The XCKU115-3FLVA1517E is a high-performance programmable logic device from AMD Xilinx, belonging to the Kintex UltraScale family. Designed for compute-intensive applications requiring massive parallel processing, this FPGA delivers exceptional DSP throughput, high logic density, and advanced memory bandwidth — all within a power-efficient architecture. Whether you’re building signal processing systems, machine learning accelerators, or high-speed networking infrastructure, the XCKU115-3FLVA1517E is engineered to meet demanding design requirements.
What Is the XCKU115-3FLVA1517E?
The XCKU115-3FLVA1517E is a Kintex UltraScale FPGA manufactured by AMD (formerly Xilinx). It is packaged in a 1517-pin FCBGA (Flip Chip Ball Grid Array) package using the FLVA1517 form factor. The “-3E” speed grade indicates a commercial-grade, enhanced performance variant optimized for higher clock frequencies and lower power consumption compared to standard speed grades.
As one of the largest devices in the Kintex UltraScale series, the XCKU115 sits just below the Virtex UltraScale family in terms of logic capacity, making it an ideal choice for engineers who need premium performance without the premium price tag of Virtex-class devices.
For a broader selection of programmable logic solutions, explore our full range of Xilinx FPGA products.
XCKU115-3FLVA1517E Key Specifications
General Device Information
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-3FLVA1517E |
| Family |
Kintex UltraScale |
| Series |
KU115 |
| Speed Grade |
-3E (Enhanced Commercial) |
| Package Type |
FCBGA (Flip Chip BGA) |
| Package / Case |
1517-FBGA |
| Operating Temperature |
0°C ~ 85°C (Commercial) |
| RoHS Compliance |
Yes |
Logic & Programmable Resources
| Resource |
Quantity |
| Logic Cells |
1,143,000 |
| CLB Flip-Flops |
663,360 |
| CLB LUTs |
331,680 |
| LUT as Logic |
331,680 |
| LUT as Memory |
128,160 |
| CLBs |
51,840 |
| Max Distributed RAM |
34.6 Mb |
Memory Resources
| Memory Type |
Capacity |
| Block RAM (BRAM) Tiles |
2,160 |
| Block RAM (36K each) |
75.9 Mb |
| UltraRAM (URAM) Blocks |
0 |
| Total On-Chip Memory |
~75.9 Mb |
Note: The XCKU115 does not include UltraRAM (URAM) blocks — those are exclusive to the UltraScale+ generation. However, the density of BRAM tiles still supports large on-chip data buffering for streaming and burst workloads.
DSP & Signal Processing
| DSP Parameter |
Value |
| DSP48E2 Slices |
5,520 |
| Peak DSP Performance |
8,900 GMACs |
| Fixed-Point Multiply Accumulate |
Yes |
| Floating Point Support |
Via DSP + Logic |
The 5,520 DSP48E2 slices make the XCKU115-3FLVA1517E exceptionally well-suited for radar signal processing, software-defined radio (SDR), image processing pipelines, and neural network inference workloads.
I/O and Connectivity
| I/O Parameter |
Value |
| Total User I/O Pins |
788 |
| HP (High Performance) I/O Banks |
16 |
| HR (High Range) I/O Banks |
0 |
| Maximum LVDS Pairs |
380 |
| GTH Transceivers |
80 |
| GTH Line Rate (Max) |
16.3 Gbps |
| GTY Transceivers |
0 |
| PCIE Hard Blocks |
4 (Gen3 x8) |
| 100G Ethernet MACs |
2 |
| Interlaken |
Yes |
Power and Clocking
| Parameter |
Value |
| CMTs (Clock Management Tiles) |
20 |
| PLLs |
40 |
| MMCMs |
20 |
| Core Supply Voltage (VCCINT) |
0.95V |
| I/O Supply Voltage (VCCO) |
1.0V – 3.3V |
XCKU115-3FLVA1517E Package Details
The FLVA1517 package (Flip Chip Low Profile BGA, 1517 balls) is designed for PCB-level integration with a ball pitch of 1.0mm. This package format balances I/O density with manageable PCB routing complexity.
| Package Attribute |
Detail |
| Package Designator |
FLVA1517 |
| Ball Count |
1517 |
| Ball Pitch |
1.0 mm |
| Package Body Size |
45 mm × 45 mm |
| Mounting Type |
Surface Mount |
| Thermal Resistance (θJA) |
Refer to AMD datasheet |
Speed Grade “-3E” Explained
What Does the Speed Grade Mean?
The -3E designation in XCKU115-3FLVA1517E breaks down as follows:
| Segment |
Meaning |
-3 |
Speed grade 3 — highest performance in the commercial range |
E |
Enhanced — tighter timing margins, better performance vs. standard -3 |
The “-3E” speed grade offers the fastest timing characteristics in the commercial temperature range (0°C to 85°C), making it the preferred choice for designs requiring maximum clock frequency and minimum propagation delays.
XCKU115-3FLVA1517E: Top Use Cases and Applications
#### High-Performance Computing (HPC)
The XCKU115’s combination of 5,520 DSP slices and 788 user I/O pins makes it ideal for building custom compute accelerators for data centers and research clusters.
#### Software-Defined Radio (SDR) and Radar
With high-speed GTH transceivers running up to 16.3 Gbps and deep DSP resources, this FPGA supports wideband digital signal processing, beamforming, and real-time radar processing.
#### 100G Networking and Packet Processing
Two hardened 100G Ethernet MACs and Interlaken IP support make the XCKU115 a natural fit for line-rate packet inspection, network function virtualization (NFV), and SmartNIC designs.
#### Machine Learning and AI Inference
The dense CLB and DSP fabric allows implementation of custom neural network inference engines, particularly for convolutional neural networks (CNNs) and recurrent models.
#### Medical Imaging and Video Processing
High logic density and parallel I/O enable real-time 4K/8K video pipelines, CT/MRI image reconstruction, and LIDAR point-cloud processing.
#### Aerospace and Defense
The commercial-grade XCKU115-3FLVA1517E is often used in lab development environments targeting rad-tolerant or mil-aero applications before migrating to screened parts.
XCKU115-3FLVA1517E vs. Similar Kintex UltraScale FPGAs
| Feature |
XCKU060 |
XCKU095 |
XCKU115 |
XCKU115+ |
| Logic Cells |
726,000 |
1,141,000 |
1,143,000 |
1,143,000 |
| DSP48E2 Slices |
2,760 |
4,320 |
5,520 |
5,520 |
| BRAM (Mb) |
38 Mb |
65.9 Mb |
75.9 Mb |
75.9 Mb |
| GTH Transceivers |
32 |
48 |
80 |
80 |
| 100G Ethernet |
0 |
1 |
2 |
2 |
| PCIe Gen |
Gen3 x8 |
Gen3 x8 |
Gen3 x8 ×4 |
Gen3 x8 ×4 |
| UltraRAM |
No |
No |
No |
Yes |
The XCKU115 represents the top of the Kintex UltraScale line, offering the highest I/O count, transceiver count, and DSP capacity within this non-UltraScale+ family.
Ordering and Availability
Part Number Breakdown
| Field |
Code |
Meaning |
| Family |
XC |
Xilinx FPGA |
| Sub-Family |
KU |
Kintex UltraScale |
| Device |
115 |
Density code |
| Speed Grade |
-3 |
Commercial high-speed |
| Package |
FLVA |
Flip Chip, Low Profile, BGA |
| Ball Count |
1517 |
1517-pin BGA |
| Temp / Variant |
E |
Enhanced commercial (0–85°C) |
Compliant Standards
- RoHS Compliant: Yes
- REACH Compliant: Yes
- Halogen-Free Options: Available via Xilinx ordering codes
Design Support and Development Tools
AMD (Xilinx) provides a comprehensive ecosystem for the XCKU115-3FLVA1517E:
| Tool |
Purpose |
| Vivado Design Suite |
RTL synthesis, implementation, bitstream generation |
| Vitis HLS |
High-Level Synthesis (C/C++/OpenCL to HDL) |
| Vitis AI |
Neural network inference deployment on FPGA |
| ChipScope Pro |
In-system debugging and signal analysis |
| PetaLinux |
Embedded Linux for processor subsystems |
| IP Integrator |
Block design and IP core integration |
Summary: Why Choose the XCKU115-3FLVA1517E?
The XCKU115-3FLVA1517E stands out as one of the most capable mid-to-high-range FPGAs available for commercial-grade applications. Its combination of:
- Over 1.1 million logic cells
- 5,520 DSP48E2 slices for extreme compute density
- 80 GTH transceivers for high-speed serial connectivity
- Dual 100G Ethernet MACs for network-intensive applications
- 788 user I/O pins for broad system integration
…makes it a go-to device for engineers designing in telecommunications, defense, HPC, video, and networking markets.
If your design demands the highest performance within the Kintex UltraScale family and requires a proven, production-ready FPGA with robust ecosystem support, the XCKU115-3FLVA1517E is the definitive choice.
