The XCKU040-3FFVA1156E is a high-performance field-programmable gate array (FPGA) from AMD Xilinx, belonging to the Kintex® UltraScale™ family. Built on 20nm process technology and housed in a 1156-pin FCBGA package, this device delivers an outstanding balance of processing power, DSP performance, and power efficiency — making it one of the most sought-after mid-range FPGAs for demanding embedded and signal-processing applications.
Whether you are designing next-generation networking equipment, advanced medical imaging systems, or high-bandwidth data center accelerators, the XCKU040-3FFVA1156E is engineered to meet the challenge. This page covers full specifications, key features, pinout details, supported applications, and everything else you need to evaluate or purchase this part.
What Is the XCKU040-3FFVA1156E?
The XCKU040-3FFVA1156E is part of AMD Xilinx’s Kintex UltraScale series — the first ASIC-class All Programmable Architecture designed to enable multi-hundred Gbps levels of system performance. The “-3” suffix denotes the fastest available speed grade, while “FFVA1156” refers to the Fine-Pitch Ball Grid Array (FCBGA) package with 1156 pins and the “E” suffix indicates the commercial temperature range.
As part of the broader family of Xilinx FPGA products, the XCKU040 series is purpose-built to offer the best price-per-performance-per-watt ratio in the mid-range FPGA segment.
XCKU040-3FFVA1156E Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU040-3FFVA1156E |
| FPGA Family |
Kintex® UltraScale™ |
| Process Node |
20nm |
| Speed Grade |
-3 (Fastest) |
| Logic Cells / System Logic Cells |
530,250 |
| CLB Logic Blocks |
242,400 |
| Package |
1156-Pin FCBGA (BBGA) |
| Package Code |
FFVA1156 |
| Total I/O Pins |
520 |
| Maximum Operating Frequency |
850 MHz |
| Core Supply Voltage (VCCINT) |
922 mV – 979 mV |
| I/O Supply Voltage |
Up to 3.3V |
| Total Block RAM |
21,606 Kbits |
| Clock Management |
MMCM, PLL |
| Temperature Range |
Commercial (0°C to +85°C) |
| Operating Status |
Active |
| RoHS Compliance |
Compliant |
XCKU040-3FFVA1156E Detailed Technical Specifications
## Logic and Processing Resources
The XCKU040-3FFVA1156E provides a rich set of programmable logic resources designed for high-utilization, complex digital designs:
| Resource |
Specification |
| System Logic Cells |
530,250 |
| CLB Logic Blocks |
242,400 |
| CLB Flip-Flops |
484,800 |
| LUT-Based Logic |
242,400 LUTs |
| Distributed RAM (Kb) |
3,040 |
| UltraRAM Blocks (URAM) |
0 (available in UltraScale+) |
| Block RAM Tiles |
600 |
| Total Block RAM (Kbits) |
21,606 |
## DSP Performance
The XCKU040-3FFVA1156E features dedicated DSP48E2 slices optimized for high-throughput arithmetic operations — critical for signal processing, image processing, and machine learning inference workloads.
| DSP Parameter |
Value |
| DSP48E2 Slices |
1,920 |
| Max DSP Performance |
~3.26 TeraMACs |
| Cascade Chains |
Supported |
| Pre-Adder Support |
Yes |
| 27×18 Multiplier |
Yes |
## I/O and Connectivity
| I/O Parameter |
Value |
| User I/O Pins |
520 |
| I/O Banks |
12 |
| High-Range (HR) I/O Banks |
6 |
| High-Performance (HP) I/O Banks |
6 |
| Max Single-Ended I/O Standards |
LVCMOS, LVTTL, HSTL, SSTL, etc. |
| Max Differential I/O Standards |
LVDS, LVDS_25, TMDS, etc. |
| SelectIO Voltage Range |
1.2V – 3.3V |
## Clocking Resources
| Clock Parameter |
Value |
| MMCMs (Mixed-Mode Clock Managers) |
8 |
| PLLs (Phase-Locked Loops) |
8 |
| Global Clock Buffers |
32 |
| Regional Clock Buffers |
96 |
| Max Input Clock Frequency |
800 MHz |
## High-Speed Serial Transceivers
| Transceiver Parameter |
Value |
| GTH Transceivers |
20 |
| Max Line Rate (GTH) |
16.3 Gbps |
| Min Line Rate (GTH) |
500 Mbps |
| Supported Protocols |
PCIe Gen3, CPRI, JESD204B, 10GbE, SATA/SAS, etc. |
| Integrated PCIe Gen3 Core |
Yes (x8 capable) |
## Package Information
| Package Parameter |
Value |
| Package Type |
FCBGA (Fine-Pitch Ball Grid Array) |
| Package Designation |
FFVA1156 |
| Pin Count |
1156 |
| Body Size |
35mm × 35mm |
| Ball Pitch |
1.0mm |
| Height (max) |
~2.65mm |
| PCB Land Pattern |
BGA |
## XCKU040-3FFVA1156E Speed Grade Comparison
The XCKU040 is available in multiple speed grades. The -3 (used in this part) is the highest-performance option:
| Speed Grade |
Max Frequency |
VCCINT Voltage |
Use Case |
| -3 (XCKU040-3FFVA1156E) |
850 MHz |
~0.95–1.0V |
Highest performance |
| -2 (XCKU040-2FFVA1156E) |
725 MHz |
~0.95V |
Standard performance |
| -1 (XCKU040-1FFVA1156E) |
661 MHz |
~0.95V |
Cost-optimized |
| -1L (Low Power) |
Matched to -1 |
0.90V or 0.95V |
Lowest power |
## Part Number Decoder: What Does XCKU040-3FFVA1156E Mean?
Understanding the AMD Xilinx part numbering convention helps engineers quickly identify the correct device:
| Segment |
Meaning |
| XC |
Xilinx Commercial device |
| KU |
Kintex UltraScale family |
| 040 |
Device density identifier (040 = mid-range) |
| -3 |
Speed grade 3 (fastest available) |
| FF |
Flip-chip Fine-Pitch Ball Grid Array |
| VA |
Package variant |
| 1156 |
Number of package pins |
| E |
Commercial temperature range (0°C to +85°C) |
## Key Features of the Kintex UltraScale Architecture
The XCKU040-3FFVA1156E is built on the UltraScale architecture — AMD Xilinx’s breakthrough design platform introduced at 20nm. Here is what sets it apart:
### ASIC-Like Performance at FPGA Flexibility
The UltraScale architecture uses next-generation routing and ASIC-like clocking to deliver up to 2 speed-grade improvements in performance at high logic utilization levels. Designers get predictable timing closure without sacrificing programmability.
### Advanced Memory Architecture
With 21,606 Kbits of dedicated Block RAM (BRAM) distributed across 600 36Kb tiles, the XCKU040-3FFVA1156E supports deep buffering, large coefficient storage, and efficient packet processing. Block RAMs are accessible in true dual-port, simple dual-port, and single-port configurations.
### Next-Generation GTH Transceivers
The 20 integrated GTH transceivers support line rates from 500 Mbps to 16.3 Gbps per channel. These transceivers are designed for low-jitter, low-BER operation and support a wide range of industry protocols including PCIe Gen3, JESD204B, CPRI, 10GbE, and 40GbE aggregated links.
### High Signal Processing Bandwidth
The device provides up to 3.26 TeraMACs of DSP compute performance through 1,920 DSP48E2 slices. This is particularly valuable for radar, communications, image processing, and machine learning inference applications.
### Low Power Consumption
The XCKU040-3FFVA1156E delivers up to 40% lower power than previous-generation FPGAs. Fine-grained clock gating, intelligent power domains, and process technology improvements all contribute to a significantly reduced power envelope — critical for thermally constrained system designs.
### Vivado Design Suite Compatibility
The part is fully supported by AMD’s Vivado® Design Suite, offering advanced synthesis, implementation, and verification tools. Vivado’s incremental implementation and design run capabilities accelerate time-to-closure for complex FPGA designs.
### Footprint Compatibility with Virtex UltraScale
The XCKU040 in the FFVA1156 package maintains footprint compatibility with selected Virtex® UltraScale™ devices, allowing designers to scale their designs up or down without a PCB respin.
## Supported Applications
The XCKU040-3FFVA1156E is designed for high-performance embedded and signal-processing applications across multiple industries:
| Application Area |
Use Cases |
| Wireless & Wireline Communications |
CPRI fronthaul, 5G baseband, 100G networking |
| Data Centers |
FPGA-based accelerators, packet processing, offload engines |
| Medical Imaging |
Ultrasound signal processing, CT/MRI reconstruction |
| Defense & Aerospace |
Radar signal processing, SIGINT, electronic warfare |
| Broadcast & Video |
4K/8K video processing, real-time encoding/decoding |
| Test & Measurement |
High-speed ADC/DAC interfaces, automated test equipment |
| Industrial |
Motor control, machine vision, real-time control systems |
| Scientific Computing |
HPC acceleration, FPGA-based simulation |
## XCKU040-3FFVA1156E vs. Related Parts
| Part Number |
Speed Grade |
Package |
Cells |
Transceivers |
Temp Range |
| XCKU040-3FFVA1156E |
-3 (Fastest) |
FCBGA-1156 |
530,250 |
20x GTH |
Commercial |
| XCKU040-2FFVA1156E |
-2 |
FCBGA-1156 |
530,250 |
20x GTH |
Commercial |
| XCKU040-1FFVA1156E |
-1 |
FCBGA-1156 |
530,250 |
20x GTH |
Commercial |
| XCKU040-3FFVA1156I |
-3 |
FCBGA-1156 |
530,250 |
20x GTH |
Industrial |
| XCKU035-3FBVA900E |
-3 |
FBVA-900 |
326,400 |
16x GTH |
Commercial |
| XCKU060-3FFVA1156E |
-3 |
FCBGA-1156 |
725,625 |
32x GTH |
Commercial |
## Power Supply Requirements
The XCKU040-3FFVA1156E requires multiple regulated supply rails. Engineers should design power sequencing carefully and use the AMD Xilinx Power Estimator (XPE) tool for accurate current budgeting.
| Power Rail |
Voltage |
Description |
| VCCINT |
0.922V – 0.979V |
Core logic supply |
| VCCAUX |
1.8V |
Auxiliary supply |
| VCCAUX_IO |
1.8V |
Auxiliary I/O supply |
| VCCO |
1.2V – 3.3V |
I/O output supply (per bank) |
| VCCBRAM |
0.922V – 0.979V |
Block RAM supply |
| MGTAVCC |
1.0V |
GTH transceiver analog supply |
| MGTAVTT |
1.2V |
GTH transceiver termination |
| MGTVCCAUX |
1.8V |
GTH transceiver auxiliary |
## Design Tool Support
| Tool / Resource |
Details |
| Primary Design Tool |
Vivado® Design Suite (v2014.1 and later) |
| Simulation |
ModelSim, Questa, Vivado Simulator |
| IP Cores |
Xilinx IP Catalog (PCIe, Ethernet, DDR4, etc.) |
| High-Level Synthesis |
Vitis HLS |
| Constraint File |
XDC (Xilinx Design Constraints) |
| Configuration Interface |
JTAG, SPI, BPI, SelectMAP |
| Power Analysis |
Xilinx Power Estimator (XPE) |
## Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCKU040-3FFVA1156E |
| Manufacturer |
AMD (formerly Xilinx) |
| DigiKey Part Number |
1100-1707-ND |
| Product Category |
Embedded – FPGAs (Field Programmable Gate Array) |
| RoHS Status |
RoHS Compliant |
| Moisture Sensitivity Level (MSL) |
MSL 3 – 168 Hours |
| Packaging |
Tray |
| Operating Status |
Active Production |
## Frequently Asked Questions (FAQ)
### What does the “-3” speed grade mean for the XCKU040-3FFVA1156E?
The “-3” speed grade indicates the fastest performance tier within the XCKU040 family. Devices with speed grade -3 operate at up to 850 MHz and are screened for tighter timing parameters compared to -2 or -1 devices. They are ideal when maximum clock frequency and logic throughput are critical.
### Is the XCKU040-3FFVA1156E RoHS compliant?
Yes, the XCKU040-3FFVA1156E is RoHS (Restriction of Hazardous Substances) compliant, making it suitable for use in products sold in the European Union and other markets with environmental compliance requirements.
### What design software is used for the XCKU040-3FFVA1156E?
The primary development environment is AMD’s Vivado® Design Suite. It handles synthesis, place-and-route, timing analysis, and bitstream generation. For high-level synthesis from C/C++, Vitis HLS is also supported.
### Can the XCKU040-3FFVA1156E be used in industrial temperature applications?
This specific part number (ending in “E”) is rated for the commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +100°C), the equivalent part is the XCKU040-3FFVA1156I.
### What protocols do the GTH transceivers support?
The 20 GTH transceivers in the XCKU040-3FFVA1156E support a wide range of high-speed serial protocols including PCIe Gen3, 10GbE/40GbE, JESD204B (for ADC/DAC interfaces), CPRI (for wireless fronthaul), Aurora, SATA, and custom serial links up to 16.3 Gbps.
### Is this device compatible with DDR4 memory?
Yes. The XCKU040-3FFVA1156E supports DDR4 SDRAM interfaces at up to 2400 Mbps data rates through its HP (High-Performance) I/O banks, enabling high-bandwidth external memory access for buffering and data-intensive applications.
## Summary
The XCKU040-3FFVA1156E is a production-grade, high-performance FPGA that combines 530,250 logic cells, 20 GTH transceivers at up to 16.3 Gbps, 1,920 DSP slices, and rich memory resources in a 1156-pin FCBGA package. Built on 20nm technology with AMD’s UltraScale architecture, it provides ASIC-class performance with the flexibility of field-programmable logic. Its -3 speed grade and commercial temperature rating make it the top choice for demanding signal-processing, communications, and data-center acceleration designs where maximum throughput is the priority.
For engineers evaluating mid-range FPGAs, the XCKU040-3FFVA1156E represents a compelling combination of density, bandwidth, and power efficiency — all backed by AMD’s comprehensive Vivado ecosystem and extensive IP library.
