The XCKU085-2FLVB1760E is a high-performance Xilinx FPGA from the Kintex UltraScale family, built on TSMC’s 20nm process node. Designed for applications that demand the highest signal processing bandwidth at mid-range power consumption, this device combines advanced logic density, next-generation GTH transceivers, and a large 1760-pin FCBGA package to deliver an optimum blend of capability and cost-efficiency.

Whether you are designing for wireless communications, test and measurement, video processing, or high-performance computing, the XCKU085-2FLVB1760E offers the programmable fabric and on-chip resources to meet demanding system requirements.

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What Is the XCKU085-2FLVB1760E?

The XCKU085-2FLVB1760E is part of AMD/Xilinx’s Kintex UltraScale product line — a mid-range FPGA family that targets price/performance/watt efficiency at the 20nm technology node. The part number breaks down as follows:

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XCKU085-2FLVB1760E Key Specifications

The table below summarizes the core technical specifications for the XCKU085-2FLVB1760E FPGA.

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XCKU085-2FLVB1760E Logic and Processing Resources

H3: Programmable Logic Fabric

The XCKU085 provides a large and highly capable programmable logic fabric. With 1,088,325 logic cells and 497,520 configurable logic blocks (CLBs), this device can accommodate even the most complex digital designs. The UltraScale architecture introduces a next-generation SLICE structure with improved routing flexibility compared to the previous 7 Series generation.

Each CLB contains LUT6-based look-up tables and flip-flops, enabling high utilization rates across complex parallel processing algorithms, DSP pipelines, and finite state machines.

H3: DSP Slices

The XCKU085 is equipped with a large array of DSP48E2 slices, optimized for high-throughput arithmetic and signal processing applications. These DSP slices support:

• Pre-adder for symmetric FIR filters
• 27×18 multiplier with 48-bit accumulator
• Optional pipeline registers for maximum frequency performance
• SIMD arithmetic for parallel data paths

This makes the XCKU085-2FLVB1760E an excellent platform for OFDM processing, radar signal processing, image processing, and software-defined radio (SDR) applications.

H3: Block RAM and Memory Architecture

The device contains a large pool of on-chip block RAM, totaling 58,266 Kbits of BRAM. These 36Kb dual-port RAM blocks can be configured as 36Kb or split into two independent 18Kb blocks, supporting:

• True dual-port (TDP) operation
• Simple dual-port (SDP) configurations
• FIFO primitives
• ECC protection for fault-tolerant memory storage

The Kintex UltraScale architecture also leverages SSI (Stacked Silicon Interconnect) technology to deliver exceptionally high memory bandwidth between die regions for larger fabric configurations.

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Package and Electrical Characteristics

H3: FCBGA-1760 Package Details

The XCKU085-2FLVB1760E is housed in an FCBGA (Flip-Chip Ball Grid Array) package with 1,760 solder balls. This low-voltage flip-chip package enables dense PCB routing and is optimized for high-speed signal integrity on multi-layer boards.

H3: Power Supply Requirements

The -2 speed grade operates at the standard 0.95V VCCINT, providing a good balance between performance and power efficiency. For designs with the tightest power budgets, the -1L low-voltage variant is available.

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Connectivity and High-Speed Interfaces

H3: GTH High-Speed Transceivers

One of the defining features of the XCKU085-2FLVB1760E is its complement of GTH transceivers, which support multi-gigabit serial connectivity up to 16.3 Gbps per channel. These transceivers are built for:

• PCIe Gen1/2/3 connectivity
• 10GbE, 25GbE, and 100G Ethernet
• CPRI and JESD204B for wireless infrastructure
• Aurora and XAUI protocols
• Interlaken (up to 150G aggregate bandwidth)

H3: PCIe Hard IP Block

The XCKU085 includes a hardened PCIe Gen3 x8 endpoint and root port block, reducing logic utilization and enabling full-bandwidth PCIe operation without consuming programmable fabric. This is ideal for:

• Embedded computing acceleration cards
• FPGA-based data acquisition boards
• High-performance computing (HPC) accelerators

H3: Memory Interface Support

The device natively supports external DDR4 and DDR3 SDRAM interfaces through dedicated high-performance (HP) I/O banks and hardened memory IP, with support for:

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Clock Management and Timing

H3: Clock Management Tiles (CMTs)

The XCKU085-2FLVB1760E includes multiple Clock Management Tiles (CMTs), each containing one Mixed-Mode Clock Manager (MMCM) and one Phase-Locked Loop (PLL). These components provide:

• Clock synthesis and multiplication
• Fine-grained phase shifting
• Spread-spectrum clock generation (SSCG)
• De-jitter and clock filtering

The device’s clock routing fabric supports extremely flexible global and regional clock trees, minimizing skew and enabling timing closure across complex multi-clock domain designs.

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Temperature Range and Reliability

The “E” suffix in XCKU085-2FLVB1760E denotes the Extended commercial temperature range, which covers operation from 0°C to +100°C junction temperature. This makes it suitable for:

• Telecom and networking equipment (line cards, base stations)
• Test and measurement instruments
• Industrial control systems
• Data center acceleration hardware

For harsh or wide-temperature applications (–40°C to +100°C), the “I” (industrial) suffix variants are available.

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Development Tools and Software Support

H3: Vivado Design Suite

The XCKU085-2FLVB1760E is fully supported by AMD’s Vivado Design Suite, which provides a unified environment for synthesis, implementation, simulation, and debug. Vivado’s incremental compilation and hierarchical design features are critical for managing the large design complexity that this device enables.

H3: Vitis Unified Software Platform

For teams building hardware-accelerated applications, AMD Vitis provides a high-level development environment that abstracts FPGA programming into software-like workflows using C/C++ and OpenCL, with automatic generation of hardware accelerators via high-level synthesis (HLS).

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Typical Applications for XCKU085-2FLVB1760E

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XCKU085-2FLVB1760E vs. Related Kintex UltraScale Variants

Understanding how this specific part compares to other variants in the same family helps buyers make the right selection.

The -2 speed grade in the XCKU085-2FLVB1760E offers a solid performance-per-dollar balance, faster than the base -1 grade but at a lower cost than the maximum-performance -3 variant.

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Ordering Information

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Frequently Asked Questions (FAQ)

Q: What does the “-2” speed grade mean on the XCKU085-2FLVB1760E? A: The -2 denotes a mid-range speed grade in the Kintex UltraScale family. Speed grades range from -1 (slowest) to -3 (fastest), with -2 offering a balance of performance and cost. Lower speed grades (e.g., -1L) also offer lower power variants.

Q: Is the XCKU085-2FLVB1760E RoHS compliant? A: Yes, this device is fully RoHS compliant, making it suitable for use in consumer, industrial, and telecom products that must meet EU environmental regulations.

Q: What design tools are required for the XCKU085-2FLVB1760E? A: AMD’s Vivado Design Suite is the primary tool for RTL synthesis, implementation, and bitstream generation. For high-level synthesis, the Vitis HLS tool is recommended.

Q: Can the XCKU085-2FLVB1760E support PCIe Gen3? A: Yes. The device includes a hardened PCIe Gen3 x8 IP block, enabling full PCIe bandwidth without consuming programmable logic resources.

Q: What is the maximum data rate of the GTH transceivers? A: The GTH transceivers in the Kintex UltraScale devices support line rates up to 16.3 Gbps per channel.

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Summary

The XCKU085-2FLVB1760E is a versatile and powerful FPGA platform for engineers who require the highest signal processing bandwidth in a mid-range device. With over 1 million logic cells, 676 user I/Os in a 1760-pin FCBGA package, hardened PCIe Gen3, 100G Ethernet support, and multi-gigabit GTH transceivers — all built on a 20nm process — it delivers exceptional compute density, connectivity, and power efficiency. Supported by AMD’s Vivado and Vitis tool chains, this device enables rapid design iteration and deployment across communications, computing, industrial, and defense markets.