Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCKU095-2FFVA1156E: Xilinx Kintex UltraScale FPGA – Full Specifications & Buying Guide

Product Details

The XCKU095-2FFVA1156E is a high-performance field-programmable gate array (FPGA) from AMD Xilinx, part of the Kintex UltraScale family. Designed for demanding applications in 100G networking, data center processing, advanced DSP, and next-generation video systems, this device delivers an exceptional balance of performance, power efficiency, and cost-effectiveness. Whether you are an FPGA engineer, procurement specialist, or system architect, this guide provides everything you need to know about the XCKU095-2FFVA1156E.


What Is the XCKU095-2FFVA1156E?

The XCKU095-2FFVA1156E is a commercial-grade Xilinx FPGA built on AMD’s 20nm UltraScale architecture. It belongs to the XCKU095 device within the Kintex UltraScale series — a mid-range product family optimized for the best price-per-performance-per-watt ratio available at this process node. The “2” in the part number denotes Speed Grade 2, the highest standard commercial speed grade for this device, while “FFVA1156E” identifies the 1156-pin FC-BGA (Flip-Chip Ball Grid Array) package and commercial temperature rating (0°C to +85°C).


XCKU095-2FFVA1156E Key Specifications

Core Device Parameters

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XCKU095-2FFVA1156E
FPGA Family Kintex UltraScale
Device Series XCKU095
Process Node 20nm
Speed Grade -2 (Highest standard commercial)
Temperature Grade Commercial (0°C to +85°C)

Logic Resources

Resource Quantity
System Logic Cells 1,176,000
CLB Logic Blocks 537,600
LUT Elements ~537,600
Flip-Flops ~1,075,200
Clock Management Tiles (CMT) MMCM + PLL
Maximum Operating Frequency 725 MHz

Memory Resources

Memory Type Capacity
Total Block RAM Bits 60,518 Kbit (~7.4 MB)
Block RAM (RAMB36) Included
Block RAM (RAMB18) Included
UltraRAM (URAM) Not available (UltraScale+ only)

I/O and Connectivity

Parameter Value
Total User I/O Pins 520
Package FCBGA-1156 (Flip-Chip BGA)
Total Package Pins 1,156
I/O Supply Voltage Up to 3.3V
Differential I/O Pairs Supported
High-Speed I/O Standards LVDS, SSTL, HSTL, LVCMOS, and more
Transceiver Support GTH transceivers (device-dependent lane count)

Power Supply Requirements

Parameter Value
Core Supply Voltage (VCCINT) Min 922 mV (0.922V)
Core Supply Voltage (VCCINT) Max 979 mV (0.979V)
Nominal Core Voltage ~0.95V
I/O Supply Voltage (VCCO) Up to 3.3V
RoHS / Phthalates Compliant Yes

Package Information

Parameter Value
Package Type FC-BGA (Flip-Chip Ball Grid Array)
Package Designation FFVA1156
Pin Count 1,156
Mounting Type Surface Mount (SMD)
Lead Finish Lead-free (RoHS)
MSL Rating See manufacturer datasheet

XCKU095-2FFVA1156E Part Number Decoder

Understanding the part number helps you confirm you are ordering the exact variant you need:

Segment Meaning
XC Xilinx Commercial device
KU Kintex UltraScale family
095 Device size (density tier)
-2 Speed Grade 2 (highest standard commercial performance)
FF Flip-Chip package
VA Package variant identifier
1156 Pin count (1,156-pin BGA)
E Commercial temperature grade (0°C to +85°C)

Note: The suffix “I” denotes Industrial temperature (–40°C to +100°C). Make sure you select the correct temperature grade for your application environment.


XCKU095-2FFVA1156E Architecture Overview

UltraScale FPGA Architecture

The XCKU095-2FFVA1156E is built on AMD’s UltraScale FPGA architecture, which introduced several significant advances over earlier 28nm 7-series devices:

ASIC-like Clocking — The UltraScale architecture implements fine-granular clock gating and ASIC-style clocking techniques, reducing dynamic power consumption by up to 40% compared to the previous 7-Series generation.

Advanced Routing — The device uses a routing architecture inspired by ASIC design methodologies, enabling more predictable timing closure and improved performance at high utilization.

Cascaded DSP Slices — The DSP48E2 slices support cascaded arithmetic chains for high-throughput signal processing pipelines in applications like radar, communications, and medical imaging.

High-Speed Transceivers — GTH transceivers support multi-gigabit serial communications protocols including PCIe Gen3, 10GbE, CPRI, and JESD204B.


Clock Management

The XCKU095-2FFVA1156E features mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) distributed across the device. These resources provide:

  • Clock synthesis and frequency multiplication/division
  • Fine-phase shifting for timing alignment
  • Spread-spectrum clock generation capability
  • Independent clock domains with minimal skew

Target Applications for XCKU095-2FFVA1156E

The combination of high logic density, 520 I/Os, 725 MHz maximum frequency, and 60,518 Kbit of on-chip BRAM makes the XCKU095-2FFVA1156E well-suited for the following application domains:

Application Domain Use Case Examples
Networking & Data Center 100G packet processing, L2/L3 switching, traffic management
Wireless Infrastructure 4G/5G baseband, Remote Radio Head DFE, CPRI bridging
Video Processing 8K/4K video scaling, multi-channel encoding, image analysis
Medical Imaging High-bandwidth CT/MRI data acquisition and reconstruction
Defense & Aerospace Radar processing, electronic warfare, secure communications
High-Performance Computing Floating-point acceleration, matrix operations, HPC offload
Test & Measurement Protocol analysis, signal generation, high-speed capture

XCKU095-2FFVA1156E vs. Other Kintex UltraScale Variants

The Kintex UltraScale family spans several density and packaging options. The table below places the XCKU095 in context within the family:

Device Logic Cells Block RAM (Kbit) Max I/O Speed Grade (-2)
XCKU025 ~318,150 ~27,180 312 725 MHz
XCKU040 ~530,250 ~38,000 520 725 MHz
XCKU060 ~726,000 ~52,200 520 725 MHz
XCKU095 1,176,000 60,518 520 725 MHz
XCKU115 ~1,451,000 ~75,900 520+ 750 MHz

The XCKU095 sits near the top of the Kintex UltraScale lineup, offering near-maximum logic density in the compact 1156-pin package — making it the optimal choice when maximum BRAM and logic are needed without stepping up to the larger and more expensive XCKU115 package footprints.


Design Tool Support

The XCKU095-2FFVA1156E is fully supported by AMD’s Vivado Design Suite, the primary development environment for UltraScale devices. Recommended tool versions:

Tool Minimum Supported Version
Vivado Design Suite 2015.3 or later
Vivado IP Integrator 2015.3 or later
Vitis (for HLS/Acceleration) 2019.2 or later
PetaLinux (if using PS) N/A (logic-only device)

The Vivado Design Suite provides end-to-end design support including HDL synthesis, place-and-route, timing analysis, simulation, and bitstream generation. Designers migrating from ISE should note that only Vivado is supported for UltraScale devices.


XCKU095-2FFVA1156E Compliance and Quality

  • RoHS Compliant: Yes
  • Phthalates Compliant: Yes
  • Lead-Free Package: Yes (FFVA1156E suffix)
  • NCNR (Non-Cancellable, Non-Returnable): Typically applies — confirm with your distributor at time of purchase
  • Production Status: Production Silicon; fully supported in Vivado speed files as of version 1.24+

Frequently Asked Questions (FAQ)

What does the “-2” speed grade mean for the XCKU095-2FFVA1156E?

Speed Grade -2 is the highest standard commercial performance tier in the Kintex UltraScale XCKU095 family, supporting a maximum operating frequency of up to 725 MHz. Speed Grade -1 is the lower-performance commercial tier, while -1L is the low-power variant. For most high-performance applications, Speed Grade -2 is recommended.

What is the difference between the XCKU095-2FFVA1156E (E) and the XCKU095-2FFVA1156I (I)?

The “E” suffix indicates a commercial temperature grade device operating from 0°C to +85°C. The “I” suffix indicates an industrial temperature grade device operating from –40°C to +100°C. If your design will be deployed in harsh or outdoor environments, the “I” variant is required.

Is the XCKU095-2FFVA1156E pin-compatible with other XCKU095 variants?

Yes. All XCKU095 devices in the FFVA1156 package share the same 1156-pin FC-BGA footprint, enabling straightforward design migration between speed grades and temperature grades on the same PCB layout.

What transceivers does the XCKU095-2FFVA1156E include?

The XCKU095 device includes GTH high-speed transceivers capable of supporting protocols such as PCIe Gen3, 10G/25G Ethernet, CPRI, JESD204B, and Interlaken. The exact transceiver lane count and grouping should be confirmed against the official AMD Xilinx XCKU095 product table and package pinout documentation.

What development boards are available for the XCKU095?

AMD offers the KCU105 Kintex UltraScale Evaluation Kit as a reference platform for the Kintex UltraScale family. Third-party vendors including Avnet, Enclustra, and Hitech Global also offer boards utilizing the XCKU095 device.


Summary

The XCKU095-2FFVA1156E is one of the most capable devices in the Kintex UltraScale family, combining 1,176,000 logic cells, 60,518 Kbit of block RAM, 520 user I/Os, and a 725 MHz maximum operating frequency in a compact, commercially-rated 1156-pin FC-BGA package. It is purpose-built for demanding applications in networking, wireless, video, and high-performance computing where maximum logic density and bandwidth are required at the mid-range price point.

For procurement, design support, and compatible Xilinx FPGA solutions, consult your authorized AMD distributor or visit AMD’s official product pages for the latest datasheet, pricing, and availability information.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.