The XCKU115-L1FLVA1517I is a high-performance, low-power Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Built on 20nm process technology, this device delivers an outstanding balance of DSP performance, logic density, and power efficiency — making it a top choice for demanding applications in 100G networking, data centers, medical imaging, and wireless infrastructure.
Whether you are an FPGA engineer evaluating next-generation devices or a procurement specialist sourcing the XCKU115-L1FLVA1517I, this guide provides everything you need: full specifications, key features, application use cases, and ordering information.
What Is the XCKU115-L1FLVA1517I?
The XCKU115-L1FLVA1517I belongs to the Kintex UltraScale FPGA family by Xilinx/AMD. It is part number XCKU115 in the -L1 (low-power speed grade 1) variant, housed in a 1517-pin FCBGA (Fine-Pitch Ball Grid Array) package, and rated for industrial temperature range (denoted by the “I” suffix, typically –40°C to +100°C).
The “L1” in the part number indicates a low-voltage, low-power screened device. The XCKU115-L1 can operate at two VCCINT voltages — 0.90V and 0.95V — offering designers a direct power/performance trade-off. At 0.95V, it matches the -1 speed grade performance; at 0.90V, it delivers reduced static power for thermally constrained designs.
XCKU115-L1FLVA1517I Key Specifications
General Specifications Table
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-L1FLVA1517I |
| FPGA Family |
Kintex UltraScale |
| Process Technology |
20nm |
| Speed Grade |
-1L (Low Power) |
| Package Type |
FCBGA (Fine-Pitch Ball Grid Array) |
| Package Pins |
1517 |
| Operating Temperature |
–40°C to +100°C (Industrial) |
| Supply Voltage (VCCINT) |
0.90V / 0.95V |
Logic & Memory Resources Table
| Resource |
Quantity |
| System Logic Cells |
1,160,880 |
| CLB Flip-Flops |
1,326,720 |
| CLB LUTs |
663,360 |
| Block RAM Bits |
77,722 Kbits |
| DSP Slices |
5,520 |
| MMCM / PLL |
Yes |
| Maximum User I/O |
624 |
Transceiver & Interface Specifications Table
| Feature |
Detail |
| GTH Transceivers |
Up to 64 per device |
| Transceiver Data Rate |
Up to 16.3 Gb/s |
| PCIe Interface |
Integrated PCIe Gen3 cores |
| DDR4 Memory Interface |
2400 Mb/s |
| Configuration Interface |
SelectMAP, JTAG, SPI |
XCKU115-L1FLVA1517I Part Number Decoder
Understanding the part number helps engineers and buyers confirm they are ordering the correct variant.
| Code |
Meaning |
| XC |
Xilinx Commercial |
| KU115 |
Kintex UltraScale, 115 device density |
| L1 |
Low-power speed grade 1 |
| FLV |
Fine-pitch, Low-Voltage BGA package |
| A |
Package variant A |
| 1517 |
1517 total pins |
| I |
Industrial temperature grade (–40°C to +100°C) |
Key Features of the XCKU115-L1FLVA1517I
High Logic Density for Complex Designs
With over 1.16 million system logic cells and more than 663,000 LUTs, the XCKU115-L1FLVA1517I supports highly complex design implementations. This level of density allows engineers to consolidate multiple functions onto a single chip, reducing board space and BOM cost by up to 60% compared to previous-generation devices.
DSP Performance for Signal Processing
The device integrates 5,520 DSP slices, delivering up to 8.2 TeraMACs of DSP compute performance. This makes the XCKU115-L1FLVA1517I exceptionally well-suited for digital signal processing workloads such as radar signal processing, software-defined radio (SDR), and advanced medical imaging algorithms.
Low-Power -1L Speed Grade
The -1L speed grade is specifically screened for lower maximum static power. When operating at VCCINT = 0.90V, designers benefit from significantly reduced idle-state power — critical for thermally constrained environments. This variant achieves up to 40% lower power consumption compared to previous-generation Kintex FPGAs.
Next-Generation High-Speed Transceivers
Equipped with GTH transceivers operating at up to 16.3 Gb/s, the XCKU115-L1FLVA1517I enables high-bandwidth serial connectivity for applications including 100G Ethernet, PCIe Gen3, Interlaken, and OTN protocols. Multiple integrated PCIe Gen3 cores eliminate the need for external bridge devices.
Advanced UltraScale Architecture
The UltraScale architecture introduces ASIC-like clocking with fine-granular clock gating, next-generation routing, and 3D-on-3D IC capabilities. This architecture enables superior utilization compared to previous 7-series devices, providing up to a 2-speed-grade improvement at high utilization levels.
Industrial Temperature Rating
The “I” suffix confirms industrial-grade screening for operation between –40°C and +100°C, making this FPGA suitable for deployment in harsh environments including outdoor telecom equipment, industrial automation systems, and defense-adjacent applications.
XCKU115-L1FLVA1517I Applications
The XCKU115-L1FLVA1517I’s combination of logic density, DSP bandwidth, and transceiver performance makes it a versatile solution across multiple industries.
100G Networking & Data Center Applications
The XCKU115-L1FLVA1517I excels in line-rate packet processing for 100G networking equipment. Its high-speed GTH transceivers, combined with integrated PCIe Gen3 cores, support the demanding throughput requirements of data center switches, network interface cards (NICs), and SmartNICs.
DSP-Intensive Signal Processing
With 5,520 DSP slices and 8.2 TeraMACs compute capacity, this FPGA is a natural fit for:
- Software-defined radio (SDR) baseband processing
- Radar and electronic warfare signal processing
- Waveform generation and digital pre-distortion (DPD)
Medical Imaging Systems
Medical applications such as CT scanners, MRI reconstruction, and ultrasound beamforming demand real-time, high-throughput signal processing. The XCKU115-L1FLVA1517I provides the compute density and memory bandwidth needed to meet these requirements within strict power and thermal budgets.
8K/4K Video Processing
The device supports video processing pipelines for 8K and 4K video in broadcast infrastructure, video surveillance, and professional AV systems. Its DDR4 interface at 2400 Mb/s provides the external memory bandwidth required for multi-stream video buffering and processing.
Wireless Infrastructure
In heterogeneous wireless infrastructure — including 4G LTE, 5G NR massive MIMO, and Remote Radio Unit (RRU) designs — the XCKU115-L1FLVA1517I delivers the DSP performance and transceiver bandwidth needed for demanding beamforming and baseband implementations.
Power Considerations
The XCKU115-L1FLVA1517I is designed with power efficiency as a priority. Key power-related details include:
| Power Parameter |
Detail |
| VCCINT Operating Voltage |
0.90V or 0.95V (selectable) |
| Power Reduction vs. Previous Gen |
Up to 40% lower |
| Fine-Granular Clock Gating |
Supported via UltraScale clocking architecture |
| Power Estimation Tool |
Xilinx Power Estimator (XPE) recommended |
| Temperature Grade |
Industrial (–40°C to +100°C) |
Designers should use the Xilinx Power Estimator (XPE) tool in conjunction with Vivado Design Suite to accurately estimate power consumption for specific design configurations.
Design Tool Support
The XCKU115-L1FLVA1517I is fully supported by the Vivado Design Suite, Xilinx’s flagship design environment. Vivado provides:
- RTL synthesis and advanced implementation algorithms
- Timing closure with UltraScale-optimized place and route
- IP Integrator for block-level design entry
- Integrated simulation and debugging tools (ChipScope/ILA)
- Bitstream generation and device programming
The -1L speed grade device is listed within Vivado as -1LV when operating at VCCINT = 0.90V, distinguishing it from the standard -1 performance profile.
Ordering Information
| Field |
Detail |
| Manufacturer Part Number |
XCKU115-L1FLVA1517I |
| Manufacturer |
AMD (Xilinx) |
| Product Category |
FPGA – Field Programmable Gate Array |
| Package |
1517-Pin FCBGA |
| Temperature Grade |
Industrial (–40°C to +100°C) |
| RoHS Status |
RoHS Compliant |
| Lead-Free |
Yes |
| NCNR Status |
Non-Cancellable, Non-Returnable (NCNR) — confirm with distributor |
Note: The XCKU115-L1FLVA1517I is a high-complexity IC. Always source from authorized distributors to ensure product authenticity, warranty coverage, and full traceability.
Frequently Asked Questions (FAQ)
What is the difference between XCKU115-L1FLVA1517I and XCKU115-1FLVA1517I?
The L1 variant (XCKU115-L1FLVA1517I) is screened for lower static power and supports dual VCCINT operation at 0.90V or 0.95V. The standard -1 variant (XCKU115-1FLVA1517I) operates at a fixed 0.95V VCCINT. The -1L at 0.95V performs equivalently to the -1, while at 0.90V it provides power savings with a slight performance reduction.
What package does the XCKU115-L1FLVA1517I use?
It uses a 1517-pin FCBGA (Fine-Pitch Ceramic Ball Grid Array) package, designated as FLVA1517 in the part number.
Is the XCKU115-L1FLVA1517I suitable for industrial environments?
Yes. The “I” suffix in the part number confirms an industrial temperature rating of –40°C to +100°C, making it suitable for industrial automation, outdoor telecom, and other thermally demanding deployments.
What design tools support the XCKU115-L1FLVA1517I?
The device is fully supported by Xilinx Vivado Design Suite. Legacy ISE design tools do not support UltraScale devices.
What are common alternatives to the XCKU115-L1FLVA1517I?
Close alternatives within the Kintex UltraScale family include:
- XCKU115-1FLVA1517I — Standard -1 speed grade, same package
- XCKU115-2FLVA1517I — Higher -2 speed grade, same package
- XCKU115-L1FLVB1760I — Same device, larger 1760-pin package for more I/O
Summary
The XCKU115-L1FLVA1517I is one of the most capable mid-range FPGAs available in the Kintex UltraScale family. Its combination of over 1.16 million logic cells, 5,520 DSP slices, 16G-capable GTH transceivers, and a low-power -1L speed grade make it an ideal solution for engineers targeting 100G networking, advanced DSP, medical imaging, and wireless infrastructure applications. Built on 20nm technology and housed in a 1517-pin FCBGA package with industrial temperature screening, the XCKU115-L1FLVA1517I delivers the performance, power efficiency, and reliability required by today’s most demanding electronic systems.
