The XCKU115-2FLVA1517I is a high-performance field programmable gate array from AMD’s Kintex® UltraScale™ family, built on an advanced 20nm process node. Designed for engineers who demand the best price-to-performance ratio in a mid-range FPGA, this device delivers exceptional DSP throughput, massive logic density, and next-generation transceiver technology — all in a compact 1517-pin FCBGA package. Whether your application involves 100G networking, data center acceleration, medical imaging, or wireless infrastructure, the XCKU115-2FLVA1517I is engineered to meet demanding system requirements.
What Is the XCKU115-2FLVA1517I?
The XCKU115-2FLVA1517I is a member of the Xilinx FPGA Kintex UltraScale product line — AMD’s flagship mid-range FPGA family. The part number breaks down as follows:
- XC – Xilinx Commercial product
- KU115 – Kintex UltraScale, device size 115 (largest in the KU series)
- -2 – Speed grade 2 (mid speed grade)
- FLVA – FCBGA low-voltage package variant
- 1517 – 1517 total pin count
- I – Industrial temperature range (–40°C to +100°C)
This industrial-grade variant is ideal for deployments in harsh environments where the commercial temperature range (0°C to 100°C) is insufficient.
XCKU115-2FLVA1517I Key Specifications
Core Technical Parameters
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU115-2FLVA1517I |
| FPGA Family |
Kintex® UltraScale™ |
| Process Technology |
20nm |
| System Logic Cells |
1,451,100 |
| CLB Logic Blocks |
663,360 |
| CLB Flip-Flops |
1,326,720 |
| Total RAM Bits |
77,721,600 (≈77.7 Mb) |
| Speed Grade |
-2 (Mid) |
| Package Type |
FCBGA (Flip Chip Ball Grid Array) |
| Package Designation |
FLVA1517 |
| Total Pin Count |
1,517 |
| User I/O Pins |
624 |
| Supply Voltage (VCCINT) |
0.922V – 0.979V |
| Operating Temperature |
–40°C to +100°C (Industrial) |
| RoHS Compliant |
Yes |
Memory & DSP Resources
| Resource |
Specification |
| Block RAM (36K blocks) |
High-density distributed configuration |
| Total Block RAM |
77,721,600 bits |
| UltraRAM (URAM) |
Available in UltraScale+ variant |
| DSP Slices |
High-ratio DSP architecture |
| DSP Compute Performance |
Up to 8.2 TeraMACs |
| DDR4 Interface Speed |
Up to 2400 Mb/s |
Clocking & Transceiver Specifications
| Feature |
Specification |
| MMCM (Mixed-Mode Clock Managers) |
Yes |
| PLL Blocks |
Yes |
| Maximum Clock Frequency |
725 MHz |
| GTH Transceivers |
Up to 64 per device |
| Transceiver Line Rate |
Up to 16 Gb/s (backplane capable) |
| Minimum Transceiver Rate |
12.5 Gb/s (slowest speed grade) |
| PCIe Interface |
Integrated PCIe® Gen3 cores |
Package & Electrical Characteristics
| Attribute |
Detail |
| Package |
1517-BBGA, FCBGA |
| Package Dimensions |
Compact BGA footprint |
| Number of Rows/Columns |
Fine-pitch ball grid |
| Core Voltage (VCCINT) |
0.922V – 0.979V |
| I/O Voltage |
Multi-standard, configurable |
| ESD Protection |
Built-in |
| Lead-Free |
Yes |
XCKU115-2FLVA1517I Architecture Overview
UltraScale Architecture Advantages
The XCKU115-2FLVA1517I is built on AMD’s UltraScale architecture — the first ASIC-class all-programmable architecture designed to enable multi-hundred Gbps levels of system performance. Key architectural innovations include next-generation routing fabrics, ASIC-like clocking networks, 3D-on-3D IC integration support, and advanced power reduction features.
Compared to previous-generation Xilinx 7-Series FPGAs, the UltraScale architecture delivers up to 40% lower power consumption while simultaneously boosting performance by up to two speed grades when operating at high utilization levels.
High Logic Density with 1.45 Million System Logic Cells
With 1,451,100 system logic cells, the XCKU115 is the largest device in the Kintex UltraScale family. This density, combined with 663,360 configurable logic blocks and over 1.3 million CLB flip-flops, enables engineers to implement highly complex designs — including full pipeline processors, hardware accelerators, and multi-protocol networking stacks — in a single device.
Advanced Transceiver Technology
The XCKU115-2FLVA1517I features next-generation GTH transceivers capable of up to 16 Gb/s line rates, making it fully backplane-capable. With support for up to 64 transceivers per device, this FPGA can handle multi-lane high-speed serial interfaces such as PCIe Gen3, 100 Gigabit Ethernet (100GbE), Interlaken, OTN, and JESD204B for RF data converter applications.
Target Applications for the XCKU115-2FLVA1517I
The XCKU115-2FLVA1517I is purpose-built for demanding, high-bandwidth workloads across multiple industries.
100G Networking and Data Center Infrastructure
This FPGA is a natural fit for line-card designs, packet classification engines, deep packet inspection (DPI), and network function virtualization (NFV) platforms. Its integrated PCIe Gen3 cores and 16G transceivers provide the backbone for 100G and beyond data center switching and routing applications.
DSP-Intensive Signal Processing
With 8.2 TeraMACs of DSP compute performance and a high DSP-to-logic ratio, the XCKU115-2FLVA1517I excels in digital predistortion (DPD), software-defined radio (SDR), radar signal processing, and OFDM modulation/demodulation. Its compatibility with JESD204B makes it a top choice for interfacing with high-speed ADCs and DACs in wireless infrastructure designs.
Medical Imaging Systems
Next-generation medical imaging equipment — including MRI reconstruction engines, CT scan processors, and ultrasound beamformers — demands both high compute density and real-time responsiveness. The XCKU115-2FLVA1517I provides the parallel processing fabric necessary to meet these requirements at clinical speeds.
8K/4K Professional Video Processing
For broadcast and video production systems, the XCKU115-2FLVA1517I supports real-time 8K and 4K video encoding, decoding, and transcoding pipelines. Its high I/O bandwidth and logic density accommodate multi-channel video processing with low latency.
Wireless Infrastructure (Heterogeneous Networks)
The device is ideally suited for remote radio heads (RRH), baseband units (BBU), and distributed radio access networks (D-RAN) where dense DSP compute, high-speed backhaul connectivity, and power efficiency are essential.
XCKU115-2FLVA1517I vs. Comparable Kintex UltraScale Devices
| Feature |
XCKU085-2FLVA1517I |
XCKU095-2FFVB1760I |
XCKU115-2FLVA1517I |
| System Logic Cells |
~938K |
~1.14M |
1,451,100 |
| Total RAM Bits |
~53.6 Mb |
~65.0 Mb |
77.7 Mb |
| User I/O Pins |
624 |
720 |
624 |
| Package Pin Count |
1,517 |
1,760 |
1,517 |
| Speed Grade |
-2 |
-2 |
-2 |
| Temperature |
Industrial |
Industrial |
Industrial |
| Process Node |
20nm |
20nm |
20nm |
The XCKU115 device offers the maximum logic density and RAM capacity available within the Kintex UltraScale portfolio in the 1517-pin package, making it the optimal choice when design complexity demands the most resources without stepping up to the larger Virtex UltraScale family.
Software Development: Vivado Design Suite Compatibility
The XCKU115-2FLVA1517I is fully supported by AMD’s Vivado® Design Suite, the industry-standard EDA tool for UltraScale and UltraScale+ FPGA development. Vivado provides a complete RTL-to-bitstream flow including synthesis, implementation, timing closure, and simulation. Its co-optimization with UltraScale devices enables faster design closure compared to legacy ISE-based flows.
Key Vivado capabilities relevant to this device include IP Integrator for block-based design, Partial Reconfiguration (PR) support, High-Level Synthesis (HLS) for C/C++ to HDL compilation, and integrated power analysis.
Ordering Information
| Parameter |
Details |
| Manufacturer Part Number |
XCKU115-2FLVA1517I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Category |
FPGA – Field Programmable Gate Array |
| Package |
1517-BBGA, FCBGA |
| Temperature Grade |
Industrial (–40°C to +100°C) |
| Speed Grade |
-2 |
| RoHS Status |
RoHS Compliant |
| ECCN |
Applicable – consult export compliance |
| Lifecycle Status |
Active |
Note: The XCKU115-2FLVA1517I is typically classified as Non-Cancellable, Non-Returnable (NCNR) due to its high-density, made-to-order nature. Confirm availability and lead times with your authorized distributor.
Frequently Asked Questions (FAQ)
What does the “I” suffix mean in XCKU115-2FLVA1517I?
The “I” at the end of the part number designates the industrial temperature range, meaning the device is rated for operation from –40°C to +100°C. The “E” suffix (as seen in the XCKU115-2FLVA1517E) indicates the commercial/extended temperature variant rated 0°C to +100°C.
What is the difference between the XCKU115-2FLVA1517I and XCKU115-1FLVA1517I?
The primary difference is the speed grade. The “-2” speed grade offers higher maximum operating frequency and better timing performance than the “-1” variant, at the cost of slightly higher power consumption. The “-2” grade is generally preferred for high-frequency signal processing pipelines.
Is the XCKU115-2FLVA1517I footprint compatible with Virtex UltraScale devices?
Yes. AMD designed the Kintex UltraScale and Virtex UltraScale families with footprint compatibility in the same package sizes, enabling engineers to scale up designs from Kintex to Virtex devices without PCB redesign — a significant advantage during product development.
What design tools support the XCKU115-2FLVA1517I?
The primary design tool is the Vivado Design Suite (version 2014.1 and later). AMD also supports the device in Vitis™ for high-level synthesis workflows and in Vitis AI for deploying neural network inference engines on FPGAs.
What transceiver protocols does the XCKU115-2FLVA1517I support?
The device supports a wide range of high-speed serial standards through its GTH transceivers, including PCIe Gen3, 100GbE/10GbE, OTN (Optical Transport Network), CPRI/eCPRI for wireless, JESD204B for RF data converters, Interlaken, and SATA/SAS storage protocols.
Summary
The XCKU115-2FLVA1517I represents the peak of the Kintex UltraScale family — combining 1.45 million system logic cells, 77.7 Mb of block RAM, 16 Gb/s transceivers, and industrial-grade thermal reliability in a proven 1517-pin FCBGA package. Its UltraScale architecture delivers ASIC-level performance efficiency with the flexibility only an FPGA can provide. From 100G data center switching to next-generation medical imaging and wireless infrastructure, this device is a proven platform for the most demanding programmable logic applications available today.