Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCKU060-1FFVA1156I FPGA Product Detail

Product Details

Part Overview

Attribute Description
Part Number XCKU060-1FFVA1156I
Manufacturer AMD (formerly Xilinx)
Product Family Kintex® UltraScale™ FPGA
Device XCKU060
Category Embedded – FPGAs (Field Programmable Gate Array)
Architecture UltraScale (20nm Technology)
Status Active

Part Number Breakdown

Code Meaning
XC Xilinx Commercial
KU Kintex UltraScale Family
060 Device density designation
-1 Speed Grade (-1 = Standard, -2 = High Performance, -3 = Highest Performance)
FF Flip-Chip Fine-pitch Ball Grid Array
VA Package Variant
1156 Pin Count (1156 pins)
I Industrial Temperature Grade (-40°C to +100°C)

Key Specifications

Parameter Value
System Logic Cells 725,550
CLB (Configurable Logic Blocks) 331,680
CLB LUTs 331,680
CLB Flip-Flops 663,360
DSP Slices (DSP48E2) 2,760
Block RAM (36Kb) 1,080 blocks
Block RAM Capacity 38.0 Mb (38,912 Kb)
Distributed RAM ~5.2 Mb
Max User I/O 520
GTH Transceivers 32
Max Transceiver Speed 16.3 Gb/s
PCIe® Hard Blocks Up to 4x Gen3 x8 or 2x Gen3 x16
Maximum Operating Frequency 630 MHz
Core Voltage (VCCINT) 0.95V (922–979 mV typical)

Package Information

Parameter Specification
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code FFVA1156
Pin Count 1156 pins
Ball Pitch 1.0 mm
Package Dimensions 35mm × 35mm
RoHS Compliant Yes
Moisture Sensitivity Level (MSL) 3

Temperature & Operating Conditions

Parameter Specification
Temperature Grade Industrial (I)
Operating Junction Temperature -40°C to +100°C
Storage Temperature -65°C to +150°C

Clock Management

Parameter Value
MMCM (Mixed-Mode Clock Manager) 10
PLL (Phase-Locked Loop) 20
Max Clock Frequency 630 MHz

Memory Interface Support

Memory Type Max Data Rate
DDR4 2,400 Mb/s
DDR3 1,866 Mb/s
LPDDR3 1,866 Mb/s
RLDRAM 3 2,133 Mb/s
QDR IV 2,133 Mb/s

DSP Slice Features (DSP48E2)

Feature Specification
Multiplier 27×18 signed
Pre-Adder 27-bit
Accumulator 48-bit
XOR Functionality 96-bit wide
Functions Multiply-accumulate, multiply-add, pattern detect

Kintex UltraScale Family Comparison

Device Logic Cells DSP Slices Block RAM (Mb) GTH Transceivers Max I/O
XCKU025 318K 1,152 12.7 12 312
XCKU035 444K 1,700 19.0 16 520
XCKU040 530K 1,920 21.1 20 520
XCKU060 726K 2,760 38.0 32 624
XCKU085 1,088K 4,100 56.9 56 676
XCKU095 1,176K 768 59.1 64 702
XCKU115 1,451K 5,520 75.9 64 832

Position Ranking Within Kintex UltraScale Family

The XCKU060 is positioned as a mid-range device within the Kintex UltraScale family:

Ranking Criteria Position Notes
Overall Capacity 4th of 7 Mid-range in the family
Logic Cells 4th 726K cells – good balance
DSP Performance 3rd 2,760 slices – strong DSP capability
Memory (Block RAM) 4th 38 Mb – suitable for most applications
Transceivers 4th 32 GTH @ 16.3 Gb/s
Price/Performance Excellent Best value for mid-density designs

Summary: The XCKU060 offers an excellent balance of logic, memory, and DSP resources, making it ideal for applications requiring moderate to high complexity without the premium cost of larger devices like XCKU085 or XCKU115.


Target Applications

  • 100G Networking & Packet Processing
  • Data Center Infrastructure
  • Medical Imaging (256-channel ultrasound)
  • 8K/4K Video Processing
  • Wireless Infrastructure (LTE/5G Remote Radio Head)
  • High-Performance Computing
  • Industrial Automation
  • Test & Measurement Equipment
  • Aerospace & Defense Systems

Key Advantages

Advantage Description
Price/Performance Best-in-class for 20nm FPGAs
Power Efficiency Up to 40% lower power vs. previous generation
DSP Capability High DSP-to-logic ratio for signal processing
Memory Bandwidth 2,400 Mb/s DDR4 support
High-Speed Serial 16.3 Gb/s transceivers for backplane applications
Design Tools Co-optimized with Vivado® Design Suite
Scalability Footprint compatible with Virtex UltraScale

Design Resources

Resource Description
Design Software Vivado® Design Suite
Evaluation Kit KCU105 (uses XCKU040)
IP Cores PCIe Gen3, DDR4, 100G Ethernet
Documentation DS892 (DC/AC Switching Characteristics)

Ordering Information

Variant Speed Grade Temperature Package
XCKU060-1FFVA1156C -1 Commercial (0°C to +85°C) FFVA1156
XCKU060-1FFVA1156I -1 Industrial (-40°C to +100°C) FFVA1156
XCKU060-2FFVA1156E -2 Extended (-40°C to +100°C) FFVA1156
XCKU060-2FFVA1156I -2 Industrial FFVA1156
XCKU060-1FFVA1517I -1 Industrial FFVA1517 (624 I/O)

This document provides comprehensive specifications for the XCKU060-1FFVA1156I. For the latest pricing and availability

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.