The XCKU115-1FLVA2104C is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the flagship Kintex® UltraScale™ family. Built on a 20nm process node and housed in a 2104-pin FCBGA package, this device delivers an exceptional balance of logic density, DSP throughput, and memory bandwidth — making it a top choice for 100G networking, data center acceleration, medical imaging, and advanced wireless infrastructure applications.

If you are looking for a versatile, production-grade Xilinx FPGA with massive logic resources and proven UltraScale architecture, the XCKU115-1FLVA2104C is one of the most capable mid-range devices available today.

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What Is the XCKU115-1FLVA2104C?

The XCKU115-1FLVA2104C is a member of the Kintex UltraScale FPGA family, designed by Xilinx (now AMD) and fabricated at 20nm. The part number decodes as follows:

• XCKU115 – Kintex UltraScale, device size 115 (largest in the Kintex UltraScale family)
• -1 – Speed grade 1 (standard performance tier)
• FLVA – FCBGA package variant A
• 2104 – 2104-pin package
• C – Commercial temperature range (0°C to +100°C junction temperature)

This combination makes it ideal for cost-sensitive, high-throughput commercial designs that do not require industrial or military-grade temperature hardening.

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XCKU115-1FLVA2104C Key Specifications

General Product Information

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Logic & Compute Resources

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I/O & Connectivity

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Power & Clocking

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Package Details

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XCKU115-1FLVA2104C Architecture Overview

## UltraScale Architecture at 20nm

The XCKU115-1FLVA2104C is built on AMD’s UltraScale architecture — the industry’s first ASIC-grade programmable architecture. By leveraging TSMC’s 20nm planar process node, this device delivers up to 40% lower power consumption compared to prior-generation 28nm FPGAs, while offering higher clock frequencies and denser logic integration.

Key architectural innovations include:

• Stacked Silicon Interconnect (SSI) Technology — The XCKU115 uses SSI technology to combine multiple super-logic regions (SLRs) on a single passive silicon interposer, enabling logic densities that would otherwise be impractical in a monolithic die.
• ASIC-like clock routing — Fine-grained clock gating and a hierarchical clocking structure minimize dynamic power and support predictable timing closure.
• Advanced memory subsystem — Distributed Block RAM (BRAM) arrays provide 77.7 million bits of on-chip storage, ideal for buffering, look-up tables, and FIFOs in high-bandwidth pipelines.

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## DSP Performance: 5,520 DSP48E2 Slices

One of the most defining characteristics of the XCKU115-1FLVA2104C is its enormous DSP processing capacity. With 5,520 DSP48E2 slices, each capable of performing a 27×18-bit multiply-accumulate (MAC) operation per clock cycle, the device can deliver multi-teraops throughput in signal processing workloads.

### Typical DSP Applications

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## High-Speed Transceivers: 64x GTH at 16.3 Gb/s

The XCKU115-1FLVA2104C integrates 64 GTH transceivers, each supporting data rates from 500 Mb/s up to 16.3 Gb/s. These transceivers are essential for implementing high-speed serial protocols and are a major differentiator of the XCKU115 within the Kintex UltraScale family.

### Supported Serial Protocols (via GTH)

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## Memory Architecture: 75.9 Mb On-Chip RAM

The device contains 2,160 block RAM tiles (36Kb each), offering approximately 75.9 megabits of on-chip memory. This large memory pool supports:

• Wide-bandwidth buffering between pipeline stages
• Large coefficient storage for DSP engines
• High-speed FIFO arrays for inter-module data transfer
• Lookup tables (LUTs) for content-addressable memory (CAM)

Combined with support for external DDR4 memory interfaces (via HP I/O banks), the XCKU115-1FLVA2104C can address demanding data-intensive workloads where both on-chip and off-chip memory throughput are critical.

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XCKU115-1FLVA2104C Applications

## Target Markets and Use Cases

The XCKU115-1FLVA2104C is well-suited to a broad set of demanding applications across multiple verticals:

### Networking & Data Center

• 100G/400G line cards — The integrated 100G Ethernet MAC, PCIe Gen3 hard IP, and high-speed GTH transceivers make this device a natural fit for network line card designs.
• Packet processing engines — Deep pipelined logic with 1.4 million logic cells handles complex classification, encapsulation, and routing workloads.
• FPGA-based SmartNIC acceleration — Offloads compute-intensive tasks from host CPUs in cloud infrastructure.

### Wireless Infrastructure

• 4G LTE / 5G NR Remote Radio Heads (RRH) — GTH transceivers support CPRI/eCPRI fronthaul at required data rates.
• Baseband Unit (BBU) processing — DSP-heavy workloads for channel estimation, MIMO beamforming, and LDPC/Turbo coding benefit from the 5,520 DSP48E2 slices.
• Heterogeneous RAN — Simultaneous multi-band, multi-standard processing in a single device.

### Defense & Aerospace

• Radar signal processing — High DSP throughput and deterministic latency suit pulse-Doppler and SAR radar implementations.
• Electronic warfare (EW) — Wideband signal monitoring and jamming countermeasures.
• Secure communications — Reprogrammable cryptographic pipelines.

### Medical Imaging

• CT / MRI reconstruction — Real-time filtered back-projection and iterative reconstruction algorithms benefit from massive parallelism.
• Ultrasound beamforming — Per-channel delay-and-sum computations mapped efficiently onto DSP arrays.
• X-ray detector interfaces — High-speed parallel data acquisition via GTH transceivers.

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Ordering & Part Number Information

## Part Number Breakdown: XCKU115-1FLVA2104C

Understanding the Xilinx/AMD part numbering convention helps in identifying compatible variants and substitutes.

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## Comparable Variants in the XCKU115 Family

Engineers evaluating the XCKU115-1FLVA2104C may also consider these related devices depending on temperature grade, speed grade, or package requirements:

Note: All FLVA2104 packages share the same PCB ball footprint, enabling direct pin-compatible migration between speed grades and temperature variants without PCB redesign.

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Design Tools & Support

## Vivado Design Suite Compatibility

The XCKU115-1FLVA2104C is fully supported by the AMD Vivado™ Design Suite, which provides an integrated environment for HDL design entry, synthesis, implementation, and bitstream generation. Vivado’s ASIC-style place-and-route engine is specifically co-optimized for UltraScale devices, enabling fast timing closure on dense, high-speed designs.

Recommended Vivado versions for production use with XCKU115 devices are documented in AMD’s official speed specification release notes (DS892).

### Development & Evaluation

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Summary: Why Choose the XCKU115-1FLVA2104C?

The XCKU115-1FLVA2104C stands out as one of the most capable devices in the Kintex UltraScale lineup, combining the highest logic density and DSP count in the family with 832 high-performance I/Os and 64 GTH transceivers — all in a footprint-compatible 2104-pin package. Its commercial temperature rating, -1 speed grade, and proven UltraScale architecture make it the go-to choice for high-volume production designs where performance, power efficiency, and cost-effectiveness all matter.

Whether you are designing next-generation network line cards, baseband processing engines, or medical imaging platforms, the XCKU115-1FLVA2104C delivers the compute density and I/O flexibility to meet the most demanding requirements.