The XCKU095-1FFVC1517C is a high-performance Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Built on a 20nm process node, this device delivers an exceptional blend of DSP throughput, logic density, and transceiver capability — making it one of the most capable mid-range FPGAs available for data center, networking, medical imaging, and wireless infrastructure applications.
What Is the XCKU095-1FFVC1517C?
The XCKU095-1FFVC1517C is a commercial-grade (-1 speed grade, “C” temperature suffix) variant of the Xilinx XCKU095 device, housed in a 1517-pin Flip-Chip Ball Grid Array (FCBGA) package. It belongs to the Kintex UltraScale product line — a family optimized for the best price-per-performance-per-watt at 20nm, combining high signal processing bandwidth with next-generation serial transceivers and cost-effective packaging.
XCKU095-1FFVC1517C Key Specifications
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU095-1FFVC1517C |
| FPGA Family |
Kintex UltraScale |
| Process Technology |
20nm |
| Logic Cells |
1,176,000 |
| Speed Grade |
-1 |
| Core Voltage (VCCINT) |
0.95V |
| Package |
FCBGA (Flip-Chip BGA) |
| Pin Count |
1517 Pins |
| Operating Temperature |
0°C to +85°C (Commercial) |
| I/O Count |
Up to 520 user I/Os |
| Maximum Clock Frequency |
630 MHz |
| Packaging Format |
Tray |
XCKU095-1FFVC1517C Logic and Memory Resources
One of the most compelling aspects of the XCKU095 is its rich on-chip resource density. The table below summarizes the key fabric resources available in this device:
| Resource Type |
Count |
| CLB LUTs |
~537,600 |
| CLB Flip-Flops |
~1,075,200 |
| Block RAM (36Kb tiles) |
1,080 |
| Total Block RAM Capacity |
~38.9 Mb |
| DSP Slices (DSP48E2) |
2,760 |
| MMCM (Mixed-Mode Clock Manager) |
20 |
| PLL |
20 |
| UltraRAM (288Kb tiles) |
0 (Kintex UltraScale, not UltraScale+) |
Note: UltraRAM is a feature of the Kintex UltraScale+ generation. The XCKU095 uses block RAM for on-chip storage.
Transceiver and High-Speed I/O Specifications
The XCKU095-1FFVC1517C includes next-generation GTH transceivers that support line rates up to 16.3 Gb/s, enabling multi-protocol connectivity across a wide range of high-speed serial standards.
| Transceiver Feature |
Specification |
| Transceiver Type |
GTH (Gen 3) |
| Number of GTH Transceivers |
32 |
| Maximum Line Rate (GTH) |
16.3 Gb/s |
| PCIe Gen3 x8 Blocks |
2 |
| 100G Ethernet Support |
Yes |
| Interlaken Support |
Yes |
| Supported Serial Standards |
PCIe Gen1/2/3, 10GbE, 40GbE, 100GbE, SATA, USB 3.0, JESD204B, Aurora, CPRI, OBSAI, OTN |
Part Number Decode: Understanding XCKU095-1FFVC1517C
Breaking down the part number helps buyers quickly identify the exact variant needed:
| Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 095 |
Device Size/Density (XCKU095) |
| -1 |
Speed Grade (-1 is standard; -2 is faster) |
| FF |
Package Type: Flip-Chip Fine-Pitch BGA |
| VC |
Package Variant Code |
| 1517 |
Number of Package Pins (1517 pins) |
| C |
Temperature Grade: Commercial (0°C to +85°C) |
XCKU095-1FFVC1517C Applications and Use Cases
## High-Speed Networking and Data Centers
The XCKU095 is purpose-built for 100G networking packet processing. Its dual PCIe Gen3 x8 blocks and GTH transceivers supporting 100GbE enable low-latency line-rate processing for switches, routers, and network interface cards (NICs).
## DSP-Intensive Signal Processing
With 2,760 DSP48E2 slices, this FPGA delivers massive parallel arithmetic throughput. Applications include:
- Next-generation medical imaging systems (MRI, CT, ultrasound)
- 8K/4K video processing and encoding pipelines
- Software-defined radio (SDR) and heterogeneous wireless infrastructure
- Radar, sonar, and test & measurement equipment
## Embedded Processing
The XCKU095 supports the MicroBlaze™ soft processor, a 32-bit RISC core capable of running at over 200 DMIPS with 800 Mb/s DDR3 memory interface support. This makes it suitable for embedded control applications alongside real-time DSP workloads.
## Wireless and Telecom Infrastructure
CPRI and OBSAI protocol support, combined with JESD204B-compatible transceivers, makes the XCKU095-1FFVC1517C a natural fit for remote radio units (RRUs), baseband units (BBUs), and heterogeneous network (HetNet) equipment.
XCKU095-1FFVC1517C vs. Related Variants
Engineers sourcing this part should be aware of how it compares to other variants in the XCKU095 family:
| Part Number |
Speed Grade |
Temperature |
Package Pins |
Target Use |
| XCKU095-1FFVC1517C |
-1 |
Commercial (0–85°C) |
1517 |
Standard designs |
| XCKU095-2FFVC1517E |
-2 |
Extended (0–100°C) |
1517 |
Higher performance, extended temp |
| XCKU095-1FFVB1760C |
-1 |
Commercial (0–85°C) |
1760 |
More I/O needed |
| XCKU095-1FFVB2104C |
-1 |
Commercial (0–85°C) |
2104 |
Maximum I/O density |
| XCKU095-1FFVA1156C |
-1 |
Commercial (0–85°C) |
1156 |
Lower pin count, cost reduction |
Development Tools and Design Environment
The XCKU095-1FFVC1517C is fully supported by AMD’s Vivado Design Suite (minimum version 2015.3 for production silicon). Vivado provides:
- Synthesis, implementation, and bitstream generation
- IP Integrator for block-level design
- Xilinx Power Estimator (XPE) for power budgeting
- High-level synthesis (HLS) via Vitis HLS
Designers migrating from ISE-based flows will find that Vivado offers dramatically improved resource utilization and timing closure capabilities for UltraScale devices.
Power Supply Requirements
Proper power sequencing is critical for UltraScale devices. The XCKU095-1FFVC1517C requires multiple supply rails:
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
0.95V |
Core logic and routing |
| VCCAUX |
1.8V |
Auxiliary circuits |
| VCCO |
1.2V – 3.3V |
I/O bank output drivers |
| VCCINT_IO |
1.0V |
I/O bank logic |
| MGTVCCAUX |
1.8V |
GTH transceiver auxiliary |
| MGTAVCC |
1.0V |
GTH transceiver analog core |
| MGTAVTT |
1.2V |
GTH transceiver termination |
Ordering Information
| Attribute |
Details |
| Manufacturer Part Number |
XCKU095-1FFVC1517C |
| Manufacturer |
AMD / Xilinx |
| DigiKey Part Number |
Available via DigiKey (part #6132159) |
| ECCN Classification |
3A001.a.7.b |
| HTS Code (US) |
8542390001 |
| TARIC Code (EU) |
8542399000 |
| Packaging |
Tray |
| RoHS Status |
Compliant |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU095-1FFVC1517C and XCKU095-2FFVC1517E? The “-1” vs. “-2” designation refers to the speed grade — the -2 variant offers higher maximum operating frequencies and is screened for extended temperature operation (up to 100°C). The -1C is designed for standard commercial environments (0–85°C).
Q: Is the XCKU095-1FFVC1517C RoHS compliant? Yes, this part is manufactured in compliance with RoHS (Restriction of Hazardous Substances) directives.
Q: Does the XCKU095 support HBM or UltraRAM? No. UltraRAM was introduced in the Kintex UltraScale+ generation. The XCKU095 uses standard 36Kb Block RAM tiles for on-chip storage.
Q: What PCIe generation does the XCKU095-1FFVC1517C support? It supports PCIe Gen1, Gen2, and Gen3 with up to x8 lane width, using two dedicated PCIe hard blocks.
Q: Can I migrate designs from an XCKU085 to the XCKU095? Yes, with care. Both devices share the same UltraScale architecture and package families overlap, but pin-compatibility must be verified for the specific package variant in use.
Summary
The XCKU095-1FFVC1517C is a leading-edge mid-range FPGA that delivers high-density logic, extensive DSP resources, and proven GTH transceiver technology in a commercially-rated package. Whether your design requires 100G network processing, real-time DSP, or multi-protocol high-speed serial connectivity, this device offers the capability, ecosystem support, and development tool maturity to accelerate time-to-market.
For engineers evaluating the full range of Kintex UltraScale and other AMD/Xilinx programmable logic options, this part represents an excellent balance of performance density and cost efficiency at 20nm.
