The XCKU035-3FBVA676E is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Built on a cutting-edge 20nm process node, the XCKU035-3FBVA676E delivers the fastest speed grade (-3) in the Kintex UltraScale lineup, making it ideal for demanding signal-processing, 100G networking, and data center applications. If you are evaluating a Xilinx FPGA for your next design, this device offers an exceptional balance of performance, I/O density, and cost-effectiveness in a compact 676-pin FCBGA package.

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What Is the XCKU035-3FBVA676E?

The XCKU035-3FBVA676E is part of AMD’s Kintex UltraScale series — a mid-range FPGA family optimized for the best price-to-performance-per-watt ratio at 20nm. The “-3” speed grade designates the highest-performance variant in the XCKU035 device family, operating at a VCCINT supply voltage of 1.0V. The “E” suffix indicates an extended commercial temperature range (0°C to 100°C junction temperature), and the “676” denotes the 676-ball Fine-Pitch Chip-Scale Ball Grid Array (FCBGA) package.

This device is widely adopted in applications that require high DSP throughput, large embedded memory, and advanced transceiver capabilities — all in a compact, surface-mount package.

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XCKU035-3FBVA676E Key Specifications

The table below summarizes the most critical parameters of the XCKU035-3FBVA676E:

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XCKU035-3FBVA676E Package and Physical Details

Understanding the package of the XCKU035-3FBVA676E is essential for PCB design and layout planning. This device uses a 676-pin Fine-Pitch Chip-Scale Ball Grid Array (FCBGA), also listed as BBGA in some databases.

The compact 676-ball package keeps board area to a minimum while still exposing 312 user-accessible I/O pins — a significant advantage in space-constrained system designs.

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Memory and Logic Resources

The XCKU035-3FBVA676E provides generous on-chip memory and logic fabric to support complex programmable designs. The table below breaks down the core fabric resources:

The high block RAM-to-logic ratio is a defining characteristic of the Kintex UltraScale architecture. This makes the XCKU035-3FBVA676E particularly well-suited for applications that require large data buffers, FIFOs, and on-chip data storage without the need for external memory.

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Speed Grade and Power Supply

The XCKU035-3FBVA676E carries the -3 speed grade, which represents the highest-performance tier in the Kintex UltraScale XCKU035 family. The -3 devices operate at a nominal VCCINT of 1.0V, compared to 0.95V for -2 and -1 devices. This higher core voltage enables faster switching speeds and superior timing closure.

For power estimation and supply design, AMD recommends using the Xilinx Power Estimator (XPE) tool to determine accurate current requirements after the device has been configured with your specific design.

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Applications for the XCKU035-3FBVA676E

Thanks to its combination of high logic density, generous block RAM, and the -3 speed grade, the XCKU035-3FBVA676E is well suited for a broad range of demanding applications:

100G Networking and Data Centers

The Kintex UltraScale family was designed with 100G packet processing in mind. The XCKU035-3FBVA676E’s high DSP throughput and next-generation transceivers make it a strong fit for line cards, network interface controllers, and high-speed switching infrastructure.

DSP-Intensive Signal Processing

Applications that require intensive DSP workloads — such as software-defined radio (SDR), radar signal processing, and test and measurement equipment — benefit directly from the high DSP-slice density and large block RAM available in the XCKU035-3FBVA676E.

Medical Imaging

Next-generation medical imaging systems, including 8K/4K video pipelines and computed tomography (CT) data acquisition, demand both high bandwidth and real-time processing. The XCKU035-3FBVA676E addresses both requirements with its UltraScale fabric and memory resources.

Wireless Infrastructure

The device is targeted at heterogeneous wireless infrastructure, including remote radio head (RRH) digital front-end (DFE) implementations for 4G/LTE and 5G base stations.

Video Processing

The XCKU035-3FBVA676E supports 8K4K video applications, making it a valid choice for broadcast, media processing, and display controller designs.

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Design Tool Support

The XCKU035-3FBVA676E is fully supported by the AMD Vivado™ Design Suite, which provides a complete design flow including synthesis, place-and-route, simulation, and timing analysis. The Vivado toolchain is co-optimized with UltraScale devices to achieve rapid design closure.

Note: Designs using the dedicated System Monitor I2C or PCIe reset I/O where bank 65 VCCO = 3.3V must use Vivado Design Suite 2015.4 or later.

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Ordering and Compliance Information

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Why Choose the XCKU035-3FBVA676E?

The XCKU035-3FBVA676E stands out in the mid-range FPGA landscape for several reasons:

• Highest speed grade (-3) in the XCKU035 family ensures maximum timing headroom and design performance.
• 20nm process technology delivers up to 40% lower power versus the previous FPGA generation.
• ASIC-like clocking through fine-grained clock gating reduces dynamic power without sacrificing performance.
• Footprint compatibility with Virtex UltraScale devices allows design teams to scale up to higher-density devices without a PCB re-spin.
• RoHS3 compliant packaging ensures the device meets current environmental and regulatory standards.
• Active product status guarantees continued availability and long-term production support from AMD.

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Summary

The XCKU035-3FBVA676E is a production-grade, high-performance FPGA from AMD’s Kintex UltraScale family, fabricated on a 20nm process with 444,343 logic cells, 312 user I/O pins, and nearly 19.5 million bits of on-chip block RAM — all housed in a compact 676-pin FCBGA package. With the -3 speed grade operating at 1.0V VCCINT and full Vivado Design Suite support, it is a reliable and scalable choice for engineers designing next-generation networking, wireless, imaging, and DSP systems.