The XCKU115-2FLVD1924I is a high-performance field programmable gate array (FPGA) from AMD Xilinx, part of the flagship Kintex® UltraScale™ family. Designed for engineers and system architects who demand the best balance of price, performance, and power efficiency, this device is a cornerstone solution for 100G networking, advanced DSP workloads, medical imaging systems, and next-generation wireless infrastructure. Whether you are sourcing components for a new design or replacing an existing device, the XCKU115-2FLVD1924I delivers exceptional capability in a proven, production-ready package.

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What Is the XCKU115-2FLVD1924I?

The XCKU115-2FLVD1924I is a Xilinx FPGA built on the UltraScale architecture using a 20nm process node. It belongs to the XCKU115 device series — the largest and most resource-rich device within the Kintex UltraScale product line. The part number breaks down as follows:

This “I” suffix is critically important: the industrial temperature rating makes this device suitable for demanding environments beyond standard commercial-grade components.

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XCKU115-2FLVD1924I Key Specifications at a Glance

The following table summarizes the most important technical parameters for the XCKU115-2FLVD1924I, as documented by AMD Xilinx and verified across authorized distributor data sheets.

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Architecture and Technology Overview

## UltraScale Architecture: ASIC-Like Design at FPGA Flexibility

The XCKU115-2FLVD1924I is built on AMD’s UltraScale architecture, which is specifically engineered to behave more like an ASIC than a traditional FPGA. This means the device delivers significantly better performance efficiency, reduced routing congestion, and more predictable timing closure compared to prior-generation 7-series devices. The architecture incorporates advanced routing fabrics and optimized place-and-route algorithms co-designed with the Vivado™ Design Suite.

## Stacked Silicon Interconnect (SSI) Technology

The XCKU115 utilizes Stacked Silicon Interconnect (SSI) technology, enabling multiple silicon dies to be integrated into a single package with high-bandwidth, low-latency die-to-die interconnects. This technology allows the XCKU115 to scale beyond what is possible with a single monolithic die, dramatically increasing the total available logic, memory, and DSP resources without sacrificing signal integrity.

## 20nm Process Node: Performance and Power Efficiency

Fabricated on TSMC’s 20nm planar process, the XCKU115-2FLVD1924I achieves up to 40% lower power consumption compared to previous-generation 28nm Kintex-7 devices. The smaller geometry also enables higher operating frequencies while keeping thermal dissipation manageable, which is essential for high-density system designs.

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Logic and Compute Resources

### CLB and Flip-Flop Capacity

With 663,360 configurable logic block (CLB) look-up tables and 1,326,720 CLB flip-flops, the XCKU115-2FLVD1924I provides enormous compute capacity for complex state machines, control logic, and pipeline-heavy designs. This makes the device well-suited for applications that require millions of simultaneous logic operations.

### DSP Slices for High-Speed Signal Processing

The device integrates 5,520 DSP48E2 slices, making it one of the highest DSP-density mid-range FPGAs available. Each DSP slice supports high-speed multiply-accumulate operations, making the XCKU115 ideal for:

• Digital filtering (FIR, IIR)
• Fast Fourier Transform (FFT) engines
• Radar and LiDAR signal processing
• Software-defined radio (SDR) baseband processing
• Machine learning inference acceleration

### Block RAM for On-Chip Data Buffering

With 77,721,600 bits (approximately 9.7 MB) of on-chip Block RAM, the XCKU115-2FLVD1924I provides ample high-speed storage for data buffering, lookup tables, and FIFO queues — all without relying on off-chip memory for latency-sensitive operations.

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I/O and Connectivity

### 832 High-Performance User I/O Pins

The 1924-pin FCBGA package exposes up to 832 user I/O pins, organized across multiple I/O banks supporting a wide range of single-ended and differential I/O standards including LVDS, LVCMOS, and SSTL. This is essential for interfacing with high-speed ADCs, DACs, and other peripherals in data-intensive systems.

### Next-Generation GTH Transceivers

The XCKU115 family includes high-speed GTH serial transceivers capable of multi-gigabit data rates, supporting protocols such as:

### Clock Management: MMCM and PLL Resources

On-chip Mixed-Mode Clock Managers (MMCMs) and Phase-Locked Loops (PLLs) allow for precise clock generation, multiplication, division, and phase shifting — a requirement in virtually every complex FPGA design.

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Package and Environmental Details

### FCBGA-1924 Package

The 1924-ball Flip-Chip Ball Grid Array (FCBGA) package provides the highest I/O density of any XCKU115 package variant. Its flip-chip construction ensures excellent thermal performance and signal integrity at high switching speeds.

The footprint compatibility with Virtex UltraScale devices is a significant design advantage: it allows engineers to prototype on the more cost-effective Kintex device and scale up to Virtex without a PCB redesign.

### Industrial Temperature Grade (–40°C to 100°C)

The “I” suffix confirms industrial temperature grade operation, meaning the XCKU115-2FLVD1924I is tested and rated for junction temperatures from –40°C to 100°C. This makes it appropriate for:

• Industrial control and automation systems
• Military and aerospace (with appropriate qualification)
• Outdoor communications infrastructure
• Transportation and ruggedized computing platforms

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Target Applications

The XCKU115-2FLVD1924I is purpose-built for the following high-demand application categories:

### 100G Networking and Data Center

The combination of high-speed transceivers, large Block RAM, and massive DSP capacity makes this device a natural fit for line-rate packet processing at 100 Gigabit Ethernet speeds. It is widely deployed in network interface cards (NICs), smart switches, and data center acceleration platforms.

### Next-Generation Wireless Infrastructure (5G/LTE)

Wireless basestations and radio access networks require real-time DSP processing of complex waveforms. The XCKU115-2FLVD1924I’s 5,520 DSP slices and high transceiver bandwidth make it capable of processing multiple antenna streams simultaneously in both DFE (Digital Front End) and BBU (Baseband Unit) designs.

### Medical Imaging

High-resolution imaging systems such as MRI, CT, and ultrasound scanners demand real-time image reconstruction from massive raw data streams. The XCKU115 provides the logic density, Block RAM, and DSP throughput necessary for next-generation 8K4K medical video pipelines.

### Defense and Aerospace Signal Processing

With its industrial temperature rating and high computational density, the XCKU115-2FLVD1924I is well-positioned for radar, electronic warfare (EW), and secure communications applications where performance and environmental robustness are non-negotiable.

### High-Performance Computing (HPC) Acceleration

FPGA-based acceleration of HPC workloads — including genomics, financial risk modeling, and scientific simulation — benefits greatly from the large logic fabric, high memory bandwidth, and low-latency compute of the XCKU115 device.

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Comparison: XCKU115-2FLVD1924I vs. Related Variants

Engineers evaluating the XCKU115 family should be aware of closely related part numbers. The table below highlights key differences:

The XCKU115-2FLVD1924I is the preferred choice when maximum I/O count and industrial temperature range are both required in the 1924-pin footprint.

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Development and Design Tools

AMD’s Vivado™ Design Suite is the primary development environment for the XCKU115-2FLVD1924I, providing:

• HDL synthesis (VHDL and Verilog/SystemVerilog)
• Implementation (place and route)
• Timing analysis and constraint management
• IP integration with the Vivado IP Catalog
• High-Level Synthesis (HLS) via Vitis HLS

The device is fully supported in all current versions of Vivado, and evaluation board support is available through AMD’s KCU105 Kintex UltraScale FPGA Evaluation Kit.

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Ordering and Availability

Note: The XCKU115-2FLVD1924I is a high-complexity, high-value component. Lead times can be extended depending on market conditions. Always verify stock and availability with authorized distributors before committing to production schedules.

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Frequently Asked Questions (FAQ)

#### What does the “I” in XCKU115-2FLVD1924I mean?

The “I” suffix indicates Industrial temperature grade, meaning the device is rated for operation from –40°C to 100°C junction temperature. This distinguishes it from “E” (Extended: 0°C to 100°C) and “C” (Commercial: 0°C to 85°C) variants.

#### Is the XCKU115-2FLVD1924I footprint-compatible with Virtex UltraScale?

Yes. The FLVD1924 package footprint is shared between Kintex UltraScale and Virtex UltraScale families, enabling scalability without a board redesign.

#### What programming tool is used for the XCKU115-2FLVD1924I?

AMD’s Vivado Design Suite is the required tool for synthesis, implementation, and device programming. High-Level Synthesis is supported via Vitis HLS.

#### How many DSP slices does the XCKU115-2FLVD1924I contain?

The device contains 5,520 DSP48E2 slices, among the highest available in any mid-range FPGA.

#### What is the core voltage for the XCKU115-2FLVD1924I?

The VCCINT core voltage is nominally 0.95V, with an operating range of approximately 0.922V to 0.979V.

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Summary

The XCKU115-2FLVD1924I is one of the most capable mid-range FPGAs on the market today. Its combination of 1,451,100 system logic cells, 5,520 DSP slices, 77.7 Mbit of Block RAM, 832 user I/O pins, and industrial-grade temperature rating — all housed in a proven 1924-ball FCBGA package — makes it an excellent choice for engineers building demanding applications in networking, wireless, defense, medical imaging, and high-performance computing. Backed by AMD’s full Vivado tool chain and an extensive ecosystem of IP cores and reference designs, the XCKU115-2FLVD1924I provides a fast, reliable path from prototype to production.