Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU115-2FLVF1924E: Xilinx Kintex UltraScale FPGA – Complete Product Guide

Product Details

The XCKU115-2FLVF1924E is a high-performance Field Programmable Gate Array (FPGA) from Xilinx (now AMD), belonging to the Kintex® UltraScale™ family. Built on advanced 20nm process technology, this device delivers an outstanding balance of processing power, logic density, and cost-efficiency — making it one of the most capable mid-range FPGAs available for demanding applications such as 100G networking, medical imaging, 8K4K video processing, and wireless infrastructure.

Whether you are an embedded systems engineer, FPGA developer, or procurement specialist, this guide covers everything you need to know about the XCKU115-2FLVF1924E — from its core specifications and key features to its target applications and ordering details.


What Is the XCKU115-2FLVF1924E?

The XCKU115-2FLVF1924E is part of the Xilinx FPGA Kintex UltraScale series — a family designed to offer the best price-to-performance-per-watt ratio at the 20nm node. The “XCKU115” designation refers to the Kintex UltraScale 115 device, while the suffix “-2FLVF1924E” encodes the speed grade (-2), package type (FLVF — Flip-Chip Fine-Line BGA), pin count (1924 pins), and temperature grade (E — Commercial/Extended).

Key Identifier Breakdown

Code Segment Meaning
XC Xilinx Commercial Device
KU Kintex UltraScale Family
115 Device Size (largest in Kintex UltraScale)
-2 Speed Grade (mid-range; higher = faster)
FLVF Flip-Chip Low-Voltage Fine-pitch BGA
1924 Pin Count (1924 balls)
E Temperature Grade: Commercial/Extended (0°C to +100°C)

XCKU115-2FLVF1924E Full Technical Specifications

Core Logic Resources

Parameter Value
Logic Cells 1,451,100
CLB Logic Blocks 663,360
CLB Flip-Flops 1,326,720
CLB LUTs 663,360
Distributed RAM (Kb) 22,368
Max Fabric Frequency 725 MHz
Technology Node 20nm

Memory Resources

Memory Type Capacity
Block RAM (Total Bits) 77,721,600 bits (~77.7 Mb)
Block RAM Tiles 936
UltraRAM Blocks N/A (UltraRAM is Kintex UltraScale+)

DSP and Arithmetic

Parameter Value
DSP Slices 5,520
Peak DSP Performance High-bandwidth signal processing

I/O and Connectivity

Parameter Value
Total User I/O 728
GTH Transceivers 64
Max Transceiver Speed Up to 16.3 Gb/s (GTH)
I/O Standards Supported LVCMOS, LVDS, HSTL, SSTL, and more
MMCM (Mixed-Mode Clock Managers) Yes
PLL Yes

Package and Electrical

Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code FLVF1924
Pin Count 1924
Supply Voltage (VCCINT) 0.922V – 0.979V (nominally 0.95V)
Temperature Range 0°C to +100°C (Commercial/Extended)
RoHS Compliant Yes

Configuration and Security

Feature Details
Configuration Interfaces JTAG, SPI, SelectMAP, ICAP
Security AES-256 bitstream encryption
Partial Reconfiguration Supported
Compression Bitstream compression supported

XCKU115-2FLVF1924E Key Features

#### Ultra-High Logic Density

With over 1.45 million logic cells and 663,360 CLB LUTs, the XCKU115-2FLVF1924E is the largest device in the Kintex UltraScale family. This makes it ideal for designs that require massive parallel processing, deep pipeline structures, or large control plane logic.

#### High-Speed Serial Transceivers

The device integrates 64 GTH transceivers capable of running at up to 16.3 Gb/s per lane, enabling support for industry-standard protocols including PCIe Gen3, 100GbE, Interlaken, JESD204B, and Aurora. This is critical for data center, networking, and high-bandwidth instrumentation applications.

#### Exceptional DSP Signal Processing Bandwidth

With 5,520 DSP slices, the XCKU115-2FLVF1924E delivers the highest DSP throughput in a mid-range FPGA family. The UltraScale DSP48E2 primitive supports cascading, pre-adders, and 27×18 multipliers, making it highly efficient for FIR filters, FFTs, matrix operations, and machine learning inference pipelines.

#### Monolithic and SSI Technology

The XCKU115 utilizes Stacked Silicon Interconnect (SSI) technology, where multiple super-logic regions (SLRs) are integrated into a single package using micro-bumps and interposer technology. This provides the logic density of a larger die while maintaining manufacturing yield and power efficiency.

#### Advanced Clocking with MMCM and PLL

Multiple MMCMs (Mixed-Mode Clock Managers) and PLLs allow precise clock generation, frequency synthesis, deskew, and phase adjustment — essential for multi-domain designs and high-speed I/O timing closure.

#### UltraScale Architecture ASIC-Like Clocking

The UltraScale architecture adopts ASIC-style clocking methodology with fine-grained clock gating, delivering up to 40% lower power compared to previous Xilinx FPGA generations.

#### Vivado Design Suite Compatibility

The XCKU115-2FLVF1924E is fully supported by the Xilinx Vivado Design Suite, which provides synthesis, implementation, IP integration (Vivado IP Integrator), simulation, and hardware debugging tools — enabling faster design closure and easier migration from 7-series devices.


Target Applications for XCKU115-2FLVF1924E

The XCKU115-2FLVF1924E is purpose-built for compute- and I/O-intensive workloads. Below are the primary application domains where this device excels:

#### 100G Networking and Data Center

The GTH transceivers and large logic fabric make this FPGA ideal for 100GbE line cards, network switches, SmartNICs, and packet processing engines. It supports complex traffic management, deep packet inspection (DPI), and hardware-accelerated encryption.

#### Medical Imaging and Diagnostics

High DSP count and parallel data processing make the XCKU115-2FLVF1924E suitable for CT scanners, MRI signal reconstruction, ultrasound beam forming, and other real-time image processing pipelines where latency and precision are critical.

#### 8K4K Video Processing

With its massive DSP and memory resources, the device supports 8K and 4K video pipelines including color space conversion, scaling, frame synchronization, HEVC/H.265 encoding acceleration, and real-time video analytics.

#### Wireless Infrastructure (5G/LTE)

The FPGA’s combination of high-speed transceivers, DSP slices, and programmable logic makes it ideal for baseband processing in 5G NR and LTE base stations, supporting massive MIMO, beamforming, and JESD204B-connected RF transceivers.

#### High-Performance Computing (HPC)

Used in FPGA acceleration cards (such as those from Xilinx, Bittware, and Nallatech), the XCKU115 enables hardware-accelerated workloads including genomics, financial analytics, and neural network inference at the edge of the data center.

#### Test and Measurement (T&M)

Logic analyzers, protocol analyzers, high-speed ADC/DAC interfacing, and automated test equipment (ATE) benefit from the device’s large I/O count and transceiver density.


Application Summary Table

Application Area Key FPGA Features Used
100G Networking GTH Transceivers, PCIe, large logic fabric
Medical Imaging DSP slices, Block RAM, parallel processing
8K/4K Video DSP, BRAM, high-bandwidth I/O
5G Wireless Infrastructure GTH (JESD204B), DSP, MMCM
HPC Acceleration Full logic fabric, PCIe Gen3
Test & Measurement I/O density, transceivers, clocking

XCKU115-2FLVF1924E vs. Related Part Numbers

Xilinx uses a systematic naming convention. Here is how the XCKU115-2FLVF1924E compares to similar variants:

Part Number Speed Grade Package Pins Temp Grade
XCKU115-1FLVF1924C -1 (slower) FLVF 1924 Commercial
XCKU115-2FLVF1924E -2 (standard) FLVF 1924 Extended
XCKU115-2FLVF1924I -2 (standard) FLVF 1924 Industrial
XCKU115-3FLVF1924E -3 (fastest) FLVF 1924 Extended
XCKU115-2FLVD1924E -2 (standard) FLVD 1924 Extended
XCKU115-2FLVB2104E -2 (standard) FLVB 2104 Extended

Tip: The “-2” speed grade represents the standard commercial performance bin. Choose “-3” for maximum timing margin or “-1” for lower-cost designs with relaxed timing. Use the “I” suffix (Industrial) if your operating environment extends below 0°C.


Ordering Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Part Number XCKU115-2FLVF1924E
DigiKey Part Number 7604486
Product Category Embedded – FPGAs (Field Programmable Gate Array)
RoHS Status RoHS Compliant
Packaging Tray
Minimum Order Quantity Consult distributor

Design Tools and Support Resources

Resource Description
Vivado Design Suite Primary design environment (synthesis, P&R, debug)
Xilinx Power Estimator (XPE) Power analysis and estimation tool
Xilinx IP Catalog Pre-verified IP cores (PCIe, Ethernet, DDR4, etc.)
UltraFast Design Methodology Xilinx’s best-practice guide for UltraScale designs
DS892 Datasheet Kintex UltraScale DC and AC Characteristics
PG054 / UG576 GTH Transceiver User Guide
KCU105 Evaluation Kit Development board for Kintex UltraScale prototyping

Frequently Asked Questions (FAQ)

Q: What is the difference between Kintex UltraScale and Kintex UltraScale+? The Kintex UltraScale is based on a 20nm process node, while Kintex UltraScale+ uses a 16nm FinFET process, adding UltraRAM blocks, improved DSP48E2 primitives, and better power efficiency. The XCKU115 is part of the original 20nm UltraScale family.

Q: Is the XCKU115-2FLVF1924E footprint-compatible with Virtex UltraScale devices? Yes. One of the key advantages of the UltraScale architecture is footprint compatibility between Kintex UltraScale and Virtex UltraScale devices in the same package, enabling scalability without PCB redesign.

Q: What voltage does the XCKU115-2FLVF1924E require? The core VCCINT supply operates between 0.922V and 0.979V (nominally 0.95V). Additional supplies are required for I/O banks (VCCO), auxiliary power (VCCAUX), and transceiver supplies. Consult the DS892 datasheet for complete power supply requirements.

Q: Can I use partial reconfiguration with this device? Yes. The XCKU115-2FLVF1924E fully supports partial reconfiguration (PR) through the Vivado Design Suite, allowing portions of the FPGA fabric to be reprogrammed at runtime without disrupting the rest of the design.

Q: What EDA tools are compatible with this device? The device is supported by Xilinx Vivado Design Suite (recommended), as well as third-party tools including Mentor Questa, Synopsys Synplify, and Cadence tools through appropriate IP export flows.


Summary

The XCKU115-2FLVF1924E is an enterprise-grade FPGA delivering exceptional logic density (1.45M cells), high-speed serial connectivity (64× GTH transceivers at 16.3 Gb/s), and massive DSP performance (5,520 DSP slices) — all within a proven 20nm UltraScale architecture. Its 1924-pin FCBGA package, commercial/extended temperature rating, and full Vivado ecosystem support make it the FPGA of choice for engineers targeting 100G networking, 5G wireless, advanced medical imaging, 8K video, and high-performance computing acceleration platforms.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.