The XCKU085-L1FLVF1924I is a high-performance, low-power Xilinx FPGA from the Kintex UltraScale family. Designed for demanding mid-range applications that require an exceptional balance of signal processing capability, transceiver bandwidth, and power efficiency, this device is one of the most capable members of the XCKU085 device family. Built on TSMC’s 20nm process node and housed in a 1924-pin FCBGA package, the XCKU085-L1FLVF1924I is the go-to choice for engineers targeting 5G wireless, wired networking, video processing, defense, and high-performance computing (HPC) applications.
What Is the XCKU085-L1FLVF1924I?
The XCKU085-L1FLVF1924I is part of Xilinx’s (now AMD) Kintex UltraScale FPGA series — a family engineered to deliver the highest signal processing bandwidth at mid-range pricing. The “L1” in the part number designates the -1L low-power speed grade, meaning the device can operate at a reduced VCCINT of either 0.95V or 0.90V, offering screened lower maximum static power while maintaining competitive performance. The F1924 suffix identifies the 1924-pin Flip-Chip Ball Grid Array (FCBGA) package, and the “I” suffix confirms the industrial temperature range (–40°C to +100°C).
XCKU085-L1FLVF1924I Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XCKU085-L1FLVF1924I |
| FPGA Family |
Kintex UltraScale |
| Process Node |
20nm TSMC |
| Logic Cells |
1,088,325 |
| Configurable Logic Blocks (CLBs) |
497,520 |
| LUT Count |
663,360 |
| Flip-Flops |
1,326,720 |
| DSP Slices |
5,520 |
| Block RAM |
58,265,600 bits (~56 Mb) |
| GTH Transceivers |
64 |
| Max Transceiver Line Rate |
16.3 Gb/s |
| Transceiver Aggregate Bandwidth |
~1,220 Gb/s |
| PCIe Hard Blocks |
2× Gen3 ×8 (or 1× Gen3 ×16) |
| 100G Ethernet |
Yes (hardened) |
| 150G Interlaken |
Yes (hardened) |
| User I/O |
728 |
| Package |
1924-pin FCBGA (FLV) |
| Package Body Size |
47.5mm × 47.5mm |
| Speed Grade |
-1L (Low Power) |
| VCCINT |
0.95V / 0.90V |
| Temperature Range |
Industrial: –40°C to +100°C |
| CMTs / MMCMs / PLLs |
10 / 10 / 20 |
| ECC Support |
Yes (Block RAM) |
| RoHS Compliance |
Yes |
XCKU085-L1FLVF1924I Part Number Decoder
| Field |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial Device |
| KU |
KU |
Kintex UltraScale Family |
| 085 |
085 |
Device Density (XCKU085 die) |
| -L1 |
-L1 |
Low-Power Speed Grade 1 |
| F |
F |
Flip-Chip Package Type |
| LV |
LV |
Lidded Package Variant |
| F1924 |
F1924 |
1924-pin FCBGA |
| I |
I |
Industrial Temp (–40°C to +100°C) |
Architecture Overview: UltraScale Technology Inside
Configurable Logic Blocks (CLBs) and LUTs
The XCKU085-L1FLVF1924I’s Configurable Logic Blocks contain 6-input look-up tables (LUTs) and flip-flops, and these LUTs can be configured as distributed memory to complement the device’s large block RAM resources. Jotrin Electronics With 663,360 LUTs and 1,326,720 flip-flops, the device offers exceptional logic density for large state machines, complex data paths, and dense signal processing pipelines.
DSP Slices: High-Performance Signal Processing
The DSP slice features a 96-bit-wide XOR functionality, a 27-bit pre-adder, and a 30-bit A input, and it performs numerous independent functions including multiply accumulate, multiply add, and pattern detect. Jotrin Electronics The XCKU085-L1FLVF1924I integrates 5,520 DSP48E2 slices, enabling high-throughput FFT engines, FIR filters, neural network inference, and forward error correction pipelines.
Block RAM and On-Chip Memory
| Memory Type |
Capacity |
| Block RAM (36Kb tiles) |
1,080 tiles / ~56 Mb |
| Block RAM (18Kb tiles) |
Up to 2,160 when split |
| Distributed RAM (LUT-based) |
~9.3 Mb |
| ECC Support |
Built-in per tile |
| FIFO Mode |
Hardened FIFO per tile |
GTH High-Speed Transceivers
The device includes 64 GTH transceivers capable of up to 16.3 Gb/s per lane, with an aggregate bandwidth of approximately 1,220 Gb/s. Protocol support covers PCIe, 10GbE/100GbE, CPRI, JESD204B, SATA, SAS, DisplayPort, and Interlaken.
Package and Pin Configuration: 1924-Pin FCBGA (FLV)
| Parameter |
Value |
| Package Type |
Flip-Chip Ball Grid Array (FCBGA) |
| Package Code |
FLV F1924 |
| Pin Count |
1,924 |
| Body Size |
47.5mm × 47.5mm |
| Ball Pitch |
1.0mm |
| User I/O |
728 |
| HP I/O Banks |
12 |
| I/O Standards |
LVCMOS, LVDS, HSTL, SSTL, POD |
| VCCO Range |
1.0V – 1.8V (HP banks) |
Low-Power Speed Grade: Understanding the “-L1” Designation
-1L vs. -1 Speed Grade Comparison
The -1L devices can operate at either of two VCCINT voltages — 0.95V and 0.90V — and are screened for lower maximum static power. When operated at VCCINT = 0.95V, the speed specification of a -1L device is the same as the -1 speed grade. Mouser
| Parameter |
-1L @ 0.95V |
-1L @ 0.90V |
-1 Standard |
| VCCINT |
0.95V |
0.90V |
0.95V |
| Speed Performance |
Same as -1 |
Reduced |
Baseline |
| Static Power |
Lower than -1 |
Lowest |
Standard |
| Vivado Tool Label |
-1L |
-1LV |
-1 |
| Best For |
Power + performance |
Max power savings |
Max performance |
Industrial Temperature Range: Built for Harsh Environments
The “I” suffix confirms the XCKU085-L1FLVF1924I is rated from –40°C to +100°C junction temperature, making it suitable for:
- Outdoor telecom base station equipment
- Military and aerospace ground systems
- Industrial automation and motor control
- Transportation and rail electronics
- Energy infrastructure and smart grid applications
Hardened IP Blocks: PCIe, 100G Ethernet, and Interlaken
PCIe Gen3 Hard Block
| Feature |
Specification |
| PCIe Generation |
Gen3 (8 GT/s per lane) |
| Lane Configuration |
Up to ×16 (2× ×8 blocks) |
| Endpoint / Root Port |
Both supported |
| Power Management |
ASPM L0, L0s, L1 |
100G Ethernet and 150G Interlaken
| Protocol |
Capability |
| 100G Ethernet (CAUI-4) |
Hardened MAC/PCS |
| 150G Interlaken |
Hardened framer |
| 10GbE / 40GbE |
Via GTH + Xilinx IP |
Supported Memory Interfaces
| Memory Standard |
Max Speed |
| DDR4 |
2,400 Mb/s |
| DDR3 / DDR3L |
1,866 Mb/s |
| LPDDR4 |
2,133 Mb/s |
| QDR II+ |
633 MHz |
| RLDRAM 3 |
1,066 MHz |
| Hybrid Memory Cube (HMC) |
Via GTH serial interface |
The clock management technology is tightly integrated with dedicated memory interface circuitry to enable support for high-performance external memories, including DDR4, and UltraScale devices also support serial memories such as Hybrid Memory Cube (HMC). FPGAkey
Typical Applications for the XCKU085-L1FLVF1924I
AMD Kintex UltraScale devices provide the best price/performance/watt at 20nm and include the highest signal processing bandwidth in a mid-range device, next-generation transceivers, and low-cost packaging for an optimum blend of capability. AMD
| Application Domain |
Use Case Examples |
| Wireless Communications |
4G/5G baseband, CPRI/eCPRI aggregation, beamforming |
| Wired Networking |
100G line cards, OTN framing, packet classification |
| Test & Measurement |
High-speed data acquisition, protocol analysis |
| Defense & Aerospace |
Radar DSP, EW systems, secure comms |
| High-Performance Computing |
Hardware acceleration, AI/ML inference |
| Video & Broadcast |
4K/8K SDI, multi-channel routing, compression |
| Industrial Automation |
Motor control, machine vision, real-time control |
| Medical Imaging |
Ultrasound, CT/MRI data processing pipelines |
Development Tools and Design Flow
The XCKU085-L1FLVF1924I is fully supported by Xilinx Vivado Design Suite, providing a complete RTL-to-bitstream flow with:
- RTL synthesis (Vivado or third-party)
- Placement and routing with UltraScale-optimized algorithms
- Power estimation via Xilinx Power Estimator (XPE)
- IP integration using Vivado IP Integrator (IPI)
- In-system debug via Integrated Logic Analyzer (ILA) and Virtual I/O (VIO)
Supported HDL languages: VHDL, Verilog, SystemVerilog. High-level synthesis via Vitis HLS for C/C++ entry.
XCKU085-L1FLVF1924I Ordering and Compliance
| Attribute |
Detail |
| Manufacturer |
Xilinx, Inc. (now AMD) |
| Full Part Number |
XCKU085-L1FLVF1924I |
| Package |
1924-BBGA, FCBGA |
| RoHS Status |
RoHS Compliant |
| REACH Compliance |
Compliant |
| MSL |
MSL 3 |
| Lead Finish |
Lead-Free |
| Packaging |
Tray |
Frequently Asked Questions (FAQ)
What is the difference between XCKU085-L1FLVF1924I and XCKU085-1FLVF1924I?
The -L1 variant is screened for lower static power and supports dual VCCINT at 0.95V or 0.90V. The standard -1 grade operates only at 0.95V. Both deliver identical timing performance at 0.95V — the -1L is preferred when power or thermal budget is a constraint.
Is the XCKU085-L1FLVF1924I footprint-compatible with other XCKU085 devices?
Yes. The FLVF1924 package is footprint-compatible with other XCKU085 and XCKU115 parts in the same 1924-pin package, enabling seamless density migration on the same PCB.
Does the XCKU085-L1FLVF1924I support JESD204B?
Yes. The GTH transceivers support JESD204B implementation via Xilinx’s JESD204B IP core, making it suitable for high-speed ADC/DAC interfaces in wireless and instrumentation systems.
Can this FPGA be used in aerospace or defense applications?
The XCKU085-L1FLVF1924I is an industrial-grade commercial device. For military screening or radiation-hardened requirements, Xilinx offers separate XQKU defense-grade variants.
Summary: Why Choose the XCKU085-L1FLVF1924I?
The XCKU085-L1FLVF1924I delivers an outstanding combination of logic density, DSP throughput, high-speed serial connectivity, and power efficiency in an industrial-grade package. Its -1L low-power speed grade gives design engineers the flexibility to optimize for performance parity with standard -1 devices or maximum power savings at 0.90V VCCINT. With 64 GTH transceivers at 16.3 Gb/s, hardened 100G Ethernet and PCIe Gen3 blocks, and over one million logic cells, this FPGA is purpose-built for the most bandwidth-intensive, compute-heavy applications in communications, defense, and industrial markets.
Specifications are based on Xilinx DS892 (Kintex UltraScale FPGA Data Sheet) and DS890 (UltraScale Architecture and Product Overview). Always verify final specifications with official AMD/Xilinx documentation prior to design commit.
