The XCKU115-1FLVD1924I is a high-performance field-programmable gate array (FPGA) from AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Manufactured on a 20nm process node, this device delivers the best price/performance/watt ratio in its class, making it the go-to choice for engineers working on 100G networking, DSP-intensive signal processing, medical imaging, 8K video, and heterogeneous wireless infrastructure. If you’re sourcing a Xilinx FPGA for a demanding application, the XCKU115-1FLVD1924I is one of the most capable mid-range devices available today.

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What Is the XCKU115-1FLVD1924I?

The XCKU115-1FLVD1924I is a member of the Kintex UltraScale FPGA series — AMD’s flagship mid-range programmable logic family built on UltraScale architecture. The part number breaks down as follows:

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XCKU115-1FLVD1924I Key Specifications

Core Logic & Fabric Resources

Memory Resources

DSP & Signal Processing

I/O & Connectivity

Package & Thermal Details

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XCKU115-1FLVD1924I: Performance and Architecture Highlights

## UltraScale Architecture Advantages

The XCKU115-1FLVD1924I is built on AMD’s UltraScale architecture, which introduced ASIC-like clocking with fine-grained clock gating. Key architectural improvements over previous-generation 7-Series FPGAs include:

• Reduced routing congestion through a columnar architecture that eliminates traditional switch boxes
• ASIC-style clocking with up to 40% lower dynamic power vs. prior-generation devices
• Integrated 100G Ethernet and Interlaken hard IP blocks
• High-speed GTH transceivers at 16.3 Gb/s supporting PCIe Gen3, JESD204B, CPRI, and more

## High-Density DSP Fabric for Signal Processing

With 5,520 DSP48E2 slices, the XCKU115-1FLVD1924I is purpose-built for computation-heavy workloads. Each DSP48E2 slice can perform a 27×18-bit multiply-accumulate operation, enabling support for FIR filters, FFT engines, matrix multipliers, and AI/ML inference pipelines.

## Industrial-Grade Reliability

The “I” suffix designates the Industrial temperature grade, ensuring the device operates reliably across the full –40°C to +100°C junction temperature range. This makes the XCKU115-1FLVD1924I well-suited for mission-critical environments including aerospace, industrial automation, medical devices, and defense electronics.

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XCKU115-1FLVD1924I vs. Other XCKU115 Variants

The XCKU115 base die is offered in multiple speed grades and package options. Here is how the -1FLVD1924I compares to other common variants:

Tip: Speed grade -1 devices are identical in silicon to -2 and -3; they are simply production-tested to a lower frequency spec, making them ideal when power and heat dissipation are primary concerns.

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## Target Applications for the XCKU115-1FLVD1924I

#### 100G Networking and Data Center

The XCKU115-1FLVD1924I includes hard IP for 100GbE MAC and Interlaken interfaces, making it a natural fit for line cards, network switches, traffic shapers, and deep packet inspection (DPI) engines.

#### Wireless Infrastructure (5G / LTE)

With 64 GTH transceivers and massive DSP resources, this FPGA supports digital pre-distortion (DPD), CPRI/eCPRI fronthaul, multi-carrier beamforming, and massive MIMO workloads common in 5G radio access networks.

#### Medical Imaging

High-resolution ultrasound, CT, and MRI systems demand low-latency, high-throughput signal chains. The XCKU115-1FLVD1924I’s combination of large BRAM, abundant I/O, and DSP makes it a top choice for real-time medical imaging pipelines.

#### Defense and Aerospace

Industrial temperature rating, long product lifecycle, and high logic density make this device suitable for radar processing, electronic warfare, SIGINT, and satellite payload processing.

#### Video and Broadcast

Designers building 8K video capture, compression (HEVC/H.265), or switching systems benefit from the device’s high DSP throughput and transceiver flexibility.

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Design Tools and Support

AMD supports the XCKU115-1FLVD1924I through the Vivado Design Suite, which provides:

• RTL synthesis and implementation
• Timing closure and static timing analysis
• Partial reconfiguration support
• IP integrator for block-based design
• Hardware debugging with ILA (Integrated Logic Analyzer) and VIO cores

The device is also supported by Vitis HLS for high-level synthesis from C/C++, enabling faster RTL development for algorithm-heavy designs.

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Ordering Information

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Frequently Asked Questions (FAQ)

Q: What is the difference between XCKU115-1FLVD1924I and XCKU115-1FLVF1924I? The “D” vs. “F” in the package code refers to a minor variant in the BGA ball map. Both are 1924-pin FCBGA packages with the same die, but pin-out and pad layout may differ slightly. Always verify footprint compatibility with the AMD package files before PCB layout.

Q: Is the XCKU115-1FLVD1924I pin-compatible with Kintex UltraScale+ devices? No. The Kintex UltraScale and Kintex UltraScale+ families use different package footprints and are not pin-compatible. Migration between families requires PCB redesign.

Q: What voltage regulators are needed for the XCKU115-1FLVD1924I? At minimum, you will need rails for VCCINT (0.95V), VCCAUX (1.8V), VCCO (per bank, 1.2V–3.3V depending on I/O standard), and MGT supplies (MGTAVCC, MGTAVTT, MGTVCCAUX). AMD provides a power estimator tool (XPE) to calculate accurate current requirements.

Q: Can the XCKU115-1FLVD1924I support PCIe Gen3? Yes. The device’s GTH transceivers support PCIe Gen1/2/3, and AMD provides a hard PCIe block IP core through Vivado IP Catalog.

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Summary

The XCKU115-1FLVD1924I represents one of the most powerful mid-range FPGAs available in an industrial-grade, 1924-pin package. Its combination of 1.16 million logic cells, 5,520 DSP slices, 64 GTH transceivers, and a proven 20nm UltraScale architecture makes it a versatile platform for networking, wireless, defense, medical, and video applications. For engineers who need maximum I/O density and DSP horsepower in an industrial temperature-rated device, the XCKU115-1FLVD1924I is a benchmark-setting choice.