The XCKU085-1FLVF1924C is a high-performance Xilinx FPGA from AMD’s Kintex UltraScale family, purpose-built for demanding applications where signal processing power, I/O density, and cost-efficiency must converge. Housed in a 1924-pin FCBGA package and manufactured on a 20nm process node, this device delivers exceptional compute density for networking, medical imaging, video processing, and wireless infrastructure designs.
What Is the XCKU085-1FLVF1924C?
The XCKU085-1FLVF1924C is a member of AMD Xilinx’s Kintex UltraScale FPGA product line. It is based on the UltraScale architecture — AMD’s first ASIC-class programmable architecture — delivering up to 40% lower power consumption compared to the previous generation while dramatically increasing logic and DSP performance per watt.
The part number decodes as follows:
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| KU |
Kintex UltraScale Family |
| 085 |
Device density (XCKU085) |
| -1 |
Speed Grade 1 (entry-level speed) |
| FLVF |
Package type: Fine-pitch Flip-chip BGA, Low Voltage |
| 1924 |
1924-pin package |
| C |
Commercial temperature grade (0°C to +85°C) |
XCKU085-1FLVF1924C Key Specifications
Core Device Parameters
| Parameter |
Value |
| FPGA Family |
Kintex UltraScale |
| Part Number |
XCKU085-1FLVF1924C |
| Manufacturer |
AMD Xilinx |
| Technology Node |
20nm |
| Speed Grade |
-1 |
| Temperature Grade |
Commercial (0°C to +85°C) |
| Package |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
1924 Pins |
| User I/O Count |
624 I/Os |
| Core Supply Voltage (VCCINT) |
0.95V |
| I/O Supply Voltage |
Up to 3.3V |
| RoHS Compliant |
Yes |
Logic and Memory Resources
| Resource |
Specification |
| Logic Cells (Macrocells) |
1,088,325 |
| Logic Blocks (CLBs) |
497,520 |
| Total RAM Bits |
~56,900 Kbit |
| Clock Management |
MMCM, PLL |
| Max Operating Frequency |
Up to 725 MHz (reference speed grade) |
XCKU085-1FLVF1924C Architecture Overview
## UltraScale ASIC-Class Architecture
The XCKU085-1FLVF1924C is built on Xilinx’s UltraScale architecture, the industry’s first ASIC-class programmable architecture. Unlike earlier FPGA generations, UltraScale devices implement next-generation routing that eliminates traditional FPGA bottlenecks. The result is higher utilization rates, reduced routing congestion, and predictable timing closure — behaviors designers previously only associated with custom ASICs.
Key architectural pillars include:
- ASIC-like clocking with fine granular clock gating across the entire device
- Stacked Silicon Interconnect (SSI) technology for the highest available logic density
- Advanced power management supporting both 0.95V and optional low-voltage 0.90V operation for -1L variants
## High-Density DSP and Block RAM
The Kintex UltraScale family is engineered for DSP-intensive workloads. The XCKU085 tier offers a high ratio of DSP48E2 slices and Block RAM relative to total logic — making it particularly well-suited for:
- Digital signal processing pipelines
- Machine learning inference acceleration
- Real-time image and video processing algorithms
- Wireless baseband processing (4G/5G LTE)
## Next-Generation Transceivers and Connectivity
The XCKU085-1FLVF1924C integrates next-generation multi-gigabit transceivers with support for high-speed serial protocols. The device includes hard IP for:
- 100G Ethernet MAC
- 150G Interlaken
- PCIe Gen3 (hard block)
- Hybrid Memory Cube (HMC) interfaces
- DDR4 high-bandwidth memory interfaces
These integrated hard blocks reduce the fabric logic required for protocol implementation, freeing up programmable resources for application logic.
Package and I/O Details
### 1924-Pin FCBGA Package
The FLVF1924 package designation refers to a Fine-pitch, Low-Voltage Flip-Chip Ball Grid Array with 1924 solder balls. This large-format package provides the maximum I/O pin count for the XCKU085 device, making it the preferred choice for designs requiring maximum connectivity flexibility.
| Package Attribute |
Detail |
| Package Type |
FCBGA (Flip-Chip BGA) |
| Total Balls |
1924 |
| User I/Os Available |
624 |
| I/O Standards Supported |
LVDS, SSTL, HSTL, LVCMOS, and more |
| HP I/O Banks |
High-performance banks with DCI termination |
| HR I/O Banks |
High-range banks supporting up to 3.3V |
### Clock Management Technology
The XCKU085-1FLVF1924C includes powerful clock management infrastructure:
- Mixed-Mode Clock Manager (MMCM) for flexible frequency synthesis
- Phase-Locked Loops (PLLs) for low-jitter clock generation
- ASIC-class clock routing minimizing skew and power in clock distribution networks
- Clock gating at fine granularity to reduce dynamic power during idle phases
Supported Applications
The XCKU085-1FLVF1924C is designed for use in mid-to-high-performance applications across a broad range of industries. Its combination of logic density, DSP throughput, and high-speed I/O makes it a versatile platform for system designers.
#### Networking and Data Center
- 100G and 400G packet processing pipelines
- Line-rate traffic management and classification
- Network Function Virtualization (NFV) offload engines
- Data center switching and routing platforms
#### Wireless Infrastructure
- LTE and 5G NR baseband processing
- Remote Radio Head (RRH) Digital Front-End (DFE)
- Massive MIMO signal processing
- TD-LTE radio unit implementations (8×8 configurations at 100 MHz)
#### Medical and Scientific Imaging
- Next-generation medical imaging systems (MRI, CT, ultrasound)
- Real-time image reconstruction and filtering
- High-speed data acquisition from sensor arrays
#### Video and Broadcast
- 8K4K video processing pipelines
- Real-time video encode/decode
- Broadcast-grade signal routing and multiplexing
#### Defense and Aerospace
- Radar and signal intelligence (SIGINT) processing
- Secure communications and cryptographic acceleration
- High-reliability embedded processing platforms
Development Tools and Software Support
Designs targeting the XCKU085-1FLVF1924C are developed using AMD’s Vivado Design Suite, which provides a full RTL-to-bitstream design flow including:
| Tool / Feature |
Description |
| Vivado Design Suite |
Primary IDE for synthesis, implementation, and timing analysis |
| Vivado HLS |
High-Level Synthesis from C/C++ to FPGA logic |
| Xilinx Power Estimator (XPE) |
Accurate pre- and post-implementation power estimation |
| ChipScope Pro / ILA |
In-system logic analysis and debugging |
| IP Integrator |
Block design environment for AXI-based system integration |
| Partial Reconfiguration |
Dynamically reconfigure selected FPGA regions at runtime |
Vivado’s UltraScale-optimized placer and router are specifically tuned for the XCKU085 device family, enabling high utilization designs to close timing predictably.
Ordering and Product Information
| Attribute |
Detail |
| Manufacturer |
AMD Xilinx (formerly Xilinx, Inc.) |
| Full Part Number |
XCKU085-1FLVF1924C |
| DigiKey Part Number |
6132146 |
| Product Category |
Embedded FPGAs (Field Programmable Gate Array) |
| Lifecycle Status |
Active |
| RoHS Compliance |
Yes |
| Export Compliance |
Subject to EAR — verify ECCN before export |
XCKU085-1FLVF1924C vs. Other XCKU085 Variants
The XCKU085 device is available in multiple speed grades, package sizes, and temperature grades. The table below summarizes how the XCKU085-1FLVF1924C compares to closely related variants:
| Part Number |
Speed Grade |
Package |
Pins |
Temp Grade |
| XCKU085-1FLVF1924C |
-1 |
FCBGA |
1924 |
Commercial |
| XCKU085-2FLVF1924E |
-2 |
FCBGA |
1924 |
Extended |
| XCKU085-1FLVB1760C |
-1 |
FCBGA |
1760 |
Commercial |
| XCKU085-1FLVA1517I |
-1 |
FCBGA |
1517 |
Industrial |
| XCKU085-L1FLVF1924I |
-1L |
FCBGA |
1924 |
Industrial |
The -1FLVF1924C variant is the standard commercial-grade, entry-speed-grade device in the largest available package for the XCKU085, providing maximum I/O access with commercial temperature screening — an excellent balance of cost and flexibility for development and production environments that do not require industrial temperature operation.
Frequently Asked Questions
What does the “C” at the end of XCKU085-1FLVF1924C mean? The “C” designates the Commercial temperature grade, meaning the device is screened and guaranteed to operate correctly from 0°C to +85°C ambient. For industrial (-40°C to +100°C) applications, look for variants ending in “I”.
What voltage does the XCKU085-1FLVF1924C core run at? The core (VCCINT) operates at 0.95V for the -1 speed grade. I/O supply voltages vary by I/O bank standard and can range up to 3.3V for HR (High Range) banks.
What design software is used for the XCKU085-1FLVF1924C? AMD’s Vivado Design Suite is the standard toolchain. Legacy ISE is not supported for UltraScale devices.
Is the XCKU085-1FLVF1924C RoHS compliant? Yes, the device is fully RoHS compliant.
What is the difference between XCKU085 and XCKU085+? The XCKU085 belongs to the original Kintex UltraScale family (20nm). The “+” suffix (UltraScale+) denotes the next-generation 16nm family, which adds UltraRAM and additional features. These are separate product lines and are not pin-compatible.
