The XCKU085-1FLVF1924I is a high-performance Xilinx FPGA from AMD’s Kintex® UltraScale™ family. Built on advanced 20nm process technology, this IC delivers over one million logic cells, 624 user I/O pins, and a massive 1,924-pin FCBGA package — making it one of the most capable mid-range FPGAs available for high-density, signal-processing-intensive applications.

Whether you are designing for 100G networking, advanced DSP pipelines, medical imaging, or wireless infrastructure, the XCKU085-1FLVF1924I provides the logic resources, transceivers, and power efficiency to meet the most demanding system requirements.

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What Is the XCKU085-1FLVF1924I?

The XCKU085-1FLVF1924I is part of the Kintex UltraScale device family manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

This device is rated for industrial temperature operation, meaning it is suitable for environments requiring extended reliability beyond commercial-grade components.

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XCKU085-1FLVF1924I Key Specifications

The table below summarizes the core technical parameters of the XCKU085-1FLVF1924I as documented in the AMD/Xilinx Kintex UltraScale datasheet (DS892):

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XCKU085-1FLVF1924I Logic & Memory Resources

Configurable Logic Blocks (CLBs) and Logic Cells

The XCKU085-1FLVF1924I integrates 62,190 CLBs with a total of 1,088,325 logic cells. Each CLB in the UltraScale architecture contains two slices — each with 8 six-input LUTs (Look-Up Tables), 16 flip-flops, and carry chain logic — providing exceptional logic density for complex state machines, bus interfaces, and control path implementation.

Block RAM and Distributed RAM

The large on-chip memory pool makes the XCKU085-1FLVF1924I well-suited for packet buffering, look-up tables, coefficient storage, and frame buffering in video or communication applications.

DSP Slices (DSP48E2)

The device includes a large complement of DSP48E2 slices featuring pre-adders, 27×18 multipliers, and 48-bit accumulators. These resources enable highly efficient fixed-point and floating-point arithmetic for:

• FIR/IIR digital filtering
• FFT and DFT computation
• Beamforming and MIMO processing
• Baseband signal processing in wireless systems

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Package and I/O Details

1924-Pin FCBGA Package

The 1924-pin FCBGA package provides an extensive ball grid array footprint. With 624 available user I/O pins, designers can connect high-pin-count memories (DDR4/DDR3), parallel buses, and multi-channel serial interfaces simultaneously.

I/O Standards and Voltage Compatibility

The XCKU085-1FLVF1924I supports a broad range of industry-standard I/O standards through its High-Performance (HP) and High-Range (HR) I/O banks:

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Serial Transceivers and High-Speed Connectivity

One of the defining strengths of the Kintex UltraScale family is its next-generation GTH and GTY transceivers, which the XCKU085 platform incorporates for multi-protocol, high-speed serial connectivity.

This makes the XCKU085-1FLVF1924I an ideal solution for line cards, networking ASICs replacements, wireless radio units, and data center acceleration boards where protocol flexibility and raw bandwidth matter most.

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Clock Management and Timing Resources

The XCKU085-1FLVF1924I features the UltraScale ASIC-like clocking architecture, which provides precise clock distribution with minimal skew across the entire device.

The low-skew global routing combined with MMCM fractional dividers enables the device to support highly demanding multi-clock domain designs, synchronous DDR interfaces, and multi-rate serial links with deterministic timing.

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Power Characteristics

Supply Voltages

Power Efficiency

Built on the 20nm UltraScale process, the XCKU085-1FLVF1924I delivers up to 40% lower power compared to previous-generation 28nm FPGAs at equivalent performance. Fine-grained clock gating and power-down modes allow designers to minimize static and dynamic power consumption in real deployed systems.

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Operating Conditions

The industrial temperature rating (suffix “I”) ensures the device operates reliably in environments with wide thermal variation — critical for telecommunications base stations, industrial control systems, and military/aerospace applications.

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Supported Design Tools

The XCKU085-1FLVF1924I is fully supported by AMD’s industry-standard design environment:

Vivado provides complete support for UltraScale devices, including timing closure assistance, incremental compilation, and partial reconfiguration — enabling faster design iterations on the XCKU085-1FLVF1924I.

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XCKU085-1FLVF1924I Applications

Thanks to its balance of logic density, DSP resources, high-speed transceivers, and industrial temperature range, the XCKU085-1FLVF1924I is widely deployed across a variety of demanding markets:

Networking and Data Center

• 100G Ethernet switching and aggregation
• PCIe Gen3 offload and SmartNIC acceleration
• Interlaken and CPRI protocol bridging
• Data center fabric processing cards

Wireless Infrastructure

• TD-LTE / 5G NR Radio Unit (RU) Digital Front End (DFE)
• Remote Radio Head (RRH) baseband processing
• 8×8 MIMO beamforming engines
• JESD204B-based high-speed ADC/DAC interfacing

Medical Imaging and Industrial

• 4K/8K UHD video processing and transcoding
• CT, MRI, and ultrasound signal acquisition pipelines
• Machine vision and real-time image enhancement
• Motor control and industrial automation with time-sensitive networking (TSN)

Test and Measurement

• High-speed signal acquisition and analysis
• Protocol analyzers and traffic generators
• BERT (Bit Error Rate Testing) platforms

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Ordering Information and Part Number Variants

The XCKU085 device is available in multiple speed grades, packages, and temperature grades. The table below shows common variants:

The -1FLVF1924I variant (this product) offers the standard –1 speed grade in the largest 1924-pin package with industrial temperature tolerance. Engineers requiring higher performance at the same logic density can upgrade to the –2 or –3 speed grades.

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Frequently Asked Questions (FAQ)

What is the XCKU085-1FLVF1924I used for?

The XCKU085-1FLVF1924I is used for high-performance applications requiring large FPGA logic capacity, high-speed serial transceivers, and industrial-grade reliability. Common use cases include 100G networking, wireless baseband processing, video processing, and PCIe acceleration.

What is the difference between the -1 and -2 speed grades?

The -1 speed grade represents standard performance, while the -2 speed grade offers higher maximum operating frequencies and tighter timing margins. Both variants share the same logic and memory resources; the speed grade affects propagation delay and maximum clock rates.

Is the XCKU085-1FLVF1924I RoHS compliant?

Yes. The XCKU085-1FLVF1924I is fully RoHS compliant, meeting the European Union’s Restriction of Hazardous Substances directive requirements for lead-free manufacturing.

What design software supports the XCKU085-1FLVF1924I?

AMD’s Vivado Design Suite provides complete support for the XCKU085-1FLVF1924I, including synthesis, place-and-route, timing analysis, and IP integration. The Vitis environment also enables high-level synthesis workflows.

What is the core operating voltage of the XCKU085-1FLVF1924I?

The VCCINT (core logic) supply operates at 0.922V to 0.979V, with a typical value of 0.95V for the –1 speed grade.

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Summary

The XCKU085-1FLVF1924I is a production-active, industrial-grade Kintex UltraScale FPGA offering 1,088,325 logic cells, 62,190 CLBs, 58 Mb of on-chip RAM, 624 user I/Os, and high-speed GTH transceivers — all in a compact 45×45mm 1924-pin FCBGA package. Its 20nm process, wide industrial temperature range, and comprehensive protocol support through PCIe Gen3, 100G Ethernet, JESD204B, and Interlaken make it a compelling choice for engineers targeting the most demanding next-generation electronic systems.

For in-depth design resources, reference designs, and application notes, consult the AMD/Xilinx Kintex UltraScale product page and the official DS892 datasheet.