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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
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XCKU085-2FLVB1760I: AMD Xilinx Kintex UltraScale FPGA – Complete Product Guide

Product Details

The XCKU085-2FLVB1760I is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Engineered at 20nm process technology, this device delivers an exceptional balance of signal processing bandwidth, DSP throughput, and I/O density — making it a top choice for engineers designing next-generation telecom, data center, medical imaging, and video processing systems.

If you are looking for a powerful mid-range Xilinx FPGA that combines industrial-grade reliability with advanced UltraScale architecture, the XCKU085-2FLVB1760I is a compelling solution.


What Is the XCKU085-2FLVB1760I?

The XCKU085-2FLVB1760I is a member of AMD’s Kintex UltraScale FPGA family — a device series purpose-built to achieve the best price-per-performance-per-watt ratio at the 20nm node. The part number decodes as follows:

Part Number Field Meaning
XCKU085 Kintex UltraScale, 085 device size
-2 Speed grade 2 (mid-range performance)
FLVB Flip-chip Low Voltage Ball grid array, B package size
1760 1760 total package pins
I Industrial temperature range (–40°C to +100°C)

This device is manufactured by AMD (Xilinx) and is distributed through authorized channels including DigiKey (part number: XCKU085-2FLVB1760I-ND).


XCKU085-2FLVB1760I Key Specifications

Core Device Parameters

Parameter Value
Manufacturer AMD (Xilinx)
Series Kintex® UltraScale™
Part Number XCKU085-2FLVB1760I
Logic Cells 1,088,325
System Logic Cells 870,660
Process Node 20nm
Core Voltage (VCCINT) 0.95V
Speed Grade –2
Temperature Range Industrial: –40°C to +100°C
Package Type 1760-BBGA, FCBGA (Flip-Chip Ball Grid Array)
Total Package Pins 1760
User I/O Pins 676
RoHS Compliant Yes

Logic and Memory Resources

Resource Quantity
Logic Cells 1,088,325
CLB Flip-Flops 1,045,440
CLB LUTs 522,720
Block RAM (36Kb Blocks) 1,080
Total Block RAM 38.0 Mb
DSP Slices (DSP48E2) 2,760
Ultra RAMs (288Kb) 0 (KU085 monolithic)

Clocking and Connectivity Resources

Resource Quantity
CMTs (Clock Management Tiles) 12
MMCMs 12
PLLs 12
GTH Transceivers (16.3 Gb/s) 32
PCIe Gen3 x8 Hard Blocks 2
100G Ethernet MACs 2
150G Interlaken 2
Max Clock Frequency 661 MHz

Package and Physical Characteristics

Parameter Value
Package FCBGA (Flip-Chip Ball Grid Array)
Pin Count 1760
Package Designation FLVB1760
Mounting Type Surface Mount
Operating Voltage 0.95V (VCCINT)
Operating Temperature –40°C to +100°C (Industrial)

XCKU085-2FLVB1760I Architecture Overview

## UltraScale Architecture: What Sets It Apart

The XCKU085-2FLVB1760I is built on AMD’s UltraScale architecture, the first ASIC-class programmable architecture to address the needs of next-generation system integration. Key architectural advantages include:

  • Advanced Routing Architecture: Eliminates the interconnect bottleneck found in previous 7-series devices, enabling near-ASIC routing efficiency.
  • Next-Generation CLBs: Configurable Logic Blocks with 8-input LUTs and enhanced carry logic for faster arithmetic operations.
  • Stacked Silicon Interconnect (SSI) Technology: While the XCKU085 uses a monolithic die, the UltraScale family supports SSI for larger devices, enabling seamless scaling.
  • UltraRAM (on select variants): High-density on-chip memory blocks that significantly reduce BOM costs in memory-intensive designs.

### DSP48E2 Slices: Signal Processing Powerhouse

With 2,760 DSP48E2 slices, the XCKU085-2FLVB1760I delivers exceptional fixed-point and floating-point signal processing capability. Each DSP48E2 slice supports:

  • Pre-adder, multiplier, and accumulator in a single clock cycle
  • Cascade connections for implementing large multipliers and filters
  • Optional pattern detection for overflow detection and counter auto-reset
  • 27×18-bit two’s complement multiplication

This makes the XCKU085-2FLVB1760I ideal for FFTs, FIR filters, matrix computations, and machine learning inference engines.


### GTH Transceivers: High-Speed Serial I/O

The 32 GTH transceivers support data rates up to 16.3 Gb/s, enabling high-bandwidth serial communication across a broad range of protocols:

Protocol Supported
PCIe Gen1/2/3 ✅ Yes
10GbE / 40GbE / 100GbE ✅ Yes
SATA / SAS ✅ Yes
JESD204B ✅ Yes
CPRI / OBSAI ✅ Yes
Aurora 8B/10B / 64B/66B ✅ Yes
Interlaken (150G) ✅ Yes
DisplayPort / HDMI (via soft IP) ✅ Yes

Decoding the Part Number: XCKU085-2FLVB1760I

Understanding the part number helps engineers quickly identify device capabilities and compare alternatives:

Segment Code Description
Family XC Xilinx/AMD Commercial
Device Family KU Kintex UltraScale
Device Size 085 Mid-to-high capacity KU device
Speed Grade 2 Standard performance (–1 lowest, –3 highest)
Package Type FLV Flip-chip Low Voltage
Package Size B B-size footprint
Pin Count 1760 1760 BGA balls
Temp Grade I Industrial (–40°C to +100°C)

XCKU085-2FLVB1760I vs. Similar Kintex UltraScale Devices

Feature XCKU085-2FLVB1760I XCKU060-2FFVA1156I XCKU115-2FLVB1760I
Logic Cells 1,088,325 580,440 1,160,880
DSP Slices 2,760 1,680 3,456
Block RAM (Mb) 38.0 21.1 44.2
GTH Transceivers 32 32 32
User I/O 676 520 702
Package / Pins FCBGA-1760 FCBGA-1156 FCBGA-1760
Temp Grade Industrial Industrial Industrial
Process Node 20nm 20nm 20nm

The XCKU085-2FLVB1760I offers a middle-ground solution: significantly more resources than the KU060 while sharing the same 1760-pin footprint as the larger KU115, providing a straightforward upgrade path.


Applications: Where Is the XCKU085-2FLVB1760I Used?

#### 100G Networking and Packet Processing

The combination of hard 100G Ethernet MACs, 150G Interlaken blocks, and 32 GTH transceivers makes the XCKU085-2FLVB1760I a natural fit for high-throughput network line cards, packet classifiers, and traffic management engines.

#### Wireless Infrastructure (5G / LTE)

CPRI and JESD204B transceiver support, combined with the massive DSP slice count, enables multi-antenna radio processing, beamforming, and digital pre-distortion (DPD) for next-generation wireless base stations.

#### Medical Imaging

The device’s high logic density and DSP resources support real-time CT, MRI, and ultrasound image reconstruction pipelines that demand simultaneous multi-channel data processing.

#### 8K Video and Broadcast

With sufficient LUT and BRAM density, the XCKU085-2FLVB1760I handles 8K/4K video processing tasks including multi-channel encode/decode, color space conversion, and video routing for broadcast infrastructure.

#### Data Center Acceleration

As a PCIe Gen3 x8-capable FPGA, it integrates directly into server platforms as an accelerator card for compression, encryption, database search, and AI inference offloading.

#### Defense and Aerospace (via equivalent -Q-grade variants)

While the XCKU085-2FLVB1760I targets industrial applications, its architecture mirrors military-grade counterparts used in radar signal processing, EW systems, and secure communications.


Development Tools and Ecosystem

#### Vivado Design Suite

AMD’s Vivado Design Suite is the primary design environment for all UltraScale devices. Vivado provides:

  • IP Integrator for block diagram-based design
  • Vivado HLS (High-Level Synthesis) for C/C++ to RTL
  • Hardware-in-the-Loop (HIL) debugging via JTAG
  • Power analysis via Xilinx Power Estimator (XPE)
  • Timing closure tools and advanced placement & routing algorithms

#### Available IP Cores

IP Category Examples
Networking 10G/25G/100G Ethernet MAC, PCIe Gen3
Memory DDR4/DDR3 MIG, HBM interfaces
Video HDMI 1.4/2.0 Rx/Tx, Video Timing Controller
DSP FFT, FIR Compiler, DDS Compiler
Compression GZIP, LZ4, Zlib
Security AES-256, SHA-3, RSA

Ordering Information

Field Details
Manufacturer Part Number XCKU085-2FLVB1760I
Manufacturer AMD (Xilinx)
DigiKey Part Number XCKU085-2FLVB1760I-ND
Package 1760-BBGA, FCBGA
Temperature Grade Industrial (–40°C to +100°C)
RoHS Status Compliant
Lead-Free Yes
Moisture Sensitivity Level MSL 3 (168 Hours)

Frequently Asked Questions (FAQ)

Q: What is the difference between the XCKU085-2FLVB1760I and XCKU085-1FLVB1760I? The “-2” speed grade variant operates at a higher maximum clock frequency and offers tighter timing margins compared to the “-1” grade. The “-2” is the standard production speed grade, while “-1” is a lower-cost, lower-performance option.

Q: Is the XCKU085-2FLVB1760I RoHS compliant? Yes, the XCKU085-2FLVB1760I is fully RoHS compliant and lead-free.

Q: What programming tools are required for the XCKU085-2FLVB1760I? AMD Vivado Design Suite 2014.4 or later is required. The device is also supported by the Vitis unified software platform for hardware acceleration use cases.

Q: What is the core supply voltage for this FPGA? The VCCINT (core voltage) is 0.95V. Auxiliary voltages (VCCAUX, VCCO) vary by I/O standard.

Q: Can the XCKU085-2FLVB1760I support DDR4 memory interfaces? Yes, using the Xilinx Memory Interface Generator (MIG), the device supports DDR4 interfaces at speeds up to 2,400 Mb/s, limited by I/O bank voltage and pin selection.

Q: What is the maximum transceiver data rate? The GTH transceivers support line rates up to 16.3 Gb/s per lane.


Summary

The XCKU085-2FLVB1760I is one of AMD Xilinx’s most capable mid-range FPGAs, delivering over one million logic cells, 2,760 DSP slices, 38 Mb of block RAM, and 32 high-speed GTH transceivers — all in an industrial-grade 1760-pin FCBGA package. Its 20nm UltraScale architecture enables performance levels that were previously only achievable in much more expensive, higher-power devices, making it an outstanding choice for telecom, data center, medical, and broadcast applications that demand performance, flexibility, and proven reliability.

For engineers building complex, high-throughput digital systems, the XCKU085-2FLVB1760I represents a mature, well-supported platform backed by AMD’s comprehensive IP ecosystem and Vivado toolchain.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.