The XCKU115-2FLVF1924E is a high-performance Field Programmable Gate Array (FPGA) from Xilinx (now AMD), belonging to the Kintex® UltraScale™ family. Built on advanced 20nm process technology, this device delivers an outstanding balance of processing power, logic density, and cost-efficiency — making it one of the most capable mid-range FPGAs available for demanding applications such as 100G networking, medical imaging, 8K4K video processing, and wireless infrastructure.
Whether you are an embedded systems engineer, FPGA developer, or procurement specialist, this guide covers everything you need to know about the XCKU115-2FLVF1924E — from its core specifications and key features to its target applications and ordering details.
What Is the XCKU115-2FLVF1924E?
The XCKU115-2FLVF1924E is part of the Xilinx FPGA Kintex UltraScale series — a family designed to offer the best price-to-performance-per-watt ratio at the 20nm node. The “XCKU115” designation refers to the Kintex UltraScale 115 device, while the suffix “-2FLVF1924E” encodes the speed grade (-2), package type (FLVF — Flip-Chip Fine-Line BGA), pin count (1924 pins), and temperature grade (E — Commercial/Extended).
Key Identifier Breakdown
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 115 |
Device Size (largest in Kintex UltraScale) |
| -2 |
Speed Grade (mid-range; higher = faster) |
| FLVF |
Flip-Chip Low-Voltage Fine-pitch BGA |
| 1924 |
Pin Count (1924 balls) |
| E |
Temperature Grade: Commercial/Extended (0°C to +100°C) |
XCKU115-2FLVF1924E Full Technical Specifications
Core Logic Resources
| Parameter |
Value |
| Logic Cells |
1,451,100 |
| CLB Logic Blocks |
663,360 |
| CLB Flip-Flops |
1,326,720 |
| CLB LUTs |
663,360 |
| Distributed RAM (Kb) |
22,368 |
| Max Fabric Frequency |
725 MHz |
| Technology Node |
20nm |
Memory Resources
| Memory Type |
Capacity |
| Block RAM (Total Bits) |
77,721,600 bits (~77.7 Mb) |
| Block RAM Tiles |
936 |
| UltraRAM Blocks |
N/A (UltraRAM is Kintex UltraScale+) |
DSP and Arithmetic
| Parameter |
Value |
| DSP Slices |
5,520 |
| Peak DSP Performance |
High-bandwidth signal processing |
I/O and Connectivity
| Parameter |
Value |
| Total User I/O |
728 |
| GTH Transceivers |
64 |
| Max Transceiver Speed |
Up to 16.3 Gb/s (GTH) |
| I/O Standards Supported |
LVCMOS, LVDS, HSTL, SSTL, and more |
| MMCM (Mixed-Mode Clock Managers) |
Yes |
| PLL |
Yes |
Package and Electrical
| Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FLVF1924 |
| Pin Count |
1924 |
| Supply Voltage (VCCINT) |
0.922V – 0.979V (nominally 0.95V) |
| Temperature Range |
0°C to +100°C (Commercial/Extended) |
| RoHS Compliant |
Yes |
Configuration and Security
| Feature |
Details |
| Configuration Interfaces |
JTAG, SPI, SelectMAP, ICAP |
| Security |
AES-256 bitstream encryption |
| Partial Reconfiguration |
Supported |
| Compression |
Bitstream compression supported |
XCKU115-2FLVF1924E Key Features
#### Ultra-High Logic Density
With over 1.45 million logic cells and 663,360 CLB LUTs, the XCKU115-2FLVF1924E is the largest device in the Kintex UltraScale family. This makes it ideal for designs that require massive parallel processing, deep pipeline structures, or large control plane logic.
#### High-Speed Serial Transceivers
The device integrates 64 GTH transceivers capable of running at up to 16.3 Gb/s per lane, enabling support for industry-standard protocols including PCIe Gen3, 100GbE, Interlaken, JESD204B, and Aurora. This is critical for data center, networking, and high-bandwidth instrumentation applications.
#### Exceptional DSP Signal Processing Bandwidth
With 5,520 DSP slices, the XCKU115-2FLVF1924E delivers the highest DSP throughput in a mid-range FPGA family. The UltraScale DSP48E2 primitive supports cascading, pre-adders, and 27×18 multipliers, making it highly efficient for FIR filters, FFTs, matrix operations, and machine learning inference pipelines.
#### Monolithic and SSI Technology
The XCKU115 utilizes Stacked Silicon Interconnect (SSI) technology, where multiple super-logic regions (SLRs) are integrated into a single package using micro-bumps and interposer technology. This provides the logic density of a larger die while maintaining manufacturing yield and power efficiency.
#### Advanced Clocking with MMCM and PLL
Multiple MMCMs (Mixed-Mode Clock Managers) and PLLs allow precise clock generation, frequency synthesis, deskew, and phase adjustment — essential for multi-domain designs and high-speed I/O timing closure.
#### UltraScale Architecture ASIC-Like Clocking
The UltraScale architecture adopts ASIC-style clocking methodology with fine-grained clock gating, delivering up to 40% lower power compared to previous Xilinx FPGA generations.
#### Vivado Design Suite Compatibility
The XCKU115-2FLVF1924E is fully supported by the Xilinx Vivado Design Suite, which provides synthesis, implementation, IP integration (Vivado IP Integrator), simulation, and hardware debugging tools — enabling faster design closure and easier migration from 7-series devices.
Target Applications for XCKU115-2FLVF1924E
The XCKU115-2FLVF1924E is purpose-built for compute- and I/O-intensive workloads. Below are the primary application domains where this device excels:
#### 100G Networking and Data Center
The GTH transceivers and large logic fabric make this FPGA ideal for 100GbE line cards, network switches, SmartNICs, and packet processing engines. It supports complex traffic management, deep packet inspection (DPI), and hardware-accelerated encryption.
#### Medical Imaging and Diagnostics
High DSP count and parallel data processing make the XCKU115-2FLVF1924E suitable for CT scanners, MRI signal reconstruction, ultrasound beam forming, and other real-time image processing pipelines where latency and precision are critical.
#### 8K4K Video Processing
With its massive DSP and memory resources, the device supports 8K and 4K video pipelines including color space conversion, scaling, frame synchronization, HEVC/H.265 encoding acceleration, and real-time video analytics.
#### Wireless Infrastructure (5G/LTE)
The FPGA’s combination of high-speed transceivers, DSP slices, and programmable logic makes it ideal for baseband processing in 5G NR and LTE base stations, supporting massive MIMO, beamforming, and JESD204B-connected RF transceivers.
#### High-Performance Computing (HPC)
Used in FPGA acceleration cards (such as those from Xilinx, Bittware, and Nallatech), the XCKU115 enables hardware-accelerated workloads including genomics, financial analytics, and neural network inference at the edge of the data center.
#### Test and Measurement (T&M)
Logic analyzers, protocol analyzers, high-speed ADC/DAC interfacing, and automated test equipment (ATE) benefit from the device’s large I/O count and transceiver density.
Application Summary Table
| Application Area |
Key FPGA Features Used |
| 100G Networking |
GTH Transceivers, PCIe, large logic fabric |
| Medical Imaging |
DSP slices, Block RAM, parallel processing |
| 8K/4K Video |
DSP, BRAM, high-bandwidth I/O |
| 5G Wireless Infrastructure |
GTH (JESD204B), DSP, MMCM |
| HPC Acceleration |
Full logic fabric, PCIe Gen3 |
| Test & Measurement |
I/O density, transceivers, clocking |
XCKU115-2FLVF1924E vs. Related Part Numbers
Xilinx uses a systematic naming convention. Here is how the XCKU115-2FLVF1924E compares to similar variants:
| Part Number |
Speed Grade |
Package |
Pins |
Temp Grade |
| XCKU115-1FLVF1924C |
-1 (slower) |
FLVF |
1924 |
Commercial |
| XCKU115-2FLVF1924E |
-2 (standard) |
FLVF |
1924 |
Extended |
| XCKU115-2FLVF1924I |
-2 (standard) |
FLVF |
1924 |
Industrial |
| XCKU115-3FLVF1924E |
-3 (fastest) |
FLVF |
1924 |
Extended |
| XCKU115-2FLVD1924E |
-2 (standard) |
FLVD |
1924 |
Extended |
| XCKU115-2FLVB2104E |
-2 (standard) |
FLVB |
2104 |
Extended |
Tip: The “-2” speed grade represents the standard commercial performance bin. Choose “-3” for maximum timing margin or “-1” for lower-cost designs with relaxed timing. Use the “I” suffix (Industrial) if your operating environment extends below 0°C.
Ordering Information
| Attribute |
Detail |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCKU115-2FLVF1924E |
| DigiKey Part Number |
7604486 |
| Product Category |
Embedded – FPGAs (Field Programmable Gate Array) |
| RoHS Status |
RoHS Compliant |
| Packaging |
Tray |
| Minimum Order Quantity |
Consult distributor |
Design Tools and Support Resources
| Resource |
Description |
| Vivado Design Suite |
Primary design environment (synthesis, P&R, debug) |
| Xilinx Power Estimator (XPE) |
Power analysis and estimation tool |
| Xilinx IP Catalog |
Pre-verified IP cores (PCIe, Ethernet, DDR4, etc.) |
| UltraFast Design Methodology |
Xilinx’s best-practice guide for UltraScale designs |
| DS892 Datasheet |
Kintex UltraScale DC and AC Characteristics |
| PG054 / UG576 |
GTH Transceiver User Guide |
| KCU105 Evaluation Kit |
Development board for Kintex UltraScale prototyping |
Frequently Asked Questions (FAQ)
Q: What is the difference between Kintex UltraScale and Kintex UltraScale+? The Kintex UltraScale is based on a 20nm process node, while Kintex UltraScale+ uses a 16nm FinFET process, adding UltraRAM blocks, improved DSP48E2 primitives, and better power efficiency. The XCKU115 is part of the original 20nm UltraScale family.
Q: Is the XCKU115-2FLVF1924E footprint-compatible with Virtex UltraScale devices? Yes. One of the key advantages of the UltraScale architecture is footprint compatibility between Kintex UltraScale and Virtex UltraScale devices in the same package, enabling scalability without PCB redesign.
Q: What voltage does the XCKU115-2FLVF1924E require? The core VCCINT supply operates between 0.922V and 0.979V (nominally 0.95V). Additional supplies are required for I/O banks (VCCO), auxiliary power (VCCAUX), and transceiver supplies. Consult the DS892 datasheet for complete power supply requirements.
Q: Can I use partial reconfiguration with this device? Yes. The XCKU115-2FLVF1924E fully supports partial reconfiguration (PR) through the Vivado Design Suite, allowing portions of the FPGA fabric to be reprogrammed at runtime without disrupting the rest of the design.
Q: What EDA tools are compatible with this device? The device is supported by Xilinx Vivado Design Suite (recommended), as well as third-party tools including Mentor Questa, Synopsys Synplify, and Cadence tools through appropriate IP export flows.
Summary
The XCKU115-2FLVF1924E is an enterprise-grade FPGA delivering exceptional logic density (1.45M cells), high-speed serial connectivity (64× GTH transceivers at 16.3 Gb/s), and massive DSP performance (5,520 DSP slices) — all within a proven 20nm UltraScale architecture. Its 1924-pin FCBGA package, commercial/extended temperature rating, and full Vivado ecosystem support make it the FPGA of choice for engineers targeting 100G networking, 5G wireless, advanced medical imaging, 8K video, and high-performance computing acceleration platforms.