The XCKU040-1FBVA676C is a high-performance Xilinx FPGA from AMD’s Kintex® UltraScale™ family, built on 20nm process technology. Designed to deliver the best price/performance/watt ratio in the mid-range FPGA market, the XCKU040-1FBVA676C combines 530,250 logic cells, 312 user I/O pins, and next-generation GTH transceivers — all in a compact 676-pin FCBGA package. Whether you are building 100G networking systems, medical imaging equipment, or advanced DSP pipelines, the XCKU040-1FBVA676C is engineered to meet demanding real-world requirements.
What Is the XCKU040-1FBVA676C?
The XCKU040-1FBVA676C is a member of AMD’s Kintex UltraScale FPGA family, a device series that leverages both monolithic and stacked silicon interface (SSI) technology. The “KU040” designation refers to the mid-range device within the Kintex UltraScale lineup, and the suffix “-1FBVA676C” encodes key attributes:
| Suffix Component |
Meaning |
| -1 |
Speed Grade 1 (standard commercial performance) |
| FBVA |
Fine-pitch Ball Grid Array (FCBGA) package type |
| 676 |
676 total package balls |
| C |
Commercial temperature range (0°C to 85°C) |
XCKU040-1FBVA676C Key Specifications
The table below summarizes the full technical specifications of the XCKU040-1FBVA676C as sourced from AMD’s official documentation and authorized distributor listings.
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCKU040-1FBVA676C |
| FPGA Family |
Kintex® UltraScale™ |
| Process Technology |
20nm |
| Logic Cells |
530,250 |
| CLBs (Configurable Logic Blocks) |
30,300 |
| Total RAM Bits |
21,606,000 |
| Number of User I/O |
312 |
| Supply Voltage (VCCINT) |
0.922V – 0.979V |
| Package / Case |
676-BBGA, FCBGA |
| Package Dimensions |
27mm × 27mm |
| Mounting Type |
Surface Mount (SMT) |
| Operating Temperature (TJ) |
0°C ~ 85°C |
| RoHS Status |
Compliant |
| Lifecycle Status |
Active |
XCKU040-1FBVA676C: Package and Pinout Overview
Understanding the 676-FCBGA Package
The XCKU040-1FBVA676C is housed in a 676-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package measuring 27mm × 27mm. This compact footprint makes it suitable for space-constrained PCB designs where a smaller form factor is critical.
| Package Feature |
Detail |
| Package Type |
FCBGA (Fine-pitch BGA) |
| Ball Count |
676 |
| Package Size |
27 × 27 mm |
| Ball Pitch |
Fine-pitch |
| Mount Style |
Surface Mount |
| I/O Pins Available |
312 User I/O |
The FCBGA package also offers excellent signal integrity characteristics, low parasitic inductance, and improved thermal dissipation compared to older PBGA packages — important considerations for high-speed designs.
XCKU040-1FBVA676C Logic Resources
Programmable Logic and DSP Capabilities
The XCKU040-1FBVA676C features a rich set of programmable logic resources designed for high-throughput, compute-intensive workloads.
| Resource |
Quantity |
| Logic Cells |
530,250 |
| CLBs |
30,300 |
| Look-Up Tables (LUTs) |
~242,400 |
| Flip-Flops |
~484,800 |
| DSP Slices |
1,920 |
| Block RAM (36Kb Blocks) |
600 |
| Total RAM Bits |
21,606,000 |
| UltraRAM (288Kb Blocks) |
0 (UltraScale, not UltraScale+) |
These resources make the XCKU040-1FBVA676C one of the most capable mid-range FPGAs available, particularly for signal processing applications that demand large numbers of DSP slices and memory resources.
XCKU040-1FBVA676C Transceiver Performance
Next-Generation GTH Serial Transceivers
A standout feature of the XCKU040-1FBVA676C is its complement of GTH high-speed serial transceivers, supporting data rates up to 12.5 Gb/s per lane in the FBVA676 package. These transceivers enable direct implementation of protocols such as PCIe, CPRI, JESD204B, SRIO, and 10G/100G Ethernet without external PHY components.
| Transceiver Feature |
Specification |
| Transceiver Type |
GTH |
| Max Data Rate (FBVA676 pkg) |
Up to 12.5 Gb/s per lane |
| Supported Protocols |
PCIe Gen3, CPRI, JESD204B, 10GbE, SRIO |
| Transceiver Organization |
Groups of 4 (Quads) |
XCKU040-1FBVA676C Power and Electrical Characteristics
Supply Voltage and Power Architecture
The XCKU040-1FBVA676C operates at a core supply voltage (VCCINT) of 0.922V to 0.979V, enabling a power-efficient design. AMD’s UltraScale architecture incorporates fine-grained clock gating and power management features that can reduce dynamic power consumption compared to previous-generation FPGAs.
| Electrical Parameter |
Value |
| VCCINT (Core Voltage) |
0.922V – 0.979V (typical 0.95V) |
| I/O Voltage (HP Banks) |
1.0V – 1.8V |
| I/O Voltage (HR Banks) |
1.2V – 3.3V |
| Power Reduction vs. Previous Gen |
Up to 40% lower |
| Configuration Voltage |
Standard (refer to AMD UG570) |
XCKU040-1FBVA676C Applications and Use Cases
The XCKU040-1FBVA676C is specifically optimized for the following application domains:
Networking and Data Center
The device’s 530K logic cells and high-bandwidth GTH transceivers make it ideal for 100G packet processing, network function virtualization (NFV), and data center switch fabrics. Its UltraScale architecture supports cut-through latency-sensitive designs that traditional ASICs cannot match for flexibility.
Medical Imaging
With 1,920 DSP slices and over 21 million bits of on-chip RAM, the XCKU040-1FBVA676C supports real-time image reconstruction algorithms for MRI, CT, and ultrasound systems. The device’s deterministic timing performance is critical in safety-sensitive medical equipment.
Wireless Infrastructure (5G and Heterogeneous Networks)
The XCKU040-1FBVA676C excels in remote radio head (RRH) and digital front-end (DFE) designs. Its JESD204B transceiver support and high DSP density make it a natural fit for 5G massive MIMO and LTE baseband processing.
High-Resolution Video Processing
For applications requiring 8K4K video processing, the device provides enough logic and memory resources to implement multi-stream video pipelines including compression, scaling, and format conversion.
Additional Application Fields
| Application |
XCKU040-1FBVA676C Role |
| Artificial Intelligence |
Hardware accelerator inference engines |
| Industrial Control |
Real-time deterministic control loops |
| IoT Edge Gateways |
Protocol conversion and sensor fusion |
| Cloud Computing |
Reconfigurable compute offload |
| Consumer Electronics |
High-performance multimedia processing |
XCKU040-1FBVA676C vs. Comparable Kintex UltraScale Devices
Understanding where the KU040 sits within AMD’s Kintex UltraScale lineup helps engineers select the right device for their design.
| Device |
Logic Cells |
DSP Slices |
Block RAM Bits |
Package Options |
| XCKU025 |
331,680 |
1,152 |
13,140,000 |
FFVA1156 |
| XCKU035 |
425,280 |
1,600 |
16,488,000 |
FBVA676, SFVA784 |
| XCKU040 |
530,250 |
1,920 |
21,606,000 |
FBVA676, FFVA1156 |
| XCKU060 |
726,000 |
2,760 |
30,096,000 |
FFVA1156, FFVA1517 |
| XCKU095 |
1,143,000 |
4,000 |
44,532,000 |
FFVA1156, FFVC1517 |
The XCKU040-1FBVA676C sits at a sweet spot: it offers significantly more resources than the KU025/KU035 while remaining cost-effective compared to the larger KU060 and KU095 devices.
Development Tools for XCKU040-1FBVA676C
AMD Vivado Design Suite
The XCKU040-1FBVA676C is fully supported by AMD Vivado Design Suite, which includes:
- RTL synthesis and implementation
- Place and route
- Timing closure and analysis
- IP integrator for block-based design
- Hardware simulation (Vivado Simulator)
- Partial reconfiguration support
Recommended Development Kit
Engineers evaluating the XCKU040-1FBVA676C should consider the AMD KCU105 Evaluation Kit, which features the KU040 device and provides a complete development platform including DDR4, PCIe, FMC expansion, and JESD204B analog interface support.
Ordering and Compliance Information
| Parameter |
Value |
| Part Number |
XCKU040-1FBVA676C |
| Manufacturer |
AMD (Xilinx) |
| DigiKey Part # |
5248124 |
| RoHS Compliance |
Yes |
| ECCN (Export Control) |
Refer to AMD Export Compliance Resources |
| Lifecycle |
Active (Production) |
| Packaging |
Tray |
Frequently Asked Questions (FAQ)
What is the XCKU040-1FBVA676C used for?
The XCKU040-1FBVA676C is used in applications requiring high-performance programmable logic, including 100G networking, 5G wireless infrastructure, medical imaging, 8K video processing, and AI acceleration.
What is the difference between XCKU040-1FBVA676C and XCKU040-1FFVA1156C?
Both devices use the same KU040 die. The FBVA676C is housed in a 27×27mm 676-ball FCBGA package with 312 user I/O, while the FFVA1156C is housed in a larger 35×35mm 1156-ball FCBGA with more I/O pins. Choose based on your I/O count requirements and PCB space constraints.
What speed grade is the XCKU040-1FBVA676C?
It is a Speed Grade -1, which is the standard commercial speed grade for the KU040. Higher speed grades (-2, -3) are available if your design requires higher clock frequencies.
Is the XCKU040-1FBVA676C RoHS compliant?
Yes, the XCKU040-1FBVA676C is RoHS compliant and uses lead-free solder ball materials in its FCBGA package.
What design software supports the XCKU040-1FBVA676C?
The device is fully supported by AMD Vivado Design Suite and is compatible with the Vivado IP Integrator, Vitis HLS, and the Vivado ML Edition.
Summary
The XCKU040-1FBVA676C is a production-ready, commercially-graded mid-range FPGA from AMD’s Kintex UltraScale family. With 530,250 logic cells, 1,920 DSP slices, 21.6 million RAM bits, 312 user I/O, and GTH transceivers supporting up to 12.5 Gb/s, it is a versatile and power-efficient choice for engineers targeting demanding applications across networking, wireless, medical, video, and AI domains. Its compact 676-FCBGA package and active lifecycle status make it a reliable foundation for both prototyping and volume production.
For engineers seeking a balance of performance, on-chip resources, and cost-effective packaging, the XCKU040-1FBVA676C remains one of the most compelling mid-range FPGAs in AMD’s current portfolio.
