The XCKU085-2FLVF1924I is a high-performance, mid-range Xilinx FPGA from AMD’s Kintex UltraScale family. Built on a proven 20nm process node with SSI (Stacked Silicon Interconnect) technology, this device delivers an exceptional balance of DSP processing power, memory bandwidth, and high-speed serial connectivity — making it a top choice for demanding applications in 100G networking, medical imaging, 8K video processing, and wireless infrastructure.

Whether you are designing next-generation line cards, radar signal processors, or high-throughput data acquisition systems, the XCKU085-2FLVF1924I offers the resources and flexibility to meet your most demanding requirements.

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What Is the XCKU085-2FLVF1924I?

The XCKU085-2FLVF1924I is a member of the Kintex UltraScale FPGA family manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

This device sits in the upper tier of the Kintex UltraScale lineup, offering over 1 million system logic cells and massive on-chip memory resources, housed in a 1924-pin FCBGA package rated for industrial environments.

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XCKU085-2FLVF1924I Key Specifications at a Glance

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XCKU085-2FLVF1924I Detailed Technical Specifications

Logic Resources

The XCKU085 device utilizes the UltraScale Configurable Logic Block (CLB) architecture, where each CLB contains 8 LUTs and 16 flip-flops. The LUTs can be configured as 6-input single-output LUTs or as dual 5-input LUTs with shared inputs, providing exceptional flexibility.

Each SLICEM slice can configure its LUTs as 64-bit distributed RAM or 32-bit shift registers (SRL32), enabling highly efficient on-fabric memory and data pipeline implementations.

Memory Resources

The XCKU085-2FLVF1924I includes substantial on-chip memory for high-bandwidth data buffering and intermediate storage, reducing the need for external memory in many applications.

Block RAMs feature built-in FIFO support, ECC (Error Correction Code) logic, and hardened cascade connections. This allows multi-megabit FIFO implementations with zero CLB fabric overhead.

DSP and Signal Processing Resources

The XCKU085 is equipped with 2,760 DSP48E2 slices, each featuring a 27×18-bit multiplier, 96-bit XOR function, 30-bit A-input, and a 27-bit pre-adder. This makes it one of the most powerful mid-range FPGAs for signal processing workloads.

The DSP48E2 slice supports multiply-accumulate (MAC), multiply-add, pattern detection, and wide XOR operations — critical for applications in FEC encoding, radar signal chains, software-defined radio, and neural network inference.

High-Speed Serial Transceivers (GTH)

The XCKU085-2FLVF1924I integrates 32 GTH transceivers capable of operating at up to 16.3 Gb/s per lane. These support a wide range of industry-standard protocols.

The GTH transceivers feature advanced equalization, clock data recovery (CDR), and support for both optical and electrical backplane interfaces.

PCI Express and Hard IP Blocks

These hardened IP blocks offload significant logic fabric resources compared to soft implementations, freeing CLBs for user logic while achieving line-rate 100G Ethernet performance.

Clock Management

The MMCM (Mixed-Mode Clock Manager) supports fractional division, phase shifting, and dynamic reconfiguration — enabling complex multi-clock domain designs with minimal jitter.

I/O and Package Information

The 1924-pin FCBGA package for the XCKU085-2FLVF1924I provides the highest I/O count in the XCKU085 product line.

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Industrial Temperature Grade: What “-I” Means for the XCKU085-2FLVF1924I

The trailing “I” in the XCKU085-2FLVF1924I part number designates the Industrial temperature grade, meaning the device is tested and guaranteed to operate reliably across the full –40°C to +100°C junction temperature range. This is critical for:

• Embedded systems deployed in harsh outdoor environments
• Defense and aerospace electronics operating at extreme temperatures
• Industrial automation and motor control with high ambient temperatures
• Automotive-adjacent systems requiring extended thermal ruggedness

Commercial-grade parts (suffix “C”) are rated only from 0°C to 85°C junction temperature and are not suitable for environments where temperature excursions occur.

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Kintex UltraScale Architecture Advantages

Why Choose Kintex UltraScale Over Previous Generations?

The Kintex UltraScale family represents AMD Xilinx’s 20nm generation, offering key benefits compared to prior 28nm Kintex-7 devices:

The transition to 20nm and the UltraScale architecture also brings ASIC-like clocking with fine-grained clock gating, substantially reducing dynamic power consumption in designs where not all logic is active simultaneously.

SSI Technology in the XCKU085

The XCKU085 device uses Stacked Silicon Interconnect (SSI) technology, integrating multiple smaller dies (Super Logic Regions, or SLRs) onto a single passive silicon interposer. This approach allows AMD Xilinx to manufacture a device with over 1 million logic cells at higher yield than a single monolithic die would permit, while still appearing as a unified device to the designer.

The SLR boundaries carry dedicated high-bandwidth, low-latency interconnect resources, so crossing between regions incurs minimal timing penalty when properly planned in the Vivado Design Suite.

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Supported Design Tools for XCKU085-2FLVF1924I

The XCKU085-2FLVF1924I is fully supported by AMD’s Vivado Design Suite, including:

• Vivado ML Edition – Full synthesis, place-and-route, timing analysis
• Xilinx Power Estimator (XPE) – Accurate pre-implementation power estimation
• Vivado IP Integrator – Block design for rapid IP integration (PCIe, 100GbE, DDR4, etc.)
• Vitis HLS – High-Level Synthesis from C/C++ for DSP and algorithm accelerators
• SmartLytics / Vivado Simulator – Design verification

There is no support for the legacy ISE Design Suite; Vivado is the required toolchain for all UltraScale family devices.

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Typical Application Areas for the XCKU085-2FLVF1924I

The combination of high DSP density, 100G Ethernet hard IP, 32 GTH transceivers, and industrial temperature rating makes the XCKU085-2FLVF1924I well-suited for the following markets and applications:

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XCKU085-2FLVF1924I vs. Other XCKU085 Variants

The XCKU085 device is available in several package and speed grade combinations. The table below compares key variants to help select the right part number for your design.

The -2 speed grade provides the best balance of performance and availability for most industrial designs. The -1L low-power variant operates at a reduced VCCINT of 0.90V for the lowest static power, though with slightly reduced timing performance.

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Frequently Asked Questions About the XCKU085-2FLVF1924I

What is the XCKU085-2FLVF1924I?

The XCKU085-2FLVF1924I is a Kintex UltraScale FPGA made by AMD Xilinx, featuring approximately 1,088,325 system logic cells, 2,760 DSP slices, 38 Mb of Block RAM, and 32 GTH transceivers — all in an industrial-grade 1924-pin FCBGA package.

What temperature range does the -I suffix indicate?

The “I” suffix indicates the Industrial temperature grade, meaning the device is rated for junction temperatures from –40°C to +100°C, suitable for harsh or outdoor deployment environments.

What tools are used to program the XCKU085-2FLVF1924I?

The XCKU085-2FLVF1924I is programmed and configured using AMD’s Vivado Design Suite and Xilinx-compatible JTAG or SPI configuration interfaces. Vitis and Vitis HLS are used for high-level and embedded design flows.

Is the XCKU085-2FLVF1924I RoHS compliant?

Yes. The XCKU085-2FLVF1924I is RoHS compliant, in accordance with EU Directive 2011/65/EU restricting hazardous substances in electronic equipment.

How does the XCKU085 compare to the XCKU115?

The XCKU115 is the larger sibling of the XCKU085 and offers significantly more resources — including more DSP slices and Block RAM blocks — while the XCKU085 provides a more cost-efficient option for designs that do not require the maximum capacity of the KU115.

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Ordering Information

Note: The XCKU085-2FLVF1924I is a production-status device. Always verify availability and lead times with your authorized distributor, as FPGA supply can vary with market conditions.

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Summary

The XCKU085-2FLVF1924I is a proven, industrial-grade Kintex UltraScale FPGA that delivers outstanding DSP performance, hardened 100G Ethernet and PCIe Gen3 connectivity, and a rich complement of high-speed GTH transceivers — all within a robust –40°C to +100°C operating envelope. With over 1 million system logic cells, 2,760 DSP slices, and 38 Mb of Block RAM housed in the high-density 1924-pin FCBGA package, it serves as a powerful platform for 100G networking, wireless baseband processing, medical imaging, and ASIC prototyping applications where both performance and reliability are non-negotiable.