The XCKU060-2FFVA1156I is a high-performance industrial-grade Xilinx FPGA from AMD’s Kintex® UltraScale™ family. Built on a 20nm process node, this device is engineered to deliver an exceptional balance of processing power, DSP throughput, and cost-efficiency — making it a top choice for engineers designing advanced communications, signal processing, and industrial systems.
What Is the XCKU060-2FFVA1156I?
The XCKU060-2FFVA1156I is a field programmable gate array (FPGA) belonging to AMD’s Kintex UltraScale series. It leverages the UltraScale architecture — the industry’s first ASIC-class programmable architecture — to eliminate bottlenecks in I/O, logic, and memory interfaces. With 725,550 logic cells, 520 configurable I/O pins, and a 1156-pin FCBGA package, this device is purpose-built for compute-intensive and I/O-heavy applications that demand industrial-grade reliability.
XCKU060-2FFVA1156I Key Specifications
Core Logic & Memory
| Parameter |
Value |
| FPGA Family |
Kintex® UltraScale™ |
| Logic Cells (Macrocells) |
725,550 |
| Logic Blocks (LUTs) |
331,680 |
| CLB Flip-Flops |
663,360 |
| Total RAM Bits |
38,912 Kbit (38,912,000 bits) |
| Block RAMs (36K) |
1,080 |
| UltraRAM Blocks |
N/A (UltraScale, not UltraScale+) |
| DSP Slices |
2,760 |
Clocking & Transceivers
| Parameter |
Value |
| Max Frequency (Speed Grade -2) |
725 MHz |
| MMCM |
Yes |
| PLL |
Yes |
| GTH Transceivers |
20 |
| Max Transceiver Speed |
16.3 Gb/s |
Package & Electrical
| Parameter |
Value |
| Package |
1156-BBGA, FCBGA |
| Package Size |
35 mm × 35 mm |
| Ball Pitch |
1.0 mm |
| Number of Pins |
1,156 |
| I/O Pins (User) |
520 |
| Supply Voltage (VCCINT) |
0.922V – 0.979V (nominal 0.95V) |
| Speed Grade |
–2 |
| Process Node |
20nm |
Environmental & Compliance
| Parameter |
Value |
| Temperature Grade |
Industrial |
| Operating Junction Temp |
–40°C to 100°C (TJ) |
| RoHS Compliant |
Yes |
| Packaging (Shipment) |
Tray |
XCKU060-2FFVA1156I Part Number Decoder
Understanding the part number helps engineers quickly identify the exact variant they need:
| Code Segment |
Meaning |
| XC |
Xilinx (now AMD) product |
| KU |
Kintex UltraScale family |
| 060 |
Device size/density (060 = mid-high density) |
| -2 |
Speed grade (–2 = standard commercial speed) |
| FFVA |
Flip-chip fine-pitch BGA (FCBGA) package type |
| 1156 |
Number of pins (1156-ball BGA) |
| I |
Temperature grade (I = Industrial, –40°C to 100°C) |
Architecture Highlights: Why Kintex UltraScale Stands Out
20nm Process Technology for Low Power and High Performance
The XCKU060-2FFVA1156I is fabricated on a leading-edge 20nm process, providing significant power reduction compared to prior-generation 28nm FPGAs. AMD claims system integration on UltraScale devices can cut power consumption by up to 40% versus earlier generations — a critical advantage in thermally constrained designs.
UltraScale Architecture: ASIC-Class Routing
Unlike previous FPGA generations, the UltraScale architecture uses ASIC-like clocking and routing methodologies. This eliminates global routing congestion, resulting in more predictable timing closure and higher utilization rates — directly translating to faster design cycles for development teams.
High DSP-to-Logic Ratio for Signal Processing
With 2,760 DSP48E2 slices, the XCKU060 is particularly well-suited for computationally intensive DSP workloads. Each DSP48E2 slice supports operations like multiply-accumulate (MAC), SIMD arithmetic, and cascaded filter chains — making this device a natural fit for radar, medical imaging, and software-defined radio applications.
Next-Generation GTH Transceivers
The 20 integrated GTH transceivers running at up to 16.3 Gb/s enable high-bandwidth serial I/O for protocols including PCIe Gen3, 10GbE, CPRI, JESD204B, and Interlaken. This makes the XCKU060-2FFVA1156I a strong candidate for backplane and line-card designs in networking equipment.
XCKU060-2FFVA1156I Compared to Similar Devices
| Feature |
XCKU035-2FFVA1156I |
XCKU060-2FFVA1156I |
XCKU115-2FLVF1924E |
| Logic Cells |
444,343 |
725,550 |
1,451,000 |
| Logic Blocks |
203,550 |
331,680 |
663,360 |
| DSP Slices |
1,620 |
2,760 |
5,520 |
| Block RAM (Mb) |
23 Mb |
38.9 Mb |
75.9 Mb |
| GTH Transceivers |
20 |
20 |
64 |
| User I/Os |
520 |
520 |
960 |
| Package |
FCBGA-1156 |
FCBGA-1156 |
FCBGA-1924 |
| Temperature Grade |
Industrial |
Industrial |
Extended |
The XCKU060-2FFVA1156I occupies a strong mid-high position within the Kintex UltraScale lineup — offering substantially more logic and DSP resources than the KU035 while staying within the same compact 1156-pin footprint. This makes it an ideal upgrade path for density-constrained boards that cannot accommodate a larger package.
Supported High-Speed Protocols
The XCKU060-2FFVA1156I’s transceiver and I/O capabilities support a wide range of industry-standard protocols:
| Protocol |
Supported |
Notes |
| PCIe Gen1/2/3 |
Yes |
Up to ×8 lanes |
| 10GbE / 40GbE |
Yes |
Via GTH transceivers |
| CPRI / OBSAI |
Yes |
Wireless infrastructure |
| JESD204B |
Yes |
High-speed ADC/DAC interface |
| Interlaken |
Yes |
Chip-to-chip connectivity |
| DDR3 / DDR4 |
Yes |
External memory interfaces |
| AXI4 / AXI4-Stream |
Yes |
With Vivado IP Integrator |
| SATA / SAS |
Yes |
Storage applications |
Typical Applications for XCKU060-2FFVA1156I
The combination of dense logic, deep DSP pipeline, high-speed transceivers, and industrial temperature rating makes this FPGA suitable for a broad range of demanding use cases:
Wired & Wireless Communications
Line cards, base-station processing, CPRI fronthaul aggregation, and packet forwarding engines benefit from the device’s high transceiver density and programmable MAC layers.
Radar & Defense Signal Processing
High DSP slice count (2,760 slices) enables real-time radar waveform generation, pulse compression, and clutter filtering with minimal latency.
Medical Imaging
Ultrasound beamforming, CT reconstruction, and MRI signal acquisition pipelines require the kind of sustained floating-point-class DSP throughput this device delivers.
High-Performance Computing (HPC) Acceleration
The XCKU060-2FFVA1156I is used in FPGA-based compute acceleration cards for data center offload, genomics, and financial analytics workloads.
Industrial Machine Vision
High-resolution camera interfaces, real-time image processing pipelines, and multi-channel sensor fusion systems leverage the device’s I/O flexibility and block RAM depth.
Test & Measurement Equipment
Protocol analyzers, signal generators, and logic analyzers use this FPGA’s deterministic timing and reconfigurability for multi-standard compliance testing.
Development Tools & Ecosystem
Vivado Design Suite
AMD’s Vivado HLS and Vivado Design Suite provide full synthesis, implementation, and simulation support for the XCKU060-2FFVA1156I. The tool supports timing-driven placement and route with automated constraint management.
Vitis Unified Software Platform
For HLS-based acceleration flows, the Vitis platform enables C/C++ and OpenCL kernel development targeting the KU060 fabric, reducing HDL development time significantly.
IP Core Availability
Hundreds of validated Xilinx IP cores are available for this device, including PCIe DMA controllers, Ethernet MACs, DDR4 memory controllers, and DSP library functions — all pre-tested in the UltraScale device family.
Ordering Information
| Attribute |
Detail |
| Full Part Number |
XCKU060-2FFVA1156I |
| Manufacturer |
AMD (Xilinx) |
| Package |
1156-BBGA, FCBGA |
| Speed Grade |
–2 |
| Temperature Grade |
Industrial (–40°C to 100°C) |
| RoHS Status |
Compliant |
| Shipment Form |
Tray |
| Recommended Distributor |
DigiKey, Avnet, Newark, Arrow |
Frequently Asked Questions (FAQ)
Q: What is the difference between XCKU060-2FFVA1156I and XCKU060-2FFVA1156E?
The “I” suffix denotes an Industrial temperature grade (–40°C to 100°C TJ), while the “E” suffix denotes an Extended commercial grade with a narrower temperature range. The industrial variant is required for harsh environment applications in automotive, defense, and outdoor telecom equipment.
Q: What speed grade does the -2 designation refer to?
The –2 speed grade indicates a standard-speed performance tier within the Kintex UltraScale family. Speed grade –3 offers higher performance, while –1 targets lower power and cost-sensitive designs.
Q: Is the XCKU060-2FFVA1156I pin-compatible with other UltraScale devices?
Yes. Within the FFVA1156 package family, multiple Kintex UltraScale densities (KU035, KU060) share a common pinout, enabling design scalability without PCB re-spins.
Q: What CAD resources are available for this part?
Schematic symbols, PCB footprints, and 3D STEP models for the XCKU060-2FFVA1156I are available from AMD’s official resources and major distributors including Octopart, SnapEDA, and Ultra Librarian.
Q: Does this device support partial reconfiguration?
Yes. The Kintex UltraScale architecture fully supports partial reconfiguration (PR), allowing sections of the FPGA fabric to be reprogrammed at runtime without disrupting other active logic regions.
Summary
The XCKU060-2FFVA1156I is a proven, high-density industrial FPGA combining 725,550 logic cells, 2,760 DSP slices, 38.9 Mb of block RAM, and 20 GTH transceivers into a compact 1156-pin FCBGA package. Operating reliably across –40°C to 100°C, it is engineered for the most demanding signal processing, communications, and embedded computing applications. Backed by AMD’s full Vivado and Vitis toolchain, it offers a complete path from algorithm development to hardware deployment.
For engineers evaluating mid-to-high density FPGAs for their next design, the XCKU060-2FFVA1156I delivers ASIC-class architecture, industrial reliability, and broad protocol support — all within a footprint that fits standard high-density PCB designs.
