The XCKU095-1FFVB1760I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the Kintex UltraScale family. Built on 20nm process technology, this industrial-grade device delivers exceptional DSP processing bandwidth, next-generation transceivers, and a massive 1,176,000-cell logic capacity — all packaged in a 1760-pin FCBGA footprint. Whether you are designing for 100G networking, advanced medical imaging, 8K video processing, or wireless infrastructure, the XCKU095-1FFVB1760I offers the right balance of capability, density, and power efficiency.
If you’re looking to explore the broader ecosystem, Xilinx FPGA solutions cover a wide range of device families and application-specific configurations.
What Is the XCKU095-1FFVB1760I?
The XCKU095-1FFVB1760I is a member of the Xilinx Kintex UltraScale FPGA series — AMD’s mid-range, high-density programmable logic family designed for multi-hundred Gbps system throughput. It features the UltraScale architecture, the industry’s first ASIC-class all-programmable platform, enabling designers to achieve high logic utilization with next-generation routing efficiency.
The part number decodes as follows:
| Code Segment |
Meaning |
| XC |
Xilinx Commercial |
| KU |
Kintex UltraScale Family |
| 095 |
Device density (095 = highest in base Kintex UltraScale) |
| -1 |
Speed grade (-1 = standard, -2 = higher performance) |
| FFVB |
Package type: Fine-pitch flip-chip BGA |
| 1760 |
Pin count (1760 pins) |
| I |
Temperature grade: Industrial (-40°C to +100°C) |
XCKU095-1FFVB1760I Key Specifications
Core Logic Resources
| Parameter |
Value |
| Logic Cells |
1,176,000 |
| CLB Logic Blocks |
537,600 |
| Process Node |
20nm |
| Speed Grade |
-1 |
| Supply Voltage (VCCINT) |
0.922V – 0.979V (nominal 0.95V) |
| Clock Speed |
Up to 630 MHz |
Memory Resources
| Memory Type |
Capacity |
| Total Block RAM |
60,518 Kbit (~7.4 MB) |
| Block RAM (36K blocks) |
1,080 |
| UltraRAM |
N/A (UltraScale, not UltraScale+) |
I/O and Connectivity
| Parameter |
Value |
| User I/O Pins |
702 |
| Package |
1760-Pin FCBGA (FFVB1760) |
| GTH Transceivers |
48 |
| PCIe Gen3 Endpoint |
Yes |
| 100G Ethernet Support |
Yes |
| Interlaken (150G) |
Yes |
Signal Processing
| Parameter |
Value |
| DSP48E2 Slices |
2,760 |
| Clock Management Tiles (CMT) |
12 |
| MMCM |
Yes |
| PLL |
Yes |
Package and Environmental
| Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1,760 |
| Temperature Range |
Industrial: –40°C to +100°C |
| Mounting Type |
Surface Mount |
| RoHS Compliant |
Yes |
| Tray Packaging |
Tray |
XCKU095-1FFVB1760I vs. Other KU095 Package Variants
The XCKU095 die is available in multiple package options. Here is how the FFVB1760 compares to other common variants:
| Part Number |
Package |
Pins |
User I/Os |
Speed Grade |
Temp Grade |
| XCKU095-1FFVB1760I |
FCBGA |
1,760 |
702 |
-1 |
Industrial |
| XCKU095-2FFVB1760I |
FCBGA |
1,760 |
702 |
-2 |
Industrial |
| XCKU095-1FFVA1156I |
FCBGA |
1,156 |
520 |
-1 |
Industrial |
| XCKU095-1FFVB2104C |
FCBGA |
2,104 |
702 |
-1 |
Commercial |
| XCKU095-1FFVC1517I |
FCBGA |
1,517 |
468 |
-1 |
Industrial |
The FFVB1760I variant provides the highest I/O count among –1 speed-grade industrial parts while maintaining a manageable PCB footprint compared to the 2104-pin package.
Kintex UltraScale Architecture Highlights
## ASIC-Class Routing and Clocking
The UltraScale architecture introduces next-generation routing and ASIC-like clocking infrastructure. Unlike previous FPGA generations, UltraScale devices use a staggered interconnect structure that reduces routing congestion at high utilization levels, allowing designs to achieve higher system frequencies without sacrificing logic density.
## GTH High-Speed Transceivers
The XCKU095-1FFVB1760I integrates 48 GTH serial transceivers supporting line rates from 500 Mb/s up to 16.375 Gb/s. These transceivers are engineered for demanding protocols including:
- 100G Ethernet (100GBASE-R)
- PCIe Gen3 (8 GT/s per lane)
- Interlaken (150G aggregate)
- JESD204B for high-speed ADC/DAC interfaces
- OTU4 optical transport
## DSP Processing Density
With 2,760 DSP48E2 slices, the XCKU095-1FFVB1760I delivers some of the highest DSP-to-logic ratios available in mid-range FPGAs. This makes it ideal for radar signal processing, software-defined radio (SDR), 5G baseband, and machine learning inference acceleration.
## UltraScale Clocking
The device features 12 Clock Management Tiles (CMTs), each containing one MMCM and one PLL. This provides designers with extensive flexibility for frequency synthesis, phase alignment, and jitter filtering across complex multi-clock domain designs.
Target Applications for the XCKU095-1FFVB1760I
The XCKU095-1FFVB1760I is engineered for demanding, high-throughput applications across multiple industries:
## 100G Networking and Data Center
The combination of high-density transceivers, PCIe Gen3, and 100G Ethernet support makes this device well-suited for line cards, network interface controllers (NICs), and data center switching fabrics.
## Wireless Infrastructure (4G LTE / 5G NR)
With its exceptional DSP bandwidth and transceiver density, the XCKU095-1FFVB1760I targets digital front-end (DFE) processing for remote radio units, massive MIMO beamforming, and heterogeneous wireless infrastructure platforms.
## Medical Imaging
High-resolution ultrasound systems, CT scanners, and MRI reconstruction engines benefit from the device’s ability to process multiple high-speed ADC data streams in parallel using JESD204B transceivers and DSP48E2 slices.
## 8K Video Processing
Real-time 8K video encode/decode pipelines, multi-channel video switching, and broadcast infrastructure are enabled by the device’s high I/O count, block RAM capacity, and processing throughput.
## Military and Aerospace (Industrial Grade)
The industrial temperature rating (–40°C to +100°C) makes the XCKU095-1FFVB1760I suitable for ruggedized and extended-temperature environments commonly found in defense electronics, avionics, and industrial control systems.
Development Tools and Software Support
AMD Xilinx provides a complete software ecosystem for the XCKU095-1FFVB1760I:
| Tool |
Description |
| Vivado Design Suite |
Primary RTL synthesis, implementation, and bitstream generation tool |
| Vitis Unified Software Platform |
Application-level development for hardware/software co-design |
| Xilinx Power Estimator (XPE) |
Power analysis and budgeting tool |
| ChipScope / ILA |
In-circuit debug and signal monitoring |
| IP Integrator |
Block-based design for PCIe, Ethernet, and other IP subsystems |
Minimum supported Vivado version for the XCKU095 is Vivado Design Suite 2015.3 (speed file v1.24). For production designs, AMD recommends Vivado 2016.4 or later to ensure the latest speed specifications are applied.
Ordering and Compliance Information
| Attribute |
Detail |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Part Number |
XCKU095-1FFVB1760I |
| DigiKey Part Number |
1088-6132180-ND |
| Series |
Kintex UltraScale |
| Packaging |
Tray |
| RoHS Status |
RoHS Compliant |
| REACH / WEEE |
Compliant |
| Export Classification (ECCN) |
Applicable — check with supplier |
Frequently Asked Questions
### What is the difference between XCKU095-1FFVB1760I and XCKU095-2FFVB1760I?
The only difference is the speed grade. The -2 variant offers higher maximum operating frequency compared to the -1 variant. Both are industrial-temperature parts in the same 1760-pin FCBGA package with identical I/O counts and logic resources.
### Is the XCKU095-1FFVB1760I pin-compatible with Virtex UltraScale XCVU095?
The XCVU095 is also available in the FFVB1760 package with the same 1760-pin footprint, but the two devices are NOT functionally pin-compatible. Always verify pinout files using AMD Xilinx’s official UltraScale Package Pinout files before designing a shared-footprint PCB.
### What PCB design considerations apply to this device?
The 1760-pin FCBGA package requires careful attention to power delivery, decoupling capacitor placement, and high-speed signal routing. AMD Xilinx provides Signal Integrity (SI) guidelines and PCB design checklists specific to the UltraScale package family.
### What is the typical price range for XCKU095-1FFVB1760I?
Pricing varies significantly by quantity and availability. Contact authorized distributors such as DigiKey, Mouser, Arrow, or Avnet for current pricing. Historical single-unit pricing has ranged from approximately $2,000 to $5,000 USD depending on market conditions.
Summary
The XCKU095-1FFVB1760I is one of the most capable mid-range FPGAs ever produced by AMD Xilinx. With 1.176 million logic cells, 702 user I/Os, 48 GTH transceivers, 2,760 DSP slices, and industrial-grade temperature tolerance — all built on a 20nm UltraScale architecture — it is the device of choice for engineers pushing the boundaries of signal processing, high-speed connectivity, and real-time computation. Its industrial temperature rating makes it particularly valuable in mission-critical deployments where reliable operation across wide temperature ranges is non-negotiable.
