The XCKU115-1FLVF1924I is a high-capacity, industrial-grade Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the Kintex UltraScale family. Built on a 20nm process node using Stacked Silicon Interconnect (SSI) technology, this device delivers an exceptional balance of logic density, DSP throughput, and high-speed serial connectivity — making it a top choice for demanding applications in 100G networking, medical imaging, wireless infrastructure, and data centers.

If you are evaluating Xilinx FPGA solutions for your next design, the XCKU115-1FLVF1924I stands out as one of the largest devices in the Kintex UltraScale lineup, offering over 1.45 million logic cells in a production-ready, extended industrial temperature package.

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What Is the XCKU115-1FLVF1924I?

The part number breaks down as follows:

This FPGA is manufactured by AMD (formerly Xilinx) and is available from major authorized distributors including DigiKey (part number 7604480), Mouser, and Arrow Electronics.

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XCKU115-1FLVF1924I Key Specifications

General Device Overview

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Logic Resources

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I/O and Connectivity

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Configuration and Security

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XCKU115-1FLVF1924I Architecture Highlights

## SSI Technology for Maximum Capacity

The XCKU115-1FLVF1924I uses AMD’s Stacked Silicon Interconnect (SSI) technology, combining multiple silicon dies on a single passive interposer. This allows the KU115 to achieve logic densities that would be impossible in a monolithic die at the same process node — delivering over 1.45 million logic cells while maintaining manufacturing yield and cost efficiency.

## 20nm UltraScale Architecture

The Kintex UltraScale architecture is based on AMD’s ASIC-like clocking and routing structure. Key architectural advantages include:

• ASIC-like clocking with fine-grained clock gating reduces dynamic power consumption by up to 40% compared to previous-generation 28nm devices
• Cascade DSP slices support high-precision arithmetic operations at up to 741 GMACs of single-precision performance
• UltraRAM (available in UltraScale+ derivatives) — the KU115 uses block RAM with 75.9 Mb capacity, eliminating the need for external memory in many DSP-intensive workloads

## GTH Transceivers for High-Speed Serial Links

The 64 integrated GTH transceivers operate at line rates from 500 Mb/s up to 16.3 Gb/s per lane. Each transceiver quad shares a programmable PLL, enabling highly flexible clocking schemes. Supported protocols include:

• 100G Ethernet (IEEE 802.3ba)
• OTU4 / OTU3 (OTN)
• PCIe Gen3 ×8 / ×16
• JESD204B (data converter interface)
• CPRI / eCPRI (wireless fronthaul)
• Interlaken

## PCIe Gen3 Hard IP

Four integrated PCIe Gen3 hard blocks provide high-bandwidth host connectivity with minimal logic overhead. Each block supports up to ×8 link width, with endpoint and root-port modes supported via AMD’s Vivado IP integrator.

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Pin Package Information: 1924-Pin FCBGA

The FLVF1924 package is a 1,924-ball Flip-Chip Ball Grid Array with a low-voltage profile. Key package attributes:

The “F1924” footprint is compatible with other UltraScale family devices sharing the same package designator, simplifying hardware migration across device densities without PCB redesign.

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Speed Grade -1: What It Means for Your Design

The -1 speed grade is the slowest (and most power-efficient) speed option in the Kintex UltraScale family. This grade is ideal for:

• Designs that do not require the absolute highest clock frequencies
• Power-sensitive applications where thermal envelope is a constraint
• Cost-optimized production where -2 or -3 performance is not required

Typical maximum fabric clock frequencies at speed grade -1 are approximately 600–630 MHz, depending on the logic function and routing complexity.

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Industrial Temperature Rating: -40°C to +100°C

The “I” suffix designates the industrial temperature variant, screened and guaranteed to operate reliably from −40°C to +100°C junction temperature. This rating is essential for:

• Telecommunications and wireless base stations
• Industrial automation and control systems
• Military and aerospace adjacent applications
• Outdoor or harsh-environment embedded systems

The industrial-grade variant undergoes additional testing compared to commercial-grade devices (C suffix), making it a preferred choice for long-lifecycle production designs.

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Target Applications for the XCKU115-1FLVF1924I

The XCKU115-1FLVF1924I is purpose-built for applications demanding the highest logic density in the Kintex UltraScale family. Common deployment scenarios include:

#### 100G/400G Networking and Data Centers

With four integrated 100G Ethernet MAC hard blocks and 64 GTH transceivers, this device efficiently implements packet processing, traffic management, and switching fabric designs without consuming programmable logic resources.

#### Medical Imaging and Diagnostic Equipment

The high DSP slice count (5,520 slices) enables real-time processing of high-resolution imaging data streams. Applications include CT reconstruction, MRI signal processing, and ultrasound beamforming.

#### 8K Video Processing

The large block RAM footprint and high DSP throughput support multi-channel 8K video pipeline processing including compression, scaling, color correction, and frame buffering.

#### Wireless Infrastructure (4G/5G)

The device’s JESD204B transceiver compatibility and high logic density make it suitable for digital front-end (DFE) processing in Remote Radio Heads (RRH) and Baseband Units (BBU) for heterogeneous wireless infrastructure.

#### High-Performance Computing (HPC) Acceleration

PCIe Gen3 host connectivity and abundant memory resources support FPGA-based accelerator cards for machine learning inference, genomics, financial analytics, and scientific computing.

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XCKU115-1FLVF1924I vs. Other KU115 Speed Grades

The -1 speed grade of the XCKU115 provides the best power envelope for industrial designs where maximum frequency is not the primary design goal.

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Ordering and Availability

Note: The XCKU115-1FLVF1924I is an allocation-managed component. Lead times can vary significantly. Contact your authorized distributor for real-time stock and pricing.

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Design Tools and Support

AMD provides comprehensive design support for the XCKU115-1FLVF1924I through the Vivado Design Suite, which includes:

• HDL synthesis and implementation (Vivado ML Edition)
• IP Integrator for block-level design entry
• Vivado Simulator for behavioral and post-implementation simulation
• Power estimator (XPE) for XCKU115 device-specific power analysis
• Partial reconfiguration support

The KCU105 Evaluation Kit (AMD part EK-U1-KCU105-G) is the recommended development platform for evaluating the Kintex UltraScale architecture before committing to custom PCB development.

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Frequently Asked Questions

Q: What is the difference between XCKU115-1FLVF1924I and XCKU115-1FLVF1924C? The suffix “I” denotes industrial temperature range (−40°C to +100°C), while “C” denotes commercial range (0°C to +85°C). All other specifications are identical.

Q: Is the XCKU115-1FLVF1924I pin-compatible with other UltraScale devices in the same package? Yes. All UltraScale devices sharing the “F1924” package code are footprint-compatible, enabling board-level migration between device densities.

Q: What programming language is used for the XCKU115? The XCKU115-1FLVF1924I is programmed using VHDL, Verilog, or SystemVerilog through the AMD Vivado Design Suite. High-level synthesis (HLS) using C/C++ is also supported via Vitis HLS.

Q: Does this FPGA support partial reconfiguration? Yes. The UltraScale architecture fully supports Dynamic Function eXchange (DFX), formerly called partial reconfiguration, enabling runtime modification of specific FPGA regions without disrupting the rest of the design.

Q: What encryption standards are supported for bitstream security? The XCKU115-1FLVF1924I supports AES-256 bitstream encryption and RSA-2048 authentication to protect intellectual property in production deployments.

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Summary

The XCKU115-1FLVF1924I is the largest device in the AMD Kintex UltraScale FPGA family, combining 1,451,100 logic cells, 5,520 DSP slices, 64 GTH transceivers, and four PCIe Gen3 hard blocks in a 1,924-pin industrial-grade package. Its 20nm SSI technology, -1 speed grade power efficiency, and −40°C to +100°C operating range make it the definitive choice for high-bandwidth, long-lifecycle embedded designs in networking, wireless infrastructure, medical imaging, and data center acceleration.