The XCKU040-3SFVA784E is a high-performance Xilinx FPGA from the AMD Kintex UltraScale family, built on 20nm process technology. Designed for demanding DSP-intensive applications, this device delivers the highest speed grade (-3) available in the Kintex UltraScale lineup — making it the optimal choice when performance is the primary requirement. With 424,200 logic cells, a 784-pin FC-BGA package, and next-generation GTH transceivers, the XCKU040-3SFVA784E strikes an industry-leading balance between capability, power efficiency, and cost.
What Is the XCKU040-3SFVA784E?
The XCKU040-3SFVA784E is part of AMD’s (formerly Xilinx) Kintex UltraScale FPGA series — the industry’s first 20nm mid-range FPGA family. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 040 |
Device Size (040 tier) |
| -3 |
Speed Grade (highest performance) |
| SFVA |
Package Code (FC-BGA, Super Fine Pitch) |
| 784 |
Pin Count (784 pins) |
| E |
Temperature Grade (Commercial, 0°C to +85°C) |
XCKU040-3SFVA784E Key Specifications
Core Logic Resources
| Specification |
Value |
| Logic Cells |
424,200 |
| CLB Flip-Flops |
~486,000 |
| CLB LUTs |
~242,400 |
| Distributed RAM |
~8.5 Mb |
| Block RAM (36K blocks) |
600 |
| Total Block RAM |
21.1 Mb |
DSP and Signal Processing
| Specification |
Value |
| DSP Slices |
1,920 |
| DSP Performance |
Up to 2.7 TOPS (Tera Operations/Second) |
Transceivers and High-Speed I/O
| Specification |
Value |
| GTH Transceivers |
20 |
| Max Transceiver Speed (SFVA784 pkg) |
12.5 Gb/s |
| PCIe Hard Block |
Gen3 x8 |
| 100G Ethernet MAC |
Yes |
| 150G Interlaken |
Yes |
Package and Electrical
| Specification |
Value |
| Package Type |
FC-BGA (Flip-Chip Ball Grid Array) |
| Pin Count |
784 |
| VCCINT Supply Voltage |
1.0V (nominal) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
20nm |
| Maximum HP I/O |
208 |
XCKU040-3SFVA784E Speed Grades Comparison
The XCKU040 is available in multiple speed grades. Understanding the differences helps you select the right variant for your design.
| Speed Grade |
VCCINT Voltage |
Performance Level |
Typical Use Case |
| -3 (XCKU040-3SFVA784E) |
1.0V |
Highest |
Maximum throughput, low-latency designs |
| -2 |
0.95V |
High |
Balanced performance / power |
| -1 |
0.95V |
Standard |
Cost-sensitive applications |
| -1L |
0.95V / 0.90V |
Low Power |
Power-constrained systems |
Note: The -3 speed grade in the XCKU040-3SFVA784E is the fastest available in the Kintex UltraScale family, making it ideal for applications that demand maximum clock frequency and data throughput.
XCKU040-3SFVA784E Architecture Highlights
UltraScale Architecture — 20nm Process Advantage
The XCKU040-3SFVA784E is built on AMD’s UltraScale architecture at 20nm — the same routing and logic technology used in the high-end Virtex UltraScale family. Key architectural innovations include:
- AMBA AXI4-based NoC routing for deterministic, low-latency data movement across the chip
- Advanced 3D clocking with MMCM and PLL blocks in every I/O column
- UltraRAM blocks (where applicable in UltraScale+) for large on-chip memory without BOM cost increases
- Next-generation DSP58E2 slices optimized for signal processing pipelines
GTH Transceivers Up to 12.5 Gb/s
The XCKU040-3SFVA784E includes 20 GTH multi-gigabit transceivers in the SFVA784 package, supporting data rates up to 12.5 Gb/s per lane. These transceivers support a wide range of protocols including JESD204B, PCIe, 10GbE, SATA, and custom serial links.
Integrated Hard IP Blocks
Hard IP reduces design complexity, saves logic resources, and achieves higher reliability compared to soft implementations:
- PCIe Gen3 x8 — high-bandwidth host interface
- 100G Ethernet MAC — for demanding networking applications
- 150G Interlaken — chip-to-chip and backplane connectivity
XCKU040-3SFVA784E Package Options — SFVA784 vs Other Packages
The XCKU040 die is available in multiple packages. The SFVA784 (used in the XCKU040-3SFVA784E) is the smallest package option for this die, offering a compact footprint suitable for space-constrained PCB designs.
| Package |
Pins |
Max HP I/O |
GTH Transceivers |
Max Transceiver Rate |
| SFVA784 (this part) |
784 |
208 |
20 |
12.5 Gb/s |
| FBVA676 |
676 |
156 |
8 |
12.5 Gb/s |
| FBVA900 |
900 |
312 |
16 |
12.5 Gb/s |
| FFVA1156 |
1156 |
520 |
24 |
16.3 Gb/s |
XCKU040-3SFVA784E Applications
The XCKU040-3SFVA784E’s high DSP count, fast GTH transceivers, and maximum speed grade make it particularly well suited for:
Wireless and 5G Infrastructure
The device’s DSP slice density and integrated 100G Ethernet MAC support real-time beamforming, massive MIMO processing, and fronthaul/backhaul applications in 5G base stations and remote radio units (RRUs).
Defense and Aerospace Signal Processing
With its commercial temperature grade, high logic density, and GTH transceivers, the XCKU040-3SFVA784E is widely used in radar signal processing, electronic warfare (EW), and software-defined radio (SDR) systems.
Data Center Acceleration and Networking
PCIe Gen3 x8 and 100G Ethernet support enable network packet processing, hardware acceleration for machine learning inference, and low-latency algorithmic trading platforms.
Medical Imaging and Instrumentation
High-speed ADC/DAC interfaces via GTH transceivers, combined with massive parallel DSP capacity, make this FPGA ideal for CT scan reconstruction, ultrasound beamforming, and high-bandwidth test equipment.
Industrial Machine Vision
The device’s logic capacity and memory bandwidth support real-time image processing pipelines, pattern recognition, and high-resolution video analytics in industrial automation systems.
XCKU040-3SFVA784E Development and Design Tools
AMD’s Vivado Design Suite is the primary tool for designing with the XCKU040-3SFVA784E. Vivado supports:
- Synthesis, implementation, and timing closure
- IP integrator for rapid block design creation
- Simulation and waveform debugging
- High-Level Synthesis (HLS) for C/C++ to RTL flows
The XCKU040-3SFVA784E is also footprint-compatible with the Virtex UltraScale family within the same package sequence, allowing straightforward design migration between product tiers without PCB redesign.
XCKU040-3SFVA784E Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCKU040-3SFVA784E |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Kintex UltraScale |
| Package |
784-BBGA, FCBGA (FC-BGA) |
| Logic Cells |
424,200 |
| Speed Grade |
-3 (Highest) |
| Temperature Grade |
Commercial (E) — 0°C to +85°C |
| Supply Voltage |
1.0V (VCCINT) |
| RoHS Compliance |
Yes |
| Lifecycle |
Production |
Frequently Asked Questions About the XCKU040-3SFVA784E
What does the “-3” speed grade mean in XCKU040-3SFVA784E?
The -3 speed grade represents the highest performance tier available in the Kintex UltraScale family. It operates with VCCINT at 1.0V and provides the fastest internal clock speeds and shortest path delays, achieving maximum frequency in timing-critical designs.
What is the difference between XCKU040-3SFVA784E and XCKU040-2SFVA784E?
Both parts share the same die, package, and pin count. The key difference is the speed grade: the -3 variant (XCKU040-3SFVA784E) is binned for higher performance, while the -2 variant operates at 0.95V VCCINT with slightly lower maximum frequencies. Designers targeting maximum throughput should choose the -3 variant.
Is the XCKU040-3SFVA784E compatible with Vivado Design Suite?
Yes. The XCKU040-3SFVA784E is fully supported in Vivado Design Suite 2015.4 and all subsequent releases, including the latest Vivado ML editions.
Can the XCKU040-3SFVA784E be used in industrial temperature applications?
No. The “E” temperature suffix denotes a commercial-grade device rated for 0°C to +85°C. For industrial temperature ranges (-40°C to +100°C), use the XCKU040-3SFVA784I variant.
What transceiver data rate does the XCKU040-3SFVA784E support?
In the SFVA784 package, the GTH transceivers support a maximum data rate of 12.5 Gb/s per lane. Higher transceiver speeds (up to 16.3 Gb/s) are available in the larger FFVA1156 package variants.
