The XCKU085-1FLVB1760I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex® UltraScale™ family — one of the most powerful mid-range FPGAs available for signal processing, 100G networking, and advanced DSP applications. Built on 20nm process technology and housed in a 1760-pin FCBGA package, this device delivers an exceptional balance of logic density, memory bandwidth, and transceiver performance at competitive cost. If you are looking for a reliable Xilinx FPGA solution for demanding industrial, communications, or data center applications, the XCKU085-1FLVB1760I is worth serious consideration.

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What Is the XCKU085-1FLVB1760I?

The XCKU085-1FLVB1760I belongs to the Kintex® UltraScale™ FPGA series manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

This Industrial-grade variant is specifically engineered to withstand harsh operating environments, making it suitable for telecom, defense, and industrial automation applications.

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XCKU085-1FLVB1760I Key Specifications

The table below summarizes the most critical technical parameters of this device:

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XCKU085-1FLVB1760I Logic and DSP Resources

The XCKU085-1FLVB1760I provides substantial on-chip resources optimized for compute-intensive workloads:

#### Programmable Logic

With over 1 million logic cells and nearly 58 million flip-flops, this FPGA offers massive parallelism for implementing complex control logic, state machines, and data path operations. The UltraScale architecture allows ASIC-like design methodologies, enabling engineers to push logic utilization further than previous generation devices.

#### DSP Processing Power

The device integrates 2,760 DSP48E2 slices, delivering industry-leading digital signal processing throughput for a mid-range FPGA. This makes the XCKU085-1FLVB1760I ideal for:

• 100G and beyond Ethernet packet processing
• Software-defined radio (SDR) implementations
• Medical imaging and ultrasound signal chains
• 8K/4K video processing pipelines
• Radar and sonar signal processing

#### On-Chip Memory

The XCKU085-1FLVB1760I provides up to 1,200 Kb of distributed Block RAM, enabling high-bandwidth data buffering without external memory latency. The UltraRAM architecture further extends on-chip memory capacity, reducing bill-of-materials (BOM) cost and system complexity.

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I/O and Connectivity Features

#### User I/O

The device offers 676 user-configurable I/O pins, supporting a wide range of single-ended and differential I/O standards including LVCMOS, LVDS, HSTL, SSTL, and POD. This flexibility makes integration with DDR4 memory, high-speed ADCs/DACs, and standard bus interfaces straightforward.

#### Transceiver Performance

Kintex UltraScale FPGAs are equipped with next-generation high-speed serial transceivers supporting line rates up to 16.3 Gb/s (GTH) and 32.75 Gb/s (GTY on larger devices). These transceivers are fully compliant with major serial protocols, including PCIe Gen3, 100G Ethernet (CAUI-4), Interlaken, and JESD204B.

#### Memory Interface Support

Leveraging the UltraScale architecture’s integrated clocking and memory controllers, the XCKU085-1FLVB1760I natively supports:

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Clock Management and Timing

The UltraScale architecture includes advanced clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs). This enables:

• Precise frequency synthesis and clock multiplication/division
• Fine-grained phase adjustment for interface timing
• Low-jitter clocking for high-speed transceiver applications
• ASIC-like clock gating for power reduction

The clock network is tightly integrated with dedicated memory interface logic, enabling reliable support for high-performance DDR4 interfaces without external clock conditioning circuitry.

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Power and Thermal Specifications

The Kintex UltraScale family delivers up to 40% lower power consumption compared to 28nm-generation FPGAs, achieved through UltraScale’s ASIC-like power optimization techniques and fine-granular clock gating.

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Package and PCB Design Information

The 1760-FCBGA package requires careful PCB layout attention to ensure signal integrity at high I/O counts. Designers should follow AMD’s UltraScale PCB design guidelines for via structures, power delivery network (PDN) design, and differential pair routing.

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Compliance, Certifications, and Export Information

Note: The ECCN code 3A001.A.7.B indicates this device is subject to U.S. Export Administration Regulations (EAR). Buyers should verify export license requirements before international shipment.

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Target Applications for XCKU085-1FLVB1760I

The combination of high logic density, abundant DSP resources, and industrial temperature rating makes the XCKU085-1FLVB1760I particularly well-suited for:

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XCKU085-1FLVB1760I vs. Comparable Kintex UltraScale Devices

The XCKU085 occupies a strong position in the Kintex UltraScale lineup — delivering significantly more logic than the KU060 while maintaining the same I/O count and package size, offering a cost-effective upgrade path for higher-density designs.

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Design Tools and Software Support

The XCKU085-1FLVB1760I is fully supported by AMD’s Vivado Design Suite, which provides:

• RTL synthesis and implementation for UltraScale devices
• Vivado IP Integrator for block-based design
• Vivado Simulator for functional and timing simulation
• Power analysis with Xilinx Power Estimator (XPE)
• Hardware debugging with Integrated Logic Analyzer (ILA)

Designers can also leverage AMD’s extensive UltraScale reference designs, application notes, and the Xilinx Support Forum for faster time-to-market.

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Ordering Information

For volume pricing and availability, contact your authorized AMD distributor or request a quote from electronics distributors such as Digi-Key, Mouser, or Arrow Electronics.

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Frequently Asked Questions (FAQ)

Q: What does the “-1” in XCKU085-1FLVB1760I mean? The “-1” designates Speed Grade 1, which is the standard (base) speed grade for this device family. Higher speed grades (e.g., -2, -3) offer improved timing margins and are suited for higher-frequency designs.

Q: What is the operating temperature range of the XCKU085-1FLVB1760I? This device carries an Industrial temperature rating, supporting junction temperatures from -40°C to 100°C, making it suitable for demanding environments outside standard commercial temperature ranges.

Q: Is the XCKU085-1FLVB1760I RoHS compliant? Yes, it is fully RoHS3 compliant with lead-free ball finish.

Q: What software is used to program the XCKU085-1FLVB1760I? AMD Vivado Design Suite is the primary development environment. Legacy ISE is not supported for UltraScale devices.

Q: What DDR memory standards does this FPGA support? The device supports DDR4, DDR3, DDR3L, and LPDDR4, with DDR4 data rates up to 2,666 Mb/s using the integrated memory controllers.