The XCKU040-2FBVA900I is a mid-range, high-performance FPGA from AMD Xilinx’s Kintex® UltraScale™ family. Built on a 20nm process node, this device delivers an outstanding balance of price, performance, and power efficiency — making it a preferred choice for engineers working on DSP-intensive applications, 5G wireless infrastructure, high-speed networking, and machine learning acceleration.
Whether you are designing next-generation communications hardware or a data-intensive industrial system, the XCKU040-2FBVA900I provides the computational density and I/O flexibility to meet demanding design requirements. Explore the full range of Xilinx FPGA solutions to find the right device for your project.
What Is the XCKU040-2FBVA900I?
The XCKU040-2FBVA900I belongs to the Kintex UltraScale product family — AMD Xilinx’s mid-range FPGA series optimized for the highest signal processing bandwidth at 20nm. The “2” in the part number denotes a mid-range speed grade, the “FBVA900” describes the FCBGA (Fine-Pitch Chip Ball Grid Array) package with 900 pins, and the “I” suffix indicates an industrial temperature rating, qualifying the device for extended operating environments.
This device is manufactured by AMD (formerly Xilinx) and is categorized under Embedded – FPGAs (Field Programmable Gate Arrays).
XCKU040-2FBVA900I Key Specifications
General Identification
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU040-2FBVA900I |
| Series / Family |
Kintex® UltraScale™ |
| Package Type |
FCBGA (Fine-Pitch Ball Grid Array) |
| Package / Case |
FBVA-900 |
| Total Pin Count |
900 |
| Temperature Grade |
Industrial (I) |
| Speed Grade |
-2 (Mid) |
| RoHS Compliant |
Yes |
Logic and Fabric Resources
| Resource |
Specification |
| Logic Cells |
530,250 |
| CLB Logic Blocks |
242,400 |
| LUT Elements |
~242,400 (6-input LUTs) |
| Flip-Flops |
~530,250 |
| Process Node |
20nm |
| Architecture |
UltraScale (Monolithic + SSI) |
Memory Resources
| Memory Type |
Capacity |
| Block RAM (BRAM) |
21,606 Kbit (~21.1 Mb) |
| UltraRAM (URAM) |
Included (on-chip) |
| Distributed RAM |
Available via LUTs |
I/O and Connectivity
| Feature |
Value |
| User I/O Pins |
520 |
| High-Speed Serial Transceivers |
Up to 20 |
| Maximum Transceiver Data Rate |
16 Gb/s |
| I/O Voltage |
3.3V |
| Maximum Clock Frequency |
725 MHz |
| Clocking Resources |
MMCM, PLL |
| I/O Standards Supported |
LVCMOS, LVDS, SSTL, HSTL, and more |
Power and Supply
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
0.922V – 0.979V |
| Power Reduction vs. Previous Gen |
Up to 40% |
| BOM Cost Reduction vs. Previous Gen |
Up to 60% |
XCKU040-2FBVA900I Physical Package Details
The XCKU040-2FBVA900I is housed in an FCBGA-900 package (also referred to as FBVA-900). This fine-pitch ball grid array is designed for high-density PCB designs, offering a large number of I/Os in a compact footprint.
| Package Attribute |
Detail |
| Package Style |
FCBGA (Fine-Pitch Chip BGA) |
| Pin Count |
900 |
| Package Designator |
FBVA900 |
| Mounting Style |
Surface Mount (SMT) |
| Thermal Solution |
Compatible with heatsink solutions (e.g., FAN8060) |
AMD Kintex UltraScale Architecture Overview
UltraScale Fabric and Logic
The XCKU040-2FBVA900I is built on the UltraScale architecture, which AMD Xilinx describes as the industry’s first ASIC-class programmable architecture. It introduces route-ahead pipelining, enabling up to 90% utilization without performance penalties — a significant improvement over previous 7-Series devices.
20nm Process Technology
The 20nm process node provides substantial benefits over the older 28nm generation, including:
- Lower static power consumption through enhanced transistor leakage control
- Higher logic density per unit area
- Improved signal integrity at high data rates
Next-Generation Transceivers
The integrated high-speed transceivers in the XCKU040-2FBVA900I support data rates up to 16 Gb/s, enabling direct interfacing with industry-standard protocols such as PCIe Gen3, 10/40/100G Ethernet, Interlaken, and JESD204B.
DSP Processing Capability
The Kintex UltraScale family, including the XCKU040, features a high DSP-to-logic ratio, making it particularly well-suited for applications requiring signal processing at scale — including radar, communications baseband, and video processing.
XCKU040-2FBVA900I: Target Applications
The XCKU040-2FBVA900I is designed to address a wide range of high-performance embedded applications:
5G Wireless Infrastructure
The device’s high transceiver count and DSP capacity make it ideal for Remote Radio Heads (RRH), Digital Front End (DFE) processing, and baseband unit (BBU) designs in 4G LTE and 5G NR deployments.
Data Center and 100G Networking
With native support for high-speed serial interfaces up to 16 Gb/s, the XCKU040-2FBVA900I is well-suited for 100G packet processing, network switches, and FPGA-accelerated SmartNIC designs.
Medical Imaging
The DSP bandwidth and high memory capacity support demanding medical imaging pipelines, including ultrasound beamforming, MRI reconstruction, and real-time diagnostic processing.
Artificial Intelligence and Machine Learning
FPGA acceleration of neural network inference benefits from the configurable logic, high memory bandwidth, and DSP blocks available in the XCKU040-2FBVA900I, supporting low-latency edge AI deployments.
High-Resolution Video Processing
Supporting up to 8K/4K video processing pipelines, the device handles complex multi-stream image capture, encoding, and display tasks in broadcast and industrial camera systems.
Industrial Automation and Robotics
The robust I/O capabilities and industrial temperature rating make the XCKU040-2FBVA900I suitable for real-time control systems, precision motion controllers, and robotics vision platforms.
Ordering and Part Number Decoder
Understanding the AMD Xilinx part numbering system helps you select the right variant:
| Part Number Field |
Meaning |
| XC |
Xilinx Commercial Device |
| KU |
Kintex UltraScale Family |
| 040 |
Device Size (Logic Density Tier) |
| -2 |
Speed Grade (Mid-range) |
| FBVA |
Package Type (Fine-Pitch BGA) |
| 900 |
Pin Count |
| I |
Temperature Grade (Industrial: –40°C to +100°C) |
Related Part Numbers
| Part Number |
Speed Grade |
Temperature |
Package |
| XCKU040-2FBVA900I |
-2 (Mid) |
Industrial |
FCBGA-900 |
| XCKU040-2FBVA900E |
-2 (Mid) |
Extended |
FCBGA-900 |
| XCKU040-3FBVA900E |
-3 (Fast) |
Extended |
FCBGA-900 |
| XCKU040-1FBVA900I |
-1 (Slow) |
Industrial |
FCBGA-900 |
XCKU040-2FBVA900I vs. Similar Kintex UltraScale Devices
| Feature |
XCKU025 |
XCKU040 |
XCKU060 |
XCKU095 |
| Logic Cells |
~345K |
530K |
~726K |
~1,143K |
| Block RAM |
~13.5 Mb |
21.1 Mb |
~38 Mb |
~71 Mb |
| DSP Slices |
1,080 |
1,920 |
2,760 |
4,320 |
| Transceivers |
16 |
20 |
32 |
60 |
| Max I/Os |
330 |
520 |
520 |
680 |
| Package Options |
FBVA676 |
FBVA900 |
FBVA900 |
FBVA1156 |
Design Tools and Development Environment
Vivado Design Suite
The XCKU040-2FBVA900I is fully supported by AMD’s Vivado Design Suite, which provides:
- HDL synthesis and place-and-route
- IP Integrator for block-based design
- Vivado Simulator for functional and timing verification
- Power analysis and optimization tools
- Support for Verilog, VHDL, and SystemVerilog
IP Cores and Reference Designs
AMD provides a comprehensive library of validated IP cores for the Kintex UltraScale family, covering PCIe, Ethernet, Memory Controllers, Video Processing, and more — reducing time-to-market for complex system designs.
Evaluation Kits
The KCU105 Evaluation Kit from AMD is the recommended development platform for the XCKU040 device family. Third-party boards such as the ALINX AXKU040 also provide accessible development environments with rich I/O peripherals.
Compliance and Certifications
| Compliance |
Status |
| RoHS (Restriction of Hazardous Substances) |
Compliant |
| REACH |
Compliant |
| Halogen-Free |
Available |
| Export Control (ECCN) |
Contact distributor for classification |
Frequently Asked Questions (FAQ)
What is the operating temperature range of the XCKU040-2FBVA900I?
The “I” suffix indicates an Industrial temperature grade, meaning the device is rated for operation from –40°C to +100°C junction temperature, suitable for rugged and harsh environments.
What speed grade does the -2 suffix represent?
The -2 speed grade is the mid-tier offering in the Kintex UltraScale speed grade range. It provides a balance between performance and power, with a maximum clock frequency of approximately 725 MHz for internal logic paths.
Is the XCKU040-2FBVA900I pin-compatible with other Kintex UltraScale devices?
Yes. Devices within the same package footprint (FBVA-900) maintain pin-compatibility across different density variants in the Kintex UltraScale family, simplifying hardware design migration or future upgrades.
What programming file format does this FPGA use?
The XCKU040-2FBVA900I uses a bitstream file (.bit or .bin) generated by the Vivado Design Suite. Configuration can be performed via JTAG, SPI Flash, or BPI Flash interfaces.
Can the XCKU040-2FBVA900I be used in aerospace or defense applications?
While the industrial-grade variant (-I) offers extended temperature operation, aerospace and defense applications typically require radiation-hardened or militarized variants. Contact AMD or an authorized distributor for specific qualification documentation.
Summary
The XCKU040-2FBVA900I is a powerful, cost-effective FPGA solution from the AMD Xilinx Kintex UltraScale family. With 530,250 logic cells, 21.1 Mb of block RAM, 20 high-speed transceivers capable of 16 Gb/s, and a robust 900-pin FCBGA package rated for industrial temperatures, this device is engineered to meet the demands of modern high-bandwidth, DSP-intensive applications.
Its 20nm process architecture delivers up to 40% lower power consumption and up to 60% lower BOM cost compared to previous-generation FPGAs, making it an excellent choice for engineers seeking optimal price-performance-power ratios in 5G, data center, AI, medical, and industrial designs.
