The XCKU035-2SFVA784I is a high-performance Xilinx FPGA from AMD’s Kintex UltraScale family, built on 20nm technology. Combining 355,474 logic cells, 468 user I/Os, and a compact 784-pin FC-BGA package, this industrial-grade device delivers an exceptional balance of processing power, DSP throughput, and power efficiency — making it a preferred choice for 100G networking, medical imaging, wireless infrastructure, and data center applications.
What Is the XCKU035-2SFVA784I?
The XCKU035-2SFVA784I belongs to AMD Xilinx’s Kintex UltraScale series — the mid-range FPGA family engineered for the highest price/performance/watt ratio at 20nm. The part number breaks down as follows:
| Field |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial Device |
| KU035 |
KU035 |
Kintex UltraScale, device size 035 |
| -2 |
Speed Grade 2 |
Mid-speed, 0.95V VCCINT |
| SFVA |
Package Code |
Super Fine-pitch Vertical Array BGA |
| 784 |
Pin Count |
784 solder ball pins |
| I |
Temp Grade |
Industrial (–40°C to +100°C junction) |
XCKU035-2SFVA784I Key Specifications
Core Logic & Memory
| Parameter |
Value |
| FPGA Family |
Kintex UltraScale |
| Logic Cells |
355,474 |
| LUT Flip-Flops (LUTFFs) |
203,128 |
| Macrocells |
444,343 |
| Total Block RAM |
19,456 Kbit |
| UltraRAM |
Supported |
| DSP48E2 Slices |
High DSP-to-logic ratio |
| Process Node |
20nm |
Package & Electrical
| Parameter |
Value |
| Package |
FC-BGA (SFVA784) |
| Pin Count |
784 Pins |
| User I/Os |
468 |
| Core Supply Voltage (VCCINT) |
0.95V |
| I/O Supply Voltage |
Up to 3.3V |
| Core Voltage Min / Max |
0.922V / 0.979V |
| Maximum Operating Frequency |
630 MHz |
| MSL Rating |
MSL 4 – 72 hours |
Transceivers & Connectivity
| Parameter |
Value |
| GTH Transceiver Count |
Up to 16 |
| GTH Max Line Rate (A784 pkg) |
12.5 Gb/s |
| Supported Protocols |
PCIe Gen3, 100G Ethernet, JESD204B, Interlaken |
| Clock Management |
MMCM, PLL |
Temperature & Compliance
| Parameter |
Value |
| Temperature Grade |
Industrial (“I”) |
| Junction Temperature Range |
–40°C to +100°C |
| RoHS Compliance |
Yes |
| Packaging Format |
Tray |
XCKU035-2SFVA784I Performance Features
H3: UltraScale Architecture Advantages
The XCKU035-2SFVA784I is built on AMD Xilinx’s UltraScale architecture, which provides ASIC-like clocking and routing methodologies. This results in predictable timing closure, lower power per logic block, and superior SSI (Stacked Silicon Interconnect) readiness compared to previous 7-Series devices.
Key architectural improvements over earlier Xilinx families include:
- Fine granular clock gating that reduces dynamic power consumption by up to 40% versus previous generations
- Enhanced DSP48E2 slices with wider multiplier support for floating-point, ECC, and CRC functions
- Hardened memory cascade in block RAM reduces fabric use and boosts performance
- Next-generation GTH transceivers for multi-protocol serial connectivity at up to 12.5 Gb/s
H3: DSP and Signal Processing Capability
The Kintex UltraScale XCKU035 delivers the highest signal processing bandwidth available in a mid-range FPGA. This makes the XCKU035-2SFVA784I ideal for:
- Wireless baseband processing (LTE, 5G Radio Unit DFE 8×8)
- Medical imaging pipelines (next-generation MRI/CT reconstruction)
- 8K4K video processing and real-time transcoding
- 100G packet processing for networking line cards
H3: Block RAM and UltraRAM
The device features 19,456 Kbit of on-chip block RAM alongside UltraRAM support. UltraRAM provides large, dense on-chip memory buffers that reduce the need for external memory components, cutting BOM cost and improving latency-sensitive applications.
XCKU035-2SFVA784I vs. Related Kintex UltraScale Devices
| Part Number |
Speed Grade |
Temp Grade |
Package |
Pin Count |
I/Os |
| XCKU035-2SFVA784I |
-2 |
Industrial |
SFVA |
784 |
468 |
| XCKU035-2SFVA784E |
-2 |
Extended |
SFVA |
784 |
468 |
| XCKU035-1SFVA784I |
-1 |
Industrial |
SFVA |
784 |
468 |
| XCKU035-3FBVA900E |
-3 |
Extended |
FBVA |
900 |
— |
| XCKU035-2FBVA900I |
-2 |
Industrial |
FBVA |
900 |
— |
| XCKU035-2FFVA1156I |
-2 |
Industrial |
FFVA |
1156 |
— |
Note: The “I” suffix indicates Industrial temperature grade, making the XCKU035-2SFVA784I suitable for harsh operating environments where commercial-grade devices would fail.
Speed Grade Comparison for XCKU035
| Speed Grade |
VCCINT Voltage |
Performance Level |
Use Case |
| -3 |
1.0V |
Highest |
Maximum clock frequency |
| -2 (this device) |
0.95V |
Mid-High |
Balanced performance & power |
| -1 |
0.95V |
Standard |
Cost-sensitive designs |
| -1L |
0.95V / 0.90V |
Low power |
Power-constrained systems |
Supported Development Tools
The XCKU035-2SFVA784I is fully supported by AMD’s Vivado Design Suite, the industry-standard FPGA design environment. Vivado provides:
- Design Entry (RTL, IP Integrator)
- Synthesis and Implementation
- Place & Route with UltraScale optimizations
- Simulation and Formal Verification
- Power Analysis via Xilinx Power Estimator (XPE)
For power estimation and supply rail sequencing, AMD recommends the XPE spreadsheet tool to validate VCCINT, VCCINT_IO, VCCBRAM, VCCAUX, and VCCO requirements before PCB layout.
Typical Applications for XCKU035-2SFVA784I
H3: 100G Networking and Data Centers
The GTH transceiver array and Interlaken/100GbE hard IP make this device a strong fit for:
- Line card forwarding engines
- Deep packet inspection (DPI) offload
- Network function virtualization (NFV) acceleration
H3: Wireless Infrastructure
The XCKU035’s DSP density supports demanding heterogeneous wireless workloads including:
- Remote Radio Head (RRH) digital front-end (DFE)
- LTE/5G baseband signal processing
- JESD204B high-speed ADC/DAC interfacing
H3: Medical Imaging
With high block RAM capacity and floating-point DSP support, the device accelerates:
- Real-time MRI/CT reconstruction
- Ultrasound beamforming
- High-frame-rate X-ray processing
H3: Video and Broadcast
- 8K/4K real-time video encoding and decoding
- Multi-channel SDI capture and routing
- Low-latency frame synchronization
Ordering Information
| Attribute |
Detail |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCKU035-2SFVA784I |
| DigiKey Part # |
122-XCKU035-2SFVA784II-ND (verify at point of purchase) |
| Packaging |
Tray |
| Compliance |
RoHS |
| ECCN |
3A991 (verify for export compliance) |
Frequently Asked Questions
H4: What is the difference between XCKU035-2SFVA784I and XCKU035-2SFVA784E?
The only difference is the temperature grade. The “I” variant is rated for Industrial temperature (–40°C to +100°C junction), while the “E” variant is Extended commercial grade (0°C to +100°C). All electrical and logic specifications are otherwise identical for the same speed grade.
H4: What voltage does the XCKU035-2SFVA784I core require?
The -2 speed grade operates at 0.95V VCCINT. The I/O voltage supports a range up to 3.3V depending on the I/O standard selected.
H4: Does the XCKU035-2SFVA784I support PCIe?
Yes. The UltraScale architecture includes hardened PCIe Gen3 IP, enabling high-bandwidth host interface connectivity.
H4: What design software is compatible with this device?
The device is supported by AMD Vivado Design Suite (2014.1 and later). Legacy ISE is not supported for UltraScale devices.
H4: What is the maximum transceiver line rate in the 784-pin package?
GTH transceivers in the A784 package support a maximum line rate of 12.5 Gb/s per lane. Higher line rates (up to 16.3 Gb/s) are available in larger packages such as FFVA1156.
