The XCKU085-2FLVF1924E is a high-performance, mid-range Xilinx FPGA from AMD’s Kintex UltraScale family, engineered to deliver an exceptional balance of logic density, DSP throughput, memory bandwidth, and power efficiency. Built on TSMC’s 20nm process node and the industry-leading UltraScale architecture, this device is a top choice for engineers working on 100G networking, advanced signal processing, wireless infrastructure, and high-resolution video systems.
What Is the XCKU085-2FLVF1924E?
The XCKU085-2FLVF1924E is a Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), part of the Kintex UltraScale series. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 085 |
Device Size / Logic Density (085 tier) |
| -2 |
Speed Grade 2 (mid-range performance) |
| FLV |
Flip-chip, Low-Voltage, Fine-pitch BGA |
| F1924 |
1924-pin package footprint |
| E |
Extended temperature range (0°C to 100°C) |
This device sits between the XCKU060 and XCKU095 in the Kintex UltraScale lineup, offering a powerful combination of logic resources and I/O connectivity in a production-proven package.
XCKU085-2FLVF1924E Key Specifications
General Device Specifications
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU085-2FLVF1924E |
| Series |
Kintex UltraScale |
| Technology Node |
20nm |
| Architecture |
UltraScale |
| Package Type |
1924-FCBGA (Flip-Chip Ball Grid Array) |
| Package Size |
45 mm × 45 mm |
| Speed Grade |
-2 |
| Operating Temperature |
0°C to 100°C (Extended) |
| Supply Voltage (VCCINT) |
0.95V |
| Mount Type |
Surface Mount |
| RoHS Status |
RoHS3 Compliant |
Logic Resources
| Resource |
Quantity |
| System Logic Cells |
1,088,325 |
| Configurable Logic Blocks (CLBs) |
62,190 |
| LUT Elements |
~497,520 |
| Flip-Flops |
~995,040 |
| DSP48E2 Slices |
2,760 |
| Total RAM Bits |
58,265,600 |
| Block RAM (36K tiles) |
792 |
| UltraRAM (288Kb tiles) |
0 (UltraScale, not UltraScale+) |
I/O and Connectivity
| Parameter |
Value |
| User I/O Pins |
624 |
| Total Package Pins |
1924 |
| GTH Transceiver Count |
32 |
| GTH Line Rate (max) |
Up to 16.3 Gb/s |
| PCIe Gen3 Hard Blocks |
2 × PCIe Gen3 x8 |
| 100G Ethernet |
Supported |
| 150G Interlaken |
Supported |
| DDR4 / DDR3 Memory Interface |
Supported |
| Hybrid Memory Cube (HMC) |
Supported |
Clock Management
| Feature |
Detail |
| CMTs (Clock Management Tiles) |
Multiple MMCMs and PLLs |
| Global Clock Networks |
Low-skew, ASIC-like clocking |
| Max Clock Frequency |
661 MHz (speed grade -2) |
| Clock Gating |
Fine-granular, UltraScale architecture |
XCKU085-2FLVF1924E Architecture Deep Dive
### UltraScale Architecture: Why It Matters
The UltraScale architecture is AMD Xilinx’s 20nm programmable logic platform, designed to eliminate the traditional routing bottlenecks found in earlier 28nm FPGAs. Key innovations include:
- ASIC-like clocking: Deterministic, low-skew clock distribution across the entire device minimizes setup/hold violations in high-speed synchronous designs.
- Scalable routing fabric: Increased routing resources allow higher device utilization without timing degradation, enabling engineers to achieve higher logic density than previous generations.
- Stacked Silicon Interconnect (SSI) technology: For the XCKU085, SSI-based die stacking enables the large logic count while maintaining high inter-die bandwidth.
### DSP and Signal Processing Capabilities
The XCKU085-2FLVF1924E includes 2,760 DSP48E2 slices, each featuring a pre-adder, 27×18 multiplier, and 48-bit accumulator. This architecture enables engineers to build:
- High-throughput FIR and IIR digital filters
- Fast Fourier Transform (FFT) pipelines
- Beamforming algorithms for radar and wireless systems
- Baseband processing chains for 4G/5G LTE infrastructure
- Floating-point arithmetic pipelines
### Memory Architecture
The device integrates large amounts of on-chip memory, including:
- Block RAM (BRAM) with optional ECC for reliable data storage
- Distributed RAM derived from the LUT fabric
- DDR4/DDR3 external memory interface support for high-bandwidth off-chip storage
- Hybrid Memory Cube (HMC) interface for next-generation serial memory applications
### High-Speed Serial Transceivers (GTH)
With 32 GTH transceivers running at up to 16.3 Gb/s per lane, the XCKU085-2FLVF1924E supports demanding multi-protocol serial connectivity:
| Protocol |
Support |
| PCIe Gen3 x8 |
2 Hard Blocks |
| 100G Ethernet (CAUI-4) |
Yes |
| 150G Interlaken |
Yes |
| CPRI / eCPRI |
Yes |
| JESD204B |
Yes |
| Serial RapidIO |
Yes |
Part Number Comparison: XCKU085 Family Variants
The XCKU085 is available in multiple speed grades, packages, and temperature ranges. Use the table below to identify the right variant for your design:
| Part Number |
Speed Grade |
Package |
Pins |
Temperature |
Voltage |
| XCKU085-3FLVF1924E |
-3 (Fastest) |
FCBGA |
1924 |
Extended (0–100°C) |
1.0V |
| XCKU085-2FLVF1924E |
-2 |
FCBGA |
1924 |
Extended (0–100°C) |
0.95V |
| XCKU085-1FLVF1924C |
-1 |
FCBGA |
1924 |
Commercial (0–85°C) |
0.95V |
| XCKU085-2FLVB1760E |
-2 |
FCBGA |
1760 |
Extended (0–100°C) |
0.95V |
| XCKU085-2FLVA1517E |
-2 |
FCBGA |
1517 |
Extended (0–100°C) |
0.95V |
| XCKU085-L1FLVF1924I |
-1L (Low Power) |
FCBGA |
1924 |
Industrial (–40–100°C) |
0.90V |
Note: The “E” suffix denotes Extended commercial temperature range (0°C to 100°C). Industrial variants carrying “I” support –40°C to 100°C.
XCKU085-2FLVF1924E vs. Adjacent Kintex UltraScale Devices
| Feature |
XCKU060 |
XCKU085 |
XCKU095 |
XCKU115 |
| Logic Cells |
726,000 |
1,088,325 |
1,143,000 |
1,451,000 |
| DSP48E2 Slices |
2,760 |
2,760 |
2,760 |
3,456 |
| Block RAM Bits |
38Mb |
58Mb |
67Mb |
75Mb |
| GTH Transceivers |
32 |
32 |
48 |
64 |
| Max User I/O |
520 |
624 |
624 |
624 |
| PCIe Gen3 Hard Blocks |
2 |
2 |
3 |
4 |
Target Applications for the XCKU085-2FLVF1924E
### 100G Networking and Data Center
The combination of PCIe Gen3 hard blocks, 100G Ethernet support, and 150G Interlaken connectivity makes the XCKU085-2FLVF1924E an ideal fit for:
- 100G line cards and switch fabric implementations
- Network packet processing and traffic management
- Deep packet inspection (DPI) engines
- FPGA-accelerated server SmartNICs
### Wireless Infrastructure (4G/5G)
Telecom and wireless equipment manufacturers rely on the XCKU085’s high DSP count and JESD204B transceiver support for:
- Remote Radio Head (RRH) digital front-end (DFE) designs (8×8 100 MHz TD-LTE)
- Heterogeneous wireless infrastructure base stations
- Massive MIMO beamforming systems
- eCPRI fronthaul interfaces
### Broadcast and Professional Video
With support for 8K/4K ultra-high-definition video processing and high I/O bandwidth, the XCKU085 is widely used in:
- Real-time 8k4k video compression and decompression
- Broadcast routing switchers
- Medical imaging systems with high-resolution pipelines
- Video over IP (SMPTE ST 2110) infrastructure
### Aerospace, Defense, and Industrial
The device’s extended temperature range (0°C to 100°C), RoHS3 compliance, and robust transceiver architecture support demanding environments:
- Radar signal processing
- Software-defined radio (SDR) implementations
- Industrial automation controllers
- High-reliability instrumentation
Development Tools and Design Support
AMD provides comprehensive tooling for XCKU085-2FLVF1924E design and implementation:
| Tool |
Purpose |
| Vivado Design Suite |
Synthesis, place & route, implementation, timing analysis |
| Vitis Unified Software Platform |
High-level synthesis (HLS), software development |
| Xilinx Power Estimator (XPE) |
Accurate power budgeting and thermal planning |
| IP Integrator |
Block-level design with pre-verified Xilinx IP cores |
| ChipScope Pro / ILA |
In-system debug and logic analysis |
Vivado fully supports the XCKU085 family and includes timing closure features optimized for UltraScale’s ASIC-like clocking methodology.
Ordering Information
| Attribute |
Detail |
| Full Part Number |
XCKU085-2FLVF1924E |
| Manufacturer |
AMD (Xilinx) |
| DigiKey Part # |
1108-XCKU085-2FLVF1924ECT-ND |
| Package |
1924-FCBGA |
| Packaging |
Tray |
| Lead Time |
Contact distributor — availability varies |
| RoHS |
Compliant (RoHS3) |
| ECCN |
3A991 |
Frequently Asked Questions (FAQ)
Q: What is the difference between the -2 and -3 speed grade on the XCKU085? The -3 speed grade (XCKU085-3FLVF1924E) operates at VCCINT = 1.0V and delivers the highest timing performance in the family. The -2 speed grade runs at 0.95V and offers slightly lower maximum clock frequencies but reduced static power — making it the most popular choice for high-performance commercial designs.
Q: Is the XCKU085-2FLVF1924E pin-compatible with other XCKU085 variants? Yes. All XCKU085 devices in the 1924-pin FCBGA package (FLVF1924) are pin-compatible, allowing designers to migrate between speed grades without PCB changes.
Q: What memory interfaces does the XCKU085-2FLVF1924E support? The device supports DDR4, DDR3, LPDDR3, QDR II+, and Hybrid Memory Cube (HMC) interfaces via dedicated hard memory controllers and calibration logic.
Q: Can I use the XCKU085-2FLVF1924E for partial reconfiguration? Yes. AMD Vivado fully supports partial reconfiguration (PR) for UltraScale devices, enabling dynamic reprogramming of isolated regions while the rest of the device continues operating.
Q: What is the XCKU085-2FLVF1924E operating temperature range? The “E” suffix denotes the Extended commercial temperature range: 0°C to 100°C junction temperature. For industrial temperature (–40°C to 100°C), use the “I” suffix variants.
Summary
The XCKU085-2FLVF1924E is one of the most capable mid-range FPGAs available in AMD’s portfolio. With over 1 million logic cells, 2,760 DSP slices, 624 user I/O pins, and 32 GTH transceivers in a proven 1924-pin FCBGA package, it provides the resources needed for today’s most demanding FPGA applications — from 5G wireless and 100G networking to broadcast video and defense electronics. Its extended temperature rating, RoHS3 compliance, and comprehensive Vivado tool support make it a production-ready choice for commercial and industrial designs alike.
