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XCKU115-1FLVF1924C: Xilinx Kintex UltraScale FPGA – Full Specifications & Product Guide

Product Details

The XCKU115-1FLVF1924C is a high-performance field programmable gate array (FPGA) from AMD Xilinx, part of the Kintex UltraScale family. Built on a cutting-edge 20nm process node, this device delivers an exceptional balance of processing power, I/O bandwidth, and power efficiency — making it one of the most capable mid-range FPGAs available for demanding applications in networking, signal processing, and data centers.

Whether you are designing next-generation wireless infrastructure, 100G Ethernet line cards, or medical imaging systems, the XCKU115-1FLVF1924C offers the logic density, DSP resources, and high-speed serial transceivers required to meet today’s most challenging design requirements. For engineers and procurement teams exploring the full range of programmable solutions, Xilinx FPGA options span a broad performance and cost spectrum to suit every application.


What Is the XCKU115-1FLVF1924C?

The XCKU115-1FLVF1924C belongs to the Kintex UltraScale XCKU115 product family — the flagship device in the Kintex UltraScale series. The part number encodes key ordering information:

Part Number Segment Meaning
XC Xilinx Commercial
KU115 Kintex UltraScale, density 115
-1 Speed grade 1 (standard speed)
FLVF Package type: Flip-chip Low-Voltage FBGA
1924 1924-pin ball grid array
C Commercial temperature grade (0°C to +100°C)

This is the commercial-temperature, speed-grade-1 variant of the XCKU115 housed in the 1924-ball FCBGA package — ideal for industrial and commercial deployments where extended military or industrial temperature ranges are not required.


XCKU115-1FLVF1924C Key Specifications

General Device Specifications

Parameter Value
Manufacturer AMD Xilinx
Product Family Kintex UltraScale
Part Number XCKU115-1FLVF1924C
Process Technology 20nm
Package FCBGA-1924 (Flip-chip Ball Grid Array)
Pin Count 1924
Speed Grade -1 (Standard)
Temperature Range 0°C to +100°C (Commercial)
RoHS Compliant Yes

Logic & Compute Resources

Resource Quantity
System Logic Cells 1,451,100
CLB Flip-Flops 1,326,720
Logic Blocks (CLBs) 663,360
DSP Slices 5,520
Block RAM Bits 77,722 Kbits (~9.7 MB)
UltraRAM Blocks Not available (UltraScale, not UltraScale+)

I/O and Connectivity

Parameter Value
Maximum User I/Os 728
GTH Transceivers 48
Max GTH Data Rate Up to 16.3 Gb/s
I/O Supply Voltage 3.3V
Clock Management MMCM, PLL
Maximum Operating Frequency 630 MHz

Power Supply Requirements

Supply Voltage Range
Core Supply (VCCINT) Min 922 mV
Core Supply (VCCINT) Max 979 mV
I/O Supply (VCCO) 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
GTH Transceiver Supply (VMGTAVCC) 1.0V

XCKU115-1FLVF1924C Architecture Overview

Kintex UltraScale Architecture

The XCKU115-1FLVF1924C is built on Xilinx’s UltraScale architecture, which introduced a new generation of FPGA design methodology. Unlike earlier FPGA generations, UltraScale leverages ASIC-like clocking, routing, and logic structures to dramatically reduce congestion and improve utilisation efficiency — allowing designers to achieve higher clock frequencies with less manual timing closure effort.

Key architectural highlights include:

  • Enhanced CLB architecture with two 4-input LUT6-based slices per CLB, enabling finer-grained logic packing
  • Cascade DSP48E2 slices supporting high-throughput arithmetic and signal processing operations
  • Cascaded Block RAM for building large, deep memory structures without consuming additional fabric routing resources
  • Advanced clocking network featuring Mixed-Mode Clock Managers (MMCM) and Phase-Locked Loops (PLL) distributed throughout the device

High-Speed Serial Transceivers (GTH)

One of the defining features of the XCKU115-1FLVF1924C is its 48 GTH high-speed serial transceivers, capable of operating at line rates up to 16.3 Gb/s. These transceivers support industry-standard protocols and are purpose-built for high-bandwidth applications such as:

  • 100G Ethernet and multi-lane optical networking
  • PCIe Gen3 interfaces
  • JESD204B/C for high-speed data converter interfaces
  • Serial RapidIO and Interlaken protocols
  • Backplane communications over copper at long distances

The GTH transceivers include on-chip signal conditioning circuits designed to ensure optimal signal integrity in real-world environments, reducing the need for expensive external equalisation components on the PCB.

DSP Performance

With 5,520 DSP slices, the XCKU115-1FLVF1924C delivers outstanding computational throughput for signal-processing workloads. This is among the highest DSP slice counts available in any Kintex-class FPGA, making the device extremely well-suited for:

  • Radar and sonar signal processing
  • Software-defined radio (SDR)
  • Video and image processing pipelines
  • Machine learning inference acceleration
  • FFT and FIR filter implementations

Memory Resources

The device integrates 77,722 Kbits of block RAM, organised as dual-port 36Kb BRAM primitives that can be cascaded or configured as FIFO buffers. This on-chip memory fabric eliminates the need for large external memory interfaces in bandwidth-constrained pipelines, reducing both BOM cost and PCB complexity.


XCKU115-1FLVF1924C Package Information

FCBGA-1924 Package Details

Parameter Value
Package Type Flip-Chip Ball Grid Array (FCBGA)
Total Ball Count 1924
Ball Pitch 1.0 mm
Package Designator F1924

The F1924 package is footprint-compatible with other Kintex UltraScale and Virtex UltraScale devices sharing the same package designator, enabling straightforward board-level migration between density variants without PCB redesign. This is an important consideration for teams that require a migration path as design requirements scale.


Applications for the XCKU115-1FLVF1924C

Networking and Data Center

The XCKU115-1FLVF1924C is purpose-built for 100G and 400G networking workloads. Its combination of high-speed GTH transceivers and large DSP and logic resources makes it ideal for:

  • Line card processing for 100G/400G optical networking equipment
  • Packet classification and deep packet inspection (DPI)
  • Network function virtualisation (NFV) offload accelerators
  • Reconfigurable network switching fabrics

Wireless Infrastructure

In heterogeneous wireless and 5G infrastructure deployments, the XCKU115-1FLVF1924C supports the demanding baseband processing requirements of next-generation radio access networks (RAN):

  • Massive MIMO beamforming
  • CPRI/eCPRI fronthaul processing
  • LTE/NR multi-carrier signal processing
  • Remote radio unit (RRU) digital front-end (DFE)

High-Performance Computing and Acceleration

FPGA-based compute acceleration leverages the XCKU115-1FLVF1924C’s massive parallelism for:

  • Financial analytics and algorithmic trading
  • Database query acceleration
  • Genomics and bioinformatics pipelines
  • Scientific simulation

Medical Imaging

In medical imaging systems, the device’s DSP density and memory bandwidth support real-time image reconstruction for:

  • CT and MRI scanner backends
  • Ultrasound processing
  • 8K/4K video processing pipelines

Test and Measurement

The XCKU115-1FLVF1924C is widely used in high-end test and measurement equipment, including:

  • Logic analysers and protocol analysers
  • High-speed digital oscilloscopes
  • Software-defined instrumentation platforms

XCKU115-1FLVF1924C vs. Similar Variants

Engineers selecting among XCKU115 variants should understand the key differences between ordering options:

Parameter XCKU115-1FLVF1924C XCKU115-2FLVF1924E XCKU115-3FLVD1924E
Speed Grade -1 (Standard) -2 (Fast) -3 (Fastest)
Temperature Commercial (0–100°C) Extended (0–100°C) Extended (0–100°C)
Package FCBGA-1924 FCBGA-1924 FCBGA-1924
Logic Cells 1,451,100 1,451,100 1,451,100
Max Frequency 630 MHz Higher Highest
Typical Use Cost-sensitive commercial Production with margin High-frequency critical paths

The -1 speed grade in the XCKU115-1FLVF1924C is well-suited for most commercial applications, offering substantial performance headroom for the vast majority of FPGA designs without the premium pricing associated with higher speed grades.


Development Tools and Design Flow

Xilinx Vivado Design Suite

The XCKU115-1FLVF1924C is fully supported by the Xilinx Vivado Design Suite, the industry-standard FPGA design environment for UltraScale and UltraScale+ devices. Vivado provides:

  • RTL synthesis, implementation, and bitstream generation
  • Timing closure and static timing analysis (STA)
  • IP integrator for rapid subsystem assembly
  • Integrated logic analyser (ILA) and debug tools
  • Power estimation via the Xilinx Power Estimator (XPE)

Supported IP Cores

The device supports a comprehensive library of Xilinx IP cores relevant to its target markets:

Protocol IP Core
100G Ethernet 100G MAC/PCS
PCIe Gen3 UltraScale PCIe IP
JESD204B High-speed ADC/DAC interface
Interlaken High-bandwidth serial interface
DDR4 External memory controller
HBM Not supported (requires UltraScale+)

Ordering and Availability

The XCKU115-1FLVF1924C is an active production part available from authorised AMD Xilinx distributors worldwide. Key procurement considerations include:

  • Lead times can be extended for this high-density device — consult your distributor for current stock and lead-time information
  • The device is non-cancellable and non-returnable (NCNR) at most distributors due to its nature as a high-value programmable device
  • Volume pricing is available for production quantities — request a quote from authorised distribution partners
  • RoHS compliance is confirmed, supporting use in environmentally regulated markets

Frequently Asked Questions (FAQ)

What is the XCKU115-1FLVF1924C used for?

The XCKU115-1FLVF1924C is used in high-performance applications including 100G networking line cards, 5G wireless baseband processing, radar and defence signal processing, medical imaging, and FPGA-based compute acceleration. Its large logic, DSP, and transceiver resources make it suitable for any application demanding high throughput and low latency in a programmable device.

What is the difference between XCKU115-1FLVF1924C and XCKU115-2FLVF1924E?

The primary differences are speed grade and temperature suffix. The -1 variant (XCKU115-1FLVF1924C) is speed grade 1 with a commercial temperature suffix (C), while the -2 variant (XCKU115-2FLVF1924E) offers a higher speed grade with an extended temperature rating. The logic resources and package are identical.

Is the XCKU115-1FLVF1924C footprint-compatible with other UltraScale devices?

Yes. The F1924 package footprint is shared across multiple Kintex UltraScale and Virtex UltraScale devices. This allows hardware designers to target a lower-density device during prototyping and migrate to the XCKU115 on the same PCB for production.

What software is used to program the XCKU115-1FLVF1924C?

The device is programmed using the Xilinx Vivado Design Suite. Vivado handles synthesis, implementation, timing analysis, and bitstream generation. Configuration is typically performed via JTAG during development and via SPI flash or other configuration modes in production.

How many GTH transceivers does the XCKU115-1FLVF1924C have?

The XCKU115-1FLVF1924C includes 48 GTH transceivers, each capable of operating at data rates up to 16.3 Gb/s, making the device highly capable for multi-protocol high-speed serial connectivity.


Summary

The XCKU115-1FLVF1924C is AMD Xilinx’s most capable Kintex UltraScale FPGA, combining 1,451,100 system logic cells, 5,520 DSP slices, 77,722 Kbits of Block RAM, and 48 GTH transceivers in a 1924-ball commercial FCBGA package. Built on a 20nm process and supported by the Vivado Design Suite, it is the go-to device for engineers building next-generation networking, wireless, and signal-processing systems that demand the utmost in logic density, bandwidth, and design flexibility.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.