The XCKU060-L1FFVA1156I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, part of the renowned Kintex® UltraScale™ family. Manufactured on a 20nm process node, this device delivers an industry-leading combination of logic density, DSP throughput, and power efficiency — making it one of the most capable mid-range FPGAs available for engineers working on 100G networking, medical imaging, data center, and next-generation wireless infrastructure projects.
Built on AMD’s first ASIC-class All Programmable Architecture, the XCKU060-L1FFVA1156I enables multi-hundred Gbps system performance while keeping power consumption significantly lower than previous-generation devices. If you are evaluating programmable logic solutions for your next design, explore the full range of Xilinx FPGA products to find the right fit for your application.
What Is the XCKU060-L1FFVA1156I?
The XCKU060-L1FFVA1156I is a Kintex UltraScale FPGA in a 1156-pin FCBGA (Flip-Chip Ball Grid Array) package, featuring the -1L (low-power) speed grade and industrial-temperature operation. It is specifically engineered for applications that demand high DSP processing density, large block RAM capacity, and reliable high-speed serial connectivity — all within an optimized power envelope.
The “L1” in the part number designates the -1L speed grade, which offers up to 40% lower dynamic power compared to standard speed grades, while still delivering 630 MHz internal clock performance. This makes the XCKU060-L1FFVA1156I a preferred choice for thermally constrained or battery-sensitive deployments.
XCKU060-L1FFVA1156I Key Specifications
General Overview
| Parameter |
Value |
| Manufacturer |
AMD Xilinx |
| Part Number |
XCKU060-L1FFVA1156I |
| Family |
Kintex® UltraScale™ |
| Series |
KU060 |
| Process Technology |
20nm |
| Package Type |
FCBGA (Flip-Chip BGA) |
| Package Designation |
FFVA1156 |
| Number of Pins |
1,156 |
| Ball Pitch |
1.0 mm |
| Speed Grade |
-1L (Low Power) |
| Operating Temperature |
Industrial (-40°C to +100°C) |
| RoHS Compliant |
Yes |
Logic & Memory Resources
| Resource |
Specification |
| System Logic Cells |
725,550 |
| CLB Logic Cells |
580,440 |
| CLB Flip-Flops |
663,360 |
| CLB LUTs |
331,680 |
| Block RAM (Total) |
38,912 Kb (38 Mb) |
| Block RAM (36Kb blocks) |
1,080 |
| UltraRAM |
Not available (UltraScale+) |
| Distributed RAM |
Up to 18 Mb |
| DSP Slices |
2,760 |
| DSP Performance |
8.2 TeraMACs |
| Maximum Frequency |
630 MHz |
I/O & Transceiver Resources
| Resource |
Specification |
| Total User I/Os |
520 |
| GTH Transceivers |
32 |
| GTY Transceivers |
0 |
| Max Transceiver Data Rate |
16.3 Gb/s (GTH) |
| Backplane Support |
16G capable |
| PCIe Interface |
Integrated Gen3 (up to x8) |
| DDR4 Memory Interface |
Up to 2,400 Mb/s |
| MMCM |
Yes |
| PLL |
Yes |
| CMT (Clock Management Tiles) |
10 |
Power & Electrical Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
0.880 V – 0.920 V |
| Auxiliary Supply (VCCAUX) |
1.8 V |
| I/O Supply (VCCO) |
1.0 V – 3.3 V (bank dependent) |
| Power Reduction vs. Previous Gen |
Up to 40% lower |
| Low-Power Speed Grade (-1L) |
Yes |
XCKU060-L1FFVA1156I Part Number Decoder
Understanding the part number helps engineers quickly identify device parameters during procurement:
| Segment |
Meaning |
| XC |
Xilinx Commercial/Industrial device |
| KU |
Kintex UltraScale family |
| 060 |
Device size (60 — mid-range density) |
| L |
Low-power speed grade modifier |
| 1 |
Speed grade (-1) |
| FF |
Package type (Flip-Chip) |
| VA |
Package variant |
| 1156 |
Number of package pins |
| I |
Temperature grade: Industrial (-40°C to +100°C) |
Key Features of the Kintex UltraScale Architecture
ASIC-Class Routing and Clocking
The UltraScale architecture is the first All Programmable architecture to implement ASIC-class clocking and routing. Fine-granular clock gating, combined with next-generation routing fabrics, allows designers to achieve rapid timing closure even in high-utilization, complex designs. The Vivado® Design Suite is co-optimized for UltraScale devices, further accelerating design closure and implementation.
High-Performance DSP Processing
With 2,760 DSP48E2 slices and a sustained compute performance of 8.2 TeraMACs, the XCKU060-L1FFVA1156I is engineered for signal-processing-intensive workloads. Applications such as 5G baseband processing, radar, software-defined radio (SDR), and advanced medical imaging all benefit from this level of embedded compute density without relying on external co-processors.
Next-Generation GTH Transceivers
The device integrates 32 GTH transceivers capable of supporting data rates up to 16.3 Gb/s, enabling seamless 16G backplane connectivity and high-speed serial links for 100G Ethernet, Interlaken, Aurora, and other industry-standard protocols. This level of transceiver performance is rarely available at this price point in the mid-range FPGA segment.
3D IC and Multi-Chip Integration
Building on 2nd-generation 3D IC technology, UltraScale devices support multi-chip integration strategies that enable system designers to construct high-bandwidth pipelines across multiple dies. This approach dramatically reduces application BOM cost — AMD cites up to 60% BOM reduction through system integration — while preserving the flexibility inherent to programmable logic.
DDR4 Memory Interface Support
The XCKU060-L1FFVA1156I supports DDR4 memory interfaces at up to 2,400 Mb/s, providing the memory bandwidth required for frame buffering in 8K/4K video applications, deep packet inspection, and high-throughput data center workloads. This DDR4 capability is accessible even in mid-speed grade variants, ensuring design headroom without forcing the use of higher-cost speed grades.
Low-Power -1L Speed Grade
The -1L speed grade delivers up to 40% lower dynamic power compared to standard speed grades in the Kintex UltraScale family. Combined with fine-granular clock gating and UltraScale’s power management architecture, the XCKU060-L1FFVA1156I is an excellent choice for energy-constrained embedded platforms, industrial automation, and edge-computing deployments where thermal budgets are tight.
Footprint Compatibility with Virtex UltraScale
Designs created for the XCKU060 footprint are pin-compatible with Virtex® UltraScale™ devices using the same FFVA1156 package. This footprint scalability means engineering teams can target the Kintex device for prototyping or cost-optimized production, then migrate seamlessly to higher-capacity Virtex UltraScale or Kintex UltraScale+ devices as requirements evolve — without requiring a PCB redesign.
Target Applications
The XCKU060-L1FFVA1156I is designed for demanding, real-world deployments across multiple industries:
| Application Area |
Use Case |
| 100G Networking |
Packet processing, line-rate switching, traffic shaping |
| Data Center |
High-bandwidth compute acceleration, FPGA offload |
| Medical Imaging |
Next-generation MRI, CT, and ultrasound signal processing |
| 8K/4K Video |
Real-time video compression, format conversion, frame buffering |
| Wireless Infrastructure |
5G baseband, heterogeneous wireless platforms |
| Defense & Aerospace |
Radar signal processing, SDR, secure communications |
| Test & Measurement |
High-speed data acquisition and protocol analysis |
| Industrial Automation |
Real-time control, machine vision, sensor fusion |
Ordering Information & Variants
The KU060 device is available in multiple speed grades and temperature ratings. The table below shows common variants sharing the same FFVA1156 package footprint:
| Part Number |
Speed Grade |
Temperature |
Core Voltage |
| XCKU060-L1FFVA1156I |
-1L (Low Power) |
Industrial |
0.88–0.92 V |
| XCKU060-1FFVA1156I |
-1 |
Industrial |
0.92–0.98 V |
| XCKU060-2FFVA1156I |
-2 |
Industrial |
0.95 V |
| XCKU060-1FFVA1156C |
-1 |
Commercial |
0.92–0.98 V |
| XCKU060-2FFVA1156E |
-2 |
Extended |
0.95 V |
Note: All variants in the FFVA1156 package are footprint-compatible with Kintex UltraScale+ and Virtex UltraScale devices in the same package designation.
Development Tools & Ecosystem
Vivado Design Suite
The XCKU060-L1FFVA1156I is fully supported by AMD’s Vivado® Design Suite, which provides synthesis, implementation, simulation, and hardware debugging capabilities. The Vivado ML edition includes AI-assisted placement and routing features that specifically benefit high-utilization UltraScale designs, enabling faster timing closure.
Evaluation Hardware
Developers looking to prototype with the KU060 can reference the KCU105 Evaluation Kit (EK-U1-KCU105-G), AMD’s official Kintex UltraScale evaluation board. This platform provides access to DDR4 SDRAM, SFP+ cages, PCIe edge connector, and JTAG programming — all the essentials needed to validate a KU060-based design before committing to custom PCB development.
JTAG Programming Modules
For embedded programming scenarios, compatible JTAG programming modules from Digilent — including the JTAG-SMT2-NC and JTAG-SMT3-NC — integrate directly with the Vivado Hardware Manager for streamlined in-system programming and debugging of the XCKU060-L1FFVA1156I.
Frequently Asked Questions
What does the “L1” speed grade mean on the XCKU060-L1FFVA1156I?
The “L” prefix denotes a low-power speed grade variant. The -1L grade operates at a lower core voltage (0.88–0.92 V vs. 0.92–0.98 V for standard -1) and is optimized to reduce dynamic power by up to 40%, making it ideal for thermally or power-constrained applications.
Is the XCKU060-L1FFVA1156I RoHS compliant?
Yes. The XCKU060-L1FFVA1156I is fully RoHS compliant, meeting international restrictions on hazardous substances requirements for electronic components.
What package does the XCKU060-L1FFVA1156I use?
This device uses the 1156-pin FCBGA (Flip-Chip Ball Grid Array) package with a 1.0mm ball pitch, designated FFVA1156. It is footprint-compatible with other UltraScale and UltraScale+ devices in the A1156 package family.
What is the maximum operating temperature?
The “I” suffix indicates the Industrial temperature grade, supporting operation from -40°C to +100°C junction temperature, making it suitable for harsh or outdoor environments.
How does the XCKU060 compare to Kintex UltraScale+ devices?
Kintex UltraScale+ (KU+) devices offer higher performance through a 16nm FinFET process, additional UltraRAM blocks, and improved DSP performance. However, the KU060 in FFVA1156 packaging is pin-compatible with select KU+ devices, enabling a straightforward upgrade path if design requirements grow.
Summary
The XCKU060-L1FFVA1156I is a production-grade, industrial-temperature Kintex UltraScale FPGA that offers exceptional logic density (725,550 cells), extensive block RAM (38 Mb), 32 GTH transceivers at up to 16.3 Gb/s, and industry-leading DSP throughput (8.2 TeraMACs) — all within the power-optimized -1L speed grade. Its 1156-pin FCBGA form factor provides footprint scalability across the entire UltraScale family, protecting your PCB investment as designs evolve.
Whether you are designing for 100G networking, medical imaging, 5G wireless, or data center acceleration, the XCKU060-L1FFVA1156I provides the programmable fabric, connectivity, and power efficiency needed to bring next-generation systems to market faster.
