The XCKU085-3FLVA1517E is a high-speed, top-tier speed-grade FPGA from AMD Xilinx’s Kintex UltraScale family. Built on a proven 20nm process node and housed in a compact 1517-pin FCBGA package, this device delivers an exceptional combination of DSP throughput, logic density, and transceiver performance — all at a mid-range price point. Whether you are designing for 100G networking, advanced signal processing, medical imaging, or wireless infrastructure, the XCKU085-3FLVA1517E is engineered to meet the most demanding requirements.

For engineers seeking a comprehensive portfolio of programmable logic solutions, explore our full range of Xilinx FPGA devices.

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What Is the XCKU085-3FLVA1517E?

The XCKU085-3FLVA1517E is a member of the Kintex UltraScale FPGA family manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

This device uses AMD’s UltraScale architecture — the industry’s first ASIC-class programmable architecture — delivering reduced design complexity with predictable performance across all silicon density levels.

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Key Specifications at a Glance

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XCKU085-3FLVA1517E Logic & Memory Resources

The XCKU085 device uses SSI (Stacked Silicon Interconnect) technology, meaning it incorporates multiple super-logic regions (SLRs) to achieve high density. This translates directly into exceptional resource availability.

Note: The XCKU085 is an SSI device. For power calculations, multiply device ICCQ values by the number of SLRs as noted in the AMD datasheet (DS892).

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Speed Grade -3: Peak Performance Explained

Why -3 Speed Grade Matters

The -3 speed grade is the highest-performance grade available in the Kintex UltraScale family. In the XCKU085-3FLVA1517E, this means:

• Maximum operating frequency up to approximately 725 MHz on registered paths
• Tighter setup and hold times compared to -2 and -1 devices
• Optimal for designs that push the limits of 100G networking, high-frequency DSP pipelines, and memory interfaces
• Best choice when deterministic, lowest-latency behavior is critical

The Kintex UltraScale family offers -3, -2, -1, and -1L speed grades. The -1L grade targets lowest static power. The -3 grade targets maximum throughput — making the XCKU085-3FLVA1517E the right choice for performance-first applications.

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XCKU085-3FLVA1517E Package & Pinout Details

1517-Pin FCBGA Package (FLVA1517)

The FLVA1517 package offers a high-density I/O footprint that is footprint-compatible with other UltraScale architecture devices sharing the same package suffix. This is a critical advantage for multi-generational PCB designs, reducing redesign time and board spin costs when upgrading to higher-density or next-generation devices.

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DSP Performance: High Compute Density for Signal Processing

6,840 DSP Slices — Built for Signal-Intensive Workloads

Each DSP slice in the Kintex UltraScale architecture incorporates:

• A 27×18 multiplier
• A 27-bit pre-adder for efficient FIR filter implementation
• A 30-bit A input
• 96-bit XOR functionality
• Support for multiply-accumulate (MACC), multiply-add, and pattern detect operations

With 6,840 DSP slices, the XCKU085-3FLVA1517E is particularly well-suited to:

• FIR and IIR digital filters for communications and audio
• FFT and IFFT engines for radar and spectral analysis
• Machine learning inference pipelines
• Video processing at 8K4K resolution and above
• Software-defined radio (SDR) baseband processing

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Memory Architecture: Block RAM and Distributed RAM

75.9 Mb of Block RAM

The XCKU085-3FLVA1517E includes 2,160 blocks of 36Kb true dual-port Block RAM. Each block features:

• Built-in FIFO logic with optional ECC
• Configurable as two independent 18Kb blocks
• Support for simultaneous read and write at independent clocks

36.1 Mb of Distributed RAM

Configurable LUTs can also serve as distributed memory, supplementing block RAM with ultra-low-latency, single-cycle-access storage distributed throughout the logic fabric.

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I/O Capabilities: 624 HP I/O Pins

High-Performance (HP) I/O Banks

All 624 I/O pins on the XCKU085-3FLVA1517E in the FLVA1517 package are High-Performance (HP) I/O, supporting:

HP I/O banks are designed for high-speed memory interfaces and chip-to-chip communication, making this device ideal for DDR4 memory controllers, PCIe data paths, and high-speed sensor interfaces.

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Clock Management: Flexible Multi-Clock Design

ASIC-Like Clocking with CMTs

Kintex UltraScale devices use Clock Management Tiles (CMTs), each containing a Mixed-Mode Clock Manager (MMCM) and a Phase-Locked Loop (PLL). Key clocking capabilities include:

• Flexible clock synthesis, multiplication, and division
• Fine-grained phase shifting for timing closure
• Minimized clock skew across the entire device
• Tight integration with memory controller IP for high-speed DDR4 interfaces
• Support for Hybrid Memory Cube (HMC) serial memory protocols

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Transceiver Technology: High-Speed Serial Links

GTH Transceivers up to 16.3 Gb/s

The XCKU085-3FLVA1517E supports GTH transceivers, providing:

These hard IP blocks reduce FPGA fabric utilization and lower power consumption compared to soft implementations, freeing logic resources for application-specific workloads.

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Target Applications for XCKU085-3FLVA1517E

The XCKU085-3FLVA1517E excels in a wide range of high-performance applications.

Networking & Data Center

• 100G/40G line cards and network switches
• Deep packet inspection (DPI) engines
• High-frequency trading (HFT) acceleration

Wireless Infrastructure

• 4G LTE and 5G NR baseband processing
• Remote radio head (RRH) digital front-end (DFE)
• CPRI/eCPRI interface implementations

Defense & Aerospace

• Radar and sonar signal processing
• Secure communications and cryptography
• Electronic warfare (EW) systems

Medical Imaging

• High-resolution CT and MRI reconstruction
• Ultrasound beamforming
• Real-time image processing pipelines

Broadcast & Video

• 8K4K video processing
• Real-time video compression (HEVC, AVC)
• SDI and HDMI signal routing

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Development Tools & Ecosystem

Vivado Design Suite Support

The XCKU085-3FLVA1517E is fully supported by the AMD Vivado Design Suite, which provides:

• Design entry: RTL (VHDL, Verilog, SystemVerilog) and IP-based design
• Synthesis and implementation: Timing-driven place-and-route with ASIC-class results
• Simulation: Integrated simulation with industry-standard tools
• IP Integrator: Drag-and-drop block design environment
• Power analysis: AMD Power Estimator (XPE) for detailed power budgeting
• Debug: Integrated Logic Analyzer (ILA) and Virtual I/O (VIO) for in-system debug

Supported IP Cores

• DDR4 Memory Interface (MIG)
• PCIe Gen3 integrated block
• 100G Ethernet Subsystem
• JESD204B High-Speed ADC/DAC Interface
• Video Processing Subsystem

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XCKU085-3FLVA1517E vs. Other Speed Grades

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Ordering Information & Part Number Variants

The XCKU085 device is available in multiple package and speed grade configurations:

Package Footprint Compatibility: All XCKU085 variants with the same package suffix (e.g., A1517) are footprint-compatible with each other and with other UltraScale architecture devices sharing the same package code. This simplifies PCB design by enabling speed-grade or density migration without board changes.

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Frequently Asked Questions (FAQ)

What does the “E” suffix mean in XCKU085-3FLVA1517E?

The “E” suffix denotes the commercial temperature grade, rated for junction temperatures from 0°C to +100°C. This is the standard grade for commercial and industrial electronics applications that operate within controlled environments.

What is the core supply voltage for XCKU085-3FLVA1517E?

The VCCINT (core supply voltage) for speed grade -3 devices operates at 0.95V. The device must not be configured until after VCCINT has been properly applied and has passed through the power-on reset threshold.

Is the XCKU085-3FLVA1517E RoHS compliant?

Yes. The XCKU085-3FLVA1517E is fully RoHS compliant, meeting global environmental regulations for the restriction of hazardous substances.

What design tool is required for the XCKU085-3FLVA1517E?

The device is supported exclusively by the AMD Vivado Design Suite. Older tools such as Xilinx ISE do not support UltraScale architecture devices.

How does SSI technology in XCKU085 affect design?

The XCKU085 uses Stacked Silicon Interconnect (SSI) technology, incorporating multiple super-logic regions (SLRs). Designs that span SLRs must use dedicated crossing resources (Super Long Lines). Vivado automatically manages SLR crossing during placement and routing.

Can XCKU085-3FLVA1517E be used for PCIe Gen3 applications?

Yes. The XCKU085-3FLVA1517E includes a hardened PCIe Gen3 integrated block, supporting up to Gen3 x8 configurations, with hardware acceleration for TLP (Transaction Layer Packet) processing.

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Summary

The XCKU085-3FLVA1517E stands as one of the most capable mid-range FPGAs on the market. With 1,088,325 logic cells, 6,840 DSP slices, 75.9 Mb of Block RAM, 624 HP I/O pins, and GTH transceivers supporting up to 16.3 Gb/s — all delivered at the highest (-3) speed grade — this device is built for engineers who demand maximum programmable logic performance in a cost-optimized 20nm package.

Its UltraScale ASIC-class architecture, DDR4 and PCIe Gen3 hard IP, and full AMD Vivado tool ecosystem make it an industry-leading choice for networking, wireless, defense, and high-performance computing applications.