The XCKU060-3FFVA1156C is a high-performance Xilinx FPGA from the Kintex® UltraScale™ family, manufactured on 20nm process technology. Featuring the highest speed grade (-3) available for the XCKU060 device, it delivers peak logic performance with a VCCINT operating voltage of 1.0V. Housed in a 1156-pin FC-BGA (FFVA1156) package, this commercial-grade (C-suffix) component is purpose-built for compute-intensive applications that demand maximum throughput and minimal design iteration cycles.
Whether you are working on high-speed signal processing, packet forwarding, radar systems, or 100G networking infrastructure, the XCKU060-3FFVA1156C provides a compelling combination of logic density, DSP bandwidth, transceiver count, and tool ecosystem maturity.
What Is the XCKU060-3FFVA1156C?
Part Number Breakdown
Understanding the part number helps engineers quickly identify the exact device variant they need.
| Code Segment |
Meaning |
| XC |
Xilinx Commercial device |
| KU060 |
Kintex UltraScale family, 60% of maximum family capacity |
| -3 |
Speed grade 3 — highest performance, VCCINT = 1.0V |
| FF |
Flip-Chip BGA package type |
| VA |
Package variant designation |
| 1156 |
Total number of package balls (1156-pin) |
| C |
Commercial temperature grade (0°C to +85°C) |
XCKU060-3FFVA1156C Key Specifications
Core Logic Resources
The XCKU060 die offers one of the highest logic densities available in the mid-range Kintex UltraScale lineup. The -3 speed grade ensures the fastest achievable clock frequencies across all logic resources.
| Parameter |
XCKU060 Value |
| System Logic Cells |
725,550 |
| CLB LUT Count |
331,680 |
| CLB Flip-Flops |
~663,360 |
| Configurable Logic Blocks (CLBs) |
41,460 |
| Slices |
2,760 |
| Maximum Distributed RAM |
~9.1 Mb |
Memory Resources
| Parameter |
XCKU060 Value |
| Block RAM Tiles |
1,080 |
| Total Block RAM Capacity |
38,912 Kb (~38 Mb) |
| Max Block RAM (18K) |
2,160 |
| Max Block RAM (36K) |
1,080 |
DSP and Arithmetic Performance
The XCKU060 contains DSP48E2 slices — an enhanced version of the DSP primitive featuring a 27×18 two’s-complement multiplier, 27-bit pre-adder, and advanced ALU capabilities. This makes the device particularly well-suited for floating-point arithmetic and high-throughput signal processing chains.
| Parameter |
XCKU060 Value |
| DSP48E2 Slices |
2,760 |
| Peak DSP Performance (at -3 speed grade) |
Industry-leading for mid-range FPGAs |
I/O and Transceiver Resources
| Parameter |
XCKU060 (FFVA1156 Package) |
| Maximum User I/Os |
520 |
| HP (High-Performance) I/Os |
520 |
| HR (High-Range) I/Os |
104 |
| I/O Banks |
12 |
| GTH Transceivers (max, in 1156 pkg) |
32 |
| GTH Transceiver Line Rate |
Up to 16.3 Gb/s |
| PCIe Hard IP Blocks |
3 (Gen3 ×8 capable) |
Clocking Resources
| Parameter |
XCKU060 Value |
| Clock Management Tiles (CMTs) |
12 |
| Clock Regions |
30 (6 columns × 5 rows) |
| MMCMs per CMT |
1 |
| PLLs per CMT |
1 |
Speed Grade Comparison for XCKU060 Variants
The XCKU060 is available in multiple speed grades. The -3 speed grade in the XCKU060-3FFVA1156C is the highest-performance option, operating at VCCINT = 1.0V.
| Part Number |
Speed Grade |
VCCINT |
Temperature Grade |
Performance Level |
| XCKU060-3FFVA1156C |
-3 |
1.0V |
Commercial (0°C to +85°C) |
Highest |
| XCKU060-2FFVA1156C |
-2 |
0.95V |
Commercial |
High |
| XCKU060-1FFVA1156C |
-1 |
0.95V |
Commercial |
Standard |
| XCKU060-L1FFVA1156C |
-1L |
0.90V / 0.95V |
Commercial |
Low Power |
| XCKU060-2FFVA1156I |
-2 |
0.95V |
Industrial (-40°C to +100°C) |
High |
| XCKU060-1FFVA1156I |
-1 |
0.95V |
Industrial |
Standard |
Package and Physical Characteristics
FFVA1156 Package Details
The XCKU060-3FFVA1156C uses a 1156-ball Flip-Chip BGA (FC-BGA) package, which provides a dense, thermally efficient footprint compatible with high-layer-count PCB designs.
| Parameter |
Value |
| Package Type |
FC-BGA (Flip-Chip Ball Grid Array) |
| Ball Count |
1,156 |
| Ball Pitch |
1.0 mm |
| Package Designation |
FFVA1156 |
| Footprint Compatibility |
Compatible with Kintex UltraScale+ in A1156 packages |
| RoHS Compliance |
Yes |
Footprint Migration Path
A key design advantage of the UltraScale architecture is its footprint compatibility across families. Designs implemented on the XCKU060-3FFVA1156C can be migrated to Kintex UltraScale+ devices in the same A1156 package footprint, protecting your PCB investment while enabling a path to newer-generation technology.
Operating Conditions
| Parameter |
Value |
| Temperature Grade |
Commercial (C) |
| Ambient Operating Temperature |
0°C to +85°C |
| VCCINT (Core Voltage) |
1.0V (nominal, -3 speed grade) |
| VCCBRAM |
1.0V |
| VCCO (I/O Supply) |
1.0V to 1.8V (HP banks) |
| Configuration Standard |
SelectIO |
Supported Protocols and Interfaces
The XCKU060-3FFVA1156C supports a broad range of standard interfaces through its programmable logic fabric, hard IP blocks, and GTH transceiver infrastructure:
| Interface Category |
Supported Standards |
| Serial Transceivers |
PCIe Gen3, 10GbE, 40GbE, 100GbE, CPRI, JESD204B, Interlaken, SATA, SAS, Aurora |
| Memory Interfaces |
DDR4, DDR3, LPDDR4, QDR-II+, RLDRAM3 |
| High-Speed I/O |
LVDS, SSTL, POD, HSTL, LVCMOS |
| Configuration |
SelectMAP, JTAG, SPI, BPI |
| PCIe Hard IP |
PCIe Gen3 ×8 (3 blocks) |
Primary Applications for XCKU060-3FFVA1156C
The -3 speed grade makes this variant the preferred choice for timing-critical designs where every picosecond of margin matters. Typical application areas include:
High-Performance Computing and Data Centers
The 2,760 DSP48E2 slices and 32 GTH transceivers enable high-bandwidth compute pipelines. When paired with DDR4 memory controllers, this device serves as an efficient accelerator for machine learning inference, financial analytics, and HPC offload workloads.
Wireless Infrastructure and 5G
The XCKU060 is a proven platform for baseband processing in 4G/LTE and 5G NR systems. CPRI and JESD204B transceiver support, combined with the DSP density required for LDPC and polar code processing, makes the -3 speed grade critical for meeting timing closure in multi-antenna MIMO designs.
Test and Measurement Equipment
High-sample-rate ADC/DAC interfaces, precision timing, and protocol emulation all benefit from the increased logic performance of the -3 speed grade. The 32 GTH transceivers support simultaneous multi-lane capture at up to 16.3 Gb/s per lane.
Radar, EW, and Defense Signal Processing
The DSP48E2 architecture supports complex wideband beamforming algorithms, pulse compression, and Doppler processing chains at speeds that meet the demands of advanced radar systems. The commercial temperature grade suits lab and platform-integration environments.
Networking and Packet Processing
With three PCIe Gen3 ×8 hard blocks and 32 GTH transceivers, the XCKU060-3FFVA1156C accelerates 40G, 100G, and multi-port 10G network interface card (NIC) designs as well as programmable line card applications in enterprise and carrier routing equipment.
Development Tool Support
Xilinx (now AMD) Kintex UltraScale devices are fully supported by the Vivado Design Suite, which provides synthesis, implementation, simulation, and in-system debug capabilities.
| Tool |
Minimum Version for XCKU060 |
| Vivado Design Suite |
2015.4 (Speed File v1.23) |
| Vivado IP Integrator |
2015.4+ |
| Xilinx Power Estimator (XPE) |
Any current version |
| ChipScope Pro / ILA |
Integrated in Vivado |
The XCKU060 is not supported by the free Vivado WebPACK edition. A Vivado Design Edition license or higher is required for full device support.
XCKU060-3FFVA1156C vs. Related Devices
Comparison Within the Kintex UltraScale Family
| Device |
Logic Cells |
DSP48E2 |
Block RAM (Kb) |
GTH Tx |
Max I/O |
| XCKU040-3FFVA1156C |
530,250 |
1,920 |
28,800 |
20 |
520 |
| XCKU060-3FFVA1156C |
725,550 |
2,760 |
38,912 |
32 |
520 |
| XCKU085-3FFVA1156C |
1,045,440 |
3,528 |
56,700 |
32 |
520 |
| XCKU115-3FLVA1517C |
1,451,000 |
5,520 |
75,900 |
64 |
680 |
The XCKU060-3FFVA1156C occupies the mid-range sweet spot, offering substantially more logic and DSP resources than the XCKU040 while remaining in the same 1156-pin package with the same 520 maximum I/Os.
Ordering Information
| Field |
Value |
| Part Number |
XCKU060-3FFVA1156C |
| Manufacturer |
AMD (Xilinx) |
| Device Family |
Kintex UltraScale |
| Speed Grade |
-3 (Highest Performance) |
| Package |
1156-Ball FC-BGA (FFVA1156) |
| Temperature Grade |
Commercial (0°C to +85°C) |
| RoHS Compliant |
Yes |
| Process Node |
20nm |
Frequently Asked Questions
What is the difference between XCKU060-3FFVA1156C and XCKU060-1FFVA1156C? The primary difference is the speed grade. The -3 variant operates at a higher VCCINT (1.0V vs. 0.95V) and achieves faster timing performance across all logic paths, making it the choice for designs that cannot meet timing on lower speed grades.
Is the XCKU060-3FFVA1156C RoHS compliant? Yes. The “C” suffix in the part number confirms commercial temperature grade and RoHS compliance for the EU Restriction of Hazardous Substances directive.
What package is the XCKU060-3FFVA1156C? It uses the FFVA1156 package — a 1156-ball Flip-Chip BGA with 1.0mm ball pitch.
Can I migrate this design to a Kintex UltraScale+ device? Yes. The FFVA1156 footprint is compatible with Kintex UltraScale+ devices in the A1156 package, enabling a direct PCB-level migration path.
What development software do I need? Vivado Design Suite (Design Edition or higher) version 2015.4 or later. The XCKU060 is not supported by the free WebPACK edition.
