The XCKU060-1FFVA1517C is a high-performance Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Designed for demanding signal processing, networking, and compute applications, this device delivers exceptional logic density and DSP throughput in a mid-range, cost-optimized package. Whether you are building 100G network infrastructure, next-generation medical imaging systems, or high-bandwidth data center accelerators, the XCKU060-1FFVA1517C offers the right balance of performance, power efficiency, and flexibility.

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What Is the XCKU060-1FFVA1517C?

The XCKU060-1FFVA1517C is a Field Programmable Gate Array (FPGA) belonging to AMD Xilinx’s Kintex UltraScale product line. It is built on a 20nm process node using UltraScale architecture — the industry’s first ASIC-class All Programmable Architecture — enabling multi-hundred Gbps system performance with smart on-chip data routing and processing. The “1” in the part number denotes speed grade -1 (the slowest speed grade), which is well-suited for power-sensitive and cost-optimized deployments operating in the commercial temperature range of 0°C to 85°C.

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XCKU060-1FFVA1517C Key Specifications

General Identification

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Logic and Memory Resources

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I/O and Packaging

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Electrical Characteristics

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Compliance and Export

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XCKU060-1FFVA1517C Architecture Overview

UltraScale FPGA Architecture

The XCKU060-1FFVA1517C is built on AMD Xilinx’s UltraScale architecture, which represents a major leap from previous FPGA generations. This architecture introduces ASIC-like clocking, next-generation routing fabrics, and multi-die 3D IC integration (where applicable), enabling designers to achieve predictable timing closure even at high utilization levels.

Key architectural innovations include:

• Next-generation routing for reduced congestion and improved timing
• ASIC-like clocking with fine-grained clock gating for power savings
• 3D-on-3D IC multi-chip integration for the broader UltraScale family
• Multiprocessor SoC technologies for complex heterogeneous designs
• Co-optimization with Vivado® Design Suite for fast design closure

DSP and Signal Processing

The Kintex UltraScale family — including the XCKU060 — delivers up to 8.2 TeraMACs of DSP compute performance, making it one of the highest-performance mid-range FPGAs available. The architecture’s high DSP-to-logic and Block RAM-to-logic ratios make it purpose-built for signal-processing-intensive workloads.

Transceivers and High-Speed I/O

The XCKU060-1FFVA1517C supports next-generation transceivers capable of 12.5 Gb/s in the -1 speed grade, with the UltraScale family supporting up to 16G backplane-capable transceivers across up to 64 transceivers per device. These enable 100G networking and other multi-lane high-bandwidth interfaces.

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XCKU060-1FFVA1517C Performance Highlights

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Supported Applications

The XCKU060-1FFVA1517C is designed for a wide range of high-performance applications across industries:

Networking and Data Centers

• 100G Packet Processing: Ideal for line-rate packet inspection, switching, and forwarding
• Data Center Acceleration: FPGA-based workload offloading for compute-intensive tasks
• Backplane Interconnects: High-speed serial links for rack-scale connectivity

Wireless and Telecom Infrastructure

• Heterogeneous Wireless Infrastructure: Remote Radio Head (RRH) and Digital Front End (DFE) designs
• 4G/5G Baseband Processing: Signal chain processing for TD-LTE and NR waveforms
• CPRI/eCPRI Fronthaul Interfaces: Low-latency high-bandwidth radio access

Medical and Imaging

• Next-Generation Medical Imaging: MRI, CT, and ultrasound signal processing
• 8K/4K Video Processing: Real-time high-resolution video pipeline implementations

Defense and Aerospace

• Signal Intelligence (SIGINT): Wideband spectrum monitoring and analysis
• Radar and Sonar Processing: High-throughput real-time DSP chains
• Secure Communications: Configurable encryption and protocol stacks

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Why Choose the XCKU060-1FFVA1517C?

Best Price/Performance/Watt at 20nm

The Kintex UltraScale family was engineered to deliver the best price-to-performance ratio per watt in a mid-range FPGA device. Compared to the previous Kintex-7 generation, the XCKU060 achieves up to 40% lower power consumption while dramatically increasing logic density and DSP throughput.

Footprint Compatibility with Virtex UltraScale

The XCKU060-1FFVA1517C is footprint-compatible with Virtex® UltraScale™ devices, giving design teams an easy upgrade path for applications that require additional resources in the future, without a complete PCB redesign.

Vivado Design Suite Integration

Xilinx’s Vivado® Design Suite is fully co-optimized for UltraScale devices. This includes advanced synthesis, place-and-route, timing closure, and power analysis tools that reduce development time and ensure predictable performance across speed grades.

MicroBlaze Soft Processor Support

The XCKU060 supports the MicroBlaze™ soft processor, capable of running at over 200 DMIPs with 800 Mb/s DDR3 support, enabling embedded software control planes alongside hardware-accelerated data paths.

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Ordering and Availability

Note: Always source the XCKU060-1FFVA1517C from authorized distributors to ensure authenticity, warranty coverage, and RoHS compliance.

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XCKU060-1FFVA1517C vs. Other Kintex UltraScale Devices

The XCKU060 sits at an attractive midpoint — offering significantly higher logic density than entry-level Kintex UltraScale parts, while remaining more cost-effective than the larger XCKU095 and XCKU115 devices.

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Design Resources and Support

Designers working with the XCKU060-1FFVA1517C can access comprehensive documentation and tools from AMD Xilinx:

• Kintex UltraScale Data Sheet (DS892) – DC and AC switching characteristics
• UltraScale Architecture Reference Manual – Detailed CLB, DSP, and I/O architecture descriptions
• Vivado Design Suite – Full synthesis, implementation, and verification toolchain
• KCU105 Evaluation Kit – Development board featuring the Kintex UltraScale family for rapid prototyping
• Xilinx Answer Records – Searchable knowledge base for known issues and workarounds

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Frequently Asked Questions (FAQ)

Q: What is the operating temperature range of the XCKU060-1FFVA1517C?
A: The XCKU060-1FFVA1517C operates in the commercial temperature range of 0°C to 85°C, as indicated by the “C” suffix in the part number.

Q: What does the “-1” speed grade mean?
A: The -1 suffix denotes the slowest speed grade in the Kintex UltraScale family. It is appropriate for designs that do not require the highest clock frequencies and prioritize lower power consumption and cost efficiency.

Q: Is the XCKU060-1FFVA1517C RoHS compliant?
A: Yes, this device is RoHS compliant.

Q: What package does the XCKU060-1FFVA1517C use?
A: It uses a 1517-pin FCBGA (Flip Chip Ball Grid Array) package, also referred to as FFVA1517 or 1517-BBGA.

Q: Can I use the XCKU060-1FFVA1517C for 100G networking applications?
A: Yes. The Kintex UltraScale family, including the XCKU060, is specifically designed for 100G packet processing in networking and data center environments.

Q: What design tools support this device?
A: The XCKU060-1FFVA1517C is fully supported by the Vivado® Design Suite, which is co-optimized for UltraScale architecture devices.

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Summary

The XCKU060-1FFVA1517C is a powerful and versatile FPGA that delivers industry-leading mid-range performance in a cost-effective 20nm package. With 725,550 system logic cells, 624 user I/Os, a 1517-pin FCBGA footprint, and the full breadth of Kintex UltraScale architecture advantages — including next-generation transceivers, ASIC-like clocking, and deep Vivado toolchain integration — it is an excellent choice for engineers developing 100G networking equipment, medical imaging systems, wireless infrastructure, and high-performance data center applications.

For procurement, always verify stock and pricing with an authorized AMD Xilinx distributor and download the latest datasheet from the AMD documentation portal to ensure design compliance.