Meta Description: The XCKU115-2FLVB1760E is a high-performance Xilinx Kintex UltraScale FPGA featuring 1,451,100 logic cells, 702 I/Os, and a 1760-pin FCBGA package. Learn full specs, features, and applications.
What Is the XCKU115-2FLVB1760E?
The XCKU115-2FLVB1760E is a field-programmable gate array (FPGA) manufactured by AMD Xilinx, belonging to the Kintex UltraScale family. Built on TSMC’s 20nm process node, this device is engineered for applications demanding the highest signal processing bandwidth in a mid-range FPGA platform. The part number breaks down as follows: XCKU115 (Kintex UltraScale 115 device), -2 (speed grade 2), FLVB (flip-chip low-voltage BGA), 1760 (1760-pin package), and E (commercial/extended temperature range).
Whether you are working on 100G networking, advanced DSP processing, medical imaging, 8K video pipelines, or heterogeneous wireless infrastructure, the XCKU115-2FLVB1760E offers an exceptional blend of performance, logic density, and cost efficiency. It is part of AMD Xilinx’s broader Xilinx FPGA portfolio, which spans from entry-level to the most demanding compute-intensive designs.
XCKU115-2FLVB1760E Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-2FLVB1760E |
| FPGA Family |
Kintex UltraScale |
| Process Technology |
20nm |
| Logic Cells |
1,451,100 |
| Macrocells / CLB LUTs |
663,360 LUTs |
| Total RAM Bits |
77,722 Kbits |
| DSP Slices |
5,520 |
| I/O Pins (User I/O) |
702 |
| Speed Grade |
-2 |
| Max Operating Frequency |
725 MHz |
| Supply Voltage (VCCINT) |
0.922 V – 0.979 V |
| Package |
FCBGA-1760 (FLVB1760) |
| Package Type |
Flip-Chip BGA |
| Number of Pins |
1,760 |
| Temperature Grade |
Commercial/Extended (E) |
| Operating Temperature |
0°C to +100°C (junction) |
| Clock Resources |
MMCM, PLL |
XCKU115-2FLVB1760E Detailed Feature Breakdown
## Logic and Programmable Resources
The XCKU115-2FLVB1760E packs 1,451,100 system logic cells into its silicon fabric, making it one of the highest-density devices in the Kintex UltraScale lineup. Its 663,360 6-input LUTs are organized into UltraScale CLBs (Configurable Logic Blocks), which deliver ASIC-like performance with improved routing efficiency compared to previous-generation 7-Series devices.
Key logic resources include:
| Resource |
Quantity |
| System Logic Cells |
1,451,100 |
| CLB LUTs |
663,360 |
| CLB Flip-Flops |
1,326,720 |
| DSP Slices (DSP48E2) |
5,520 |
| Block RAM (36K) |
2,160 |
| Block RAM (18K) |
4,320 |
| Total RAM Bits |
~77.7 Mbits |
| UltraRAM (288Kb) |
0 (XCKU115 uses BRAM) |
## I/O and Connectivity Resources
The XCKU115-2FLVB1760E provides 702 user-configurable I/O pins, supporting a wide range of single-ended and differential I/O standards. The device supports both HP (High Performance) and HR (High Range) I/O banks, enabling flexible interfacing to a variety of external components and memory types.
| I/O Feature |
Details |
| Total User I/Os |
702 |
| HP I/O Banks |
Yes – supports DCI termination |
| HR I/O Banks |
Yes |
| Differential I/O Pairs |
Supported (LVDS, LVDS_25, etc.) |
| I/O Standards Supported |
LVCMOS, LVDS, HSTL, SSTL, POD |
| Max Single-Ended I/O Voltage |
Up to 3.3V (HR banks) |
| On-Die Termination (ODT) |
Yes (HP banks) |
## Transceiver Capabilities
The Kintex UltraScale XCKU115 incorporates GTH transceivers — high-speed serial transceivers designed for multi-gigabit communication protocols. These enable connectivity for PCIe Gen3, 100G Ethernet, JESD204B, SRIO, and other high-bandwidth interfaces critical in data center, telecom, and instrumentation designs.
| Transceiver Feature |
Details |
| Transceiver Type |
GTH (16.3 Gbps max) |
| Number of GTH Transceivers |
32 |
| Max Line Rate |
16.375 Gbps |
| Supported Protocols |
PCIe Gen1/2/3, 100GE, JESD204B, CPRI, SRIO |
| PCIe Hard IP |
Yes – PCIe Gen3 x8 |
## Clocking Architecture
The XCKU115-2FLVB1760E features an advanced clocking infrastructure based on UltraScale architecture, supporting both MMCMs (Mixed-Mode Clock Managers) and PLLs (Phase-Locked Loops) for flexible frequency synthesis, phase alignment, and jitter filtering.
| Clock Resource |
Quantity |
| MMCMs |
20 |
| PLLs |
20 |
| Global Clock Buffers (BUFGCE) |
480 |
| Regional Clock Buffers |
240 |
## Memory Interface Resources
The XCKU115-2FLVB1760E supports high-bandwidth external memory interfaces through its HP I/O banks. It is optimized for interfacing with DDR4, DDR3, LPDDR4, QDR II+, and other memory technologies via the Xilinx Memory Interface Generator (MIG).
| Memory Interface |
Support |
| DDR4 SDRAM |
Yes |
| DDR3 / DDR3L |
Yes |
| LPDDR4 |
Yes |
| QDR II+ / RLDRAM 3 |
Yes |
| Max DDR4 Data Rate |
2,666 Mbps |
Package and Mechanical Information
The FLVB1760 package designation indicates a Flip-Chip Low-Voltage Ball Grid Array with 1,760 solder balls in a fine-pitch grid. This compact package format is critical for PCB area efficiency without sacrificing I/O density.
| Package Parameter |
Value |
| Package Code |
FLVB1760 |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Total Pins |
1,760 |
| Body Size |
45mm × 45mm |
| Ball Pitch |
1.0mm |
| Moisture Sensitivity Level (MSL) |
MSL 3 |
| RoHS Compliance |
Yes |
Operating Conditions and Electrical Specifications
| Electrical Parameter |
Min |
Typical |
Max |
| Core Supply Voltage (VCCINT) |
0.922V |
0.950V |
0.979V |
| Auxiliary Supply Voltage (VCCAUX) |
1.746V |
1.800V |
1.854V |
| I/O Supply Voltage (VCCO) |
1.14V |
— |
3.465V |
| Operating Temperature (Tj) |
0°C |
— |
100°C |
Part Number Decoding: XCKU115-2FLVB1760E
Understanding the XCKU115-2FLVB1760E part number is essential for procurement and design planning:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 115 |
Device Size (Highest in Kintex UltraScale) |
| -2 |
Speed Grade (-2 = mid-performance; -3 is fastest) |
| F |
Flip-Chip Package |
| LV |
Low Voltage |
| B |
Package Variant B |
| 1760 |
Number of Package Pins |
| E |
Commercial/Extended Temperature Grade |
XCKU115-2FLVB1760E vs. Similar Kintex UltraScale Devices
| Part Number |
Logic Cells |
I/Os |
Pins |
Speed Grade |
Temp Grade |
| XCKU115-2FLVB1760E |
1,451,100 |
702 |
1760 |
-2 |
Commercial |
| XCKU115-2FLVB1760I |
1,451,100 |
702 |
1760 |
-2 |
Industrial |
| XCKU115-1FLVB1760C |
1,451,100 |
702 |
1760 |
-1 |
Commercial |
| XCKU115-2FLVB2104E |
1,451,100 |
832 |
2104 |
-2 |
Commercial |
| XCKU085-2FLVB1760E |
1,160,880 |
702 |
1760 |
-2 |
Commercial |
Tip: The “E” suffix denotes the Commercial/Extended temperature grade, suitable for operating environments from 0°C to 100°C (junction). For harsher environments, consider the “I” (Industrial) variant rated to 125°C.
Key Advantages of the Kintex UltraScale Architecture
The XCKU115-2FLVB1760E benefits from Xilinx’s UltraScale architecture, which was purpose-built to close the gap between FPGAs and ASICs. Here are the standout advantages:
### ASIC-Like Clocking
UltraScale devices feature a routing architecture that eliminates dedicated clock rows, enabling ASIC-like clocking strategies. The result is a significant reduction in clock-related routing congestion and improved timing closure.
### Next-Generation DSP Performance
With 5,520 DSP48E2 slices, the XCKU115-2FLVB1760E is well-suited for floating-point arithmetic, FIR/IIR filter banks, FFT processing, and machine learning inference accelerators. The DSP48E2 supports pre-adder, multiplier, and accumulator chains at very high throughput.
### Advanced Memory Subsystem
The large on-chip block RAM pool (~77.7 Mbits) combined with support for DDR4 at 2666 Mbps enables sophisticated data buffering for high-throughput pipelines — critical in radar signal processing, video broadcast, and software-defined radio (SDR) designs.
### Up to 40% Lower Power vs. Previous Generation
Kintex UltraScale devices offer up to 40% lower power consumption compared to Kintex-7 FPGAs. Fine-grained clock gating and the 20nm process node together deliver exceptional power efficiency for power-constrained system designs.
### Footprint Compatibility with Virtex UltraScale
The FLVB1760 package is footprint-compatible with select Virtex UltraScale devices, allowing design teams to scale performance up or down within the same PCB layout — reducing NRE costs and accelerating time to market.
Typical Applications for XCKU115-2FLVB1760E
The XCKU115-2FLVB1760E is deployed across a wide range of high-performance application domains:
| Application Domain |
Use Case |
| Networking & Telecom |
100G/400G packet processing, line cards, OTN framing |
| Wireless Infrastructure |
LTE/5G base stations, Remote Radio Heads (RRH), DFE |
| Data Centers |
SmartNIC acceleration, FPGA-based compute offload |
| Defense & Aerospace |
Radar signal processing, SIGINT, ELINT systems |
| Medical Imaging |
CT, MRI, ultrasound reconstruction pipelines |
| Video & Broadcast |
8K video processing, HEVC encoding, vision AI |
| Test & Measurement |
Oscilloscopes, protocol analyzers, ATE systems |
| Scientific Computing |
HPC accelerators, real-time data acquisition |
Design Tools and Support
### Vivado Design Suite
The XCKU115-2FLVB1760E is fully supported by Xilinx Vivado Design Suite, which provides RTL synthesis, implementation, simulation, and bitstream generation. Vivado’s UltraFast Design Methodology is recommended for meeting timing closure on large XCKU115 designs.
### Xilinx Power Estimator (XPE)
Before finalizing power delivery networks, designers should use the Xilinx Power Estimator (XPE) tool to model static and dynamic power consumption. The XCKU115’s VCCINT nominal of 0.95V requires careful decoupling capacitor placement given the high current draw at full utilization.
### IP Core Ecosystem
AMD Xilinx offers a comprehensive IP core library through the Vivado IP Catalog, including:
- PCIe Gen3 endpoint and root complex IP
- 100G Ethernet MAC/PCS IP
- Memory Interface Generator (MIG) for DDR4
- JESD204B IP for ADC/DAC interfacing
- FPU and DSP acceleration IP
Ordering Information
| Field |
Value |
| Manufacturer Part Number |
XCKU115-2FLVB1760E |
| Manufacturer |
AMD / Xilinx |
| DigiKey Part Number |
1278-XCKU115-2FLVB1760E-ND |
| Product Category |
Embedded – FPGAs |
| RoHS Status |
RoHS Compliant |
| Export Control Classification (ECCN) |
3A991 (check current classification) |
| Minimum Order Quantity |
1 |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU115-2FLVB1760E and XCKU115-2FLVB1760I? The suffix “E” denotes the commercial/extended temperature grade (0°C to 100°C junction), while “I” designates industrial grade (–40°C to 125°C junction). All other specifications are identical.
Q: What speed grade is the XCKU115-2FLVB1760E? It is speed grade -2, which sits in the middle of the Kintex UltraScale speed range. The -3 grade offers the highest performance, while -1 and -1L offer lower power at reduced performance.
Q: Is the XCKU115-2FLVB1760E PCIe Gen3 capable? Yes. The device includes a hardened PCIe Gen3 x8 block, enabling high-bandwidth host interface connectivity without consuming FPGA fabric resources.
Q: What programming software does XCKU115-2FLVB1760E require? The XCKU115-2FLVB1760E requires Vivado Design Suite 2014.1 or later for synthesis and implementation. Xilinx JTAG-based configuration via Vivado Hardware Manager is the standard programming method.
Q: Can the XCKU115-2FLVB1760E be used in defense applications? Yes, it is commonly used in defense signal processing applications. For higher-reliability screening, consider XQKU115 (space/defense qualified) variants where applicable.
Conclusion
The XCKU115-2FLVB1760E represents one of the most capable mid-range FPGAs available for high-performance embedded and infrastructure applications. With over 1.45 million logic cells, 5,520 DSP slices, 702 I/Os, 32 GTH transceivers at 16.3 Gbps, and support for DDR4 at 2666 Mbps, this device from AMD Xilinx’s Kintex UltraScale family provides the processing bandwidth and programmable flexibility required by the most demanding modern designs — all within an efficient 20nm, 0.95V silicon platform.
For engineers looking to maximize performance within a cost-effective FPGA platform, the XCKU115-2FLVB1760E is an outstanding choice backed by Xilinx’s mature ecosystem and long-term IP support.
