKU115 delivers up to 8,916 GMAC/s of signal processing performance. Each DSP48E2 slice supports:

• 27×18 multiplier
• 48-bit accumulator
• Pre-adder for efficient filtering
• Cascade chains for FIR, FFT, and floating-point implementations

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Power Management: The -1L Advantage

Dual VCCINT Voltage Operation

The -1L speed grade is uniquely screened for reduced static power. Compared to the standard -1 device:

This makes the XCKU115-L1FLVA2104I ideal for:

• Always-on industrial equipment with tight thermal budgets
• Rack-mounted systems where power density is critical
• Remote deployments operating from battery or limited power sources

Up to 40% Lower Power vs. Previous Generation

Compared to older 28nm Kintex-7 devices, the Kintex UltraScale family delivers up to 40% power reduction for equivalent workloads, primarily through fine-grained clock gating, process node improvements, and architectural optimizations.