The XCKU035-2SFVA784E is a high-performance Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), belonging to the Kintex® UltraScale™ family. Built on 20nm process technology, this device delivers an outstanding balance of processing power, signal bandwidth, and energy efficiency — making it a top choice for engineers designing next-generation embedded systems. Whether you are developing 100G networking equipment, medical imaging platforms, or advanced wireless infrastructure, the XCKU035-2SFVA784E delivers the performance you need at a competitive price point.
What Is the XCKU035-2SFVA784E?
The XCKU035-2SFVA784E is a mid-range Kintex UltraScale FPGA that combines 355,474 logic cells with 468 user I/O pins in a compact 784-pin FC-BGA package. The “-2” speed grade and “E” suffix indicate commercial extended temperature range operation, making this device well-suited for demanding industrial and commercial applications. It is part of AMD’s Xilinx FPGA product line — a trusted platform widely used across telecom, data center, and embedded computing markets.
XCKU035-2SFVA784E Key Specifications
General Product Identification
| Parameter |
Value |
| Part Number |
XCKU035-2SFVA784E |
| Manufacturer |
AMD (Xilinx) |
| Series / Family |
Kintex® UltraScale™ |
| Product Category |
FPGA — Field Programmable Gate Array |
| RoHS Status |
RoHS Compliant |
Core Logic Resources
The XCKU035-2SFVA784E provides abundant logic fabric for complex digital designs. The table below summarizes the core resources available on this device.
| Resource |
Specification |
| Logic Cells |
355,474 |
| Look-Up Tables (LUTs) |
444,343 |
| Flip-Flops |
891,840 |
| DSP Slices |
1,920 |
| Block RAM (BRAM) |
19,456 Kbits (~22.5 Mb) |
| UltraRAM (URAM) |
Not available on XCKU035 |
The high DSP slice count makes this FPGA particularly powerful for signal processing workloads, including FFT, FIR filtering, and floating-point arithmetic.
Electrical and Physical Characteristics
| Parameter |
Value |
| Process Node |
20nm |
| Core Voltage (VCCINT) |
0.95V |
| User I/O Pins |
468 |
| Package Type |
FC-BGA (Flip-Chip Ball Grid Array) |
| Package Designation |
SFVA784 |
| Total Pin Count |
784 |
| Mounting Type |
Surface Mount (SMT) |
| Operating Temperature (Extended) |
0°C to +100°C (Tj) |
| Speed Grade |
-2 (Commercial / Extended) |
High-Speed Serial Transceivers
| Parameter |
Value |
| GTH Transceiver Count |
16 |
| Max GTH Line Rate |
Up to 16.3 Gb/s |
| PCIe Interface |
Gen3 × 8 |
| Integrated 100G Ethernet |
Yes (via Hard IP blocks) |
The 16 GTH transceivers support a wide range of high-speed protocols, including PCIe Gen3, 10G/100G Ethernet, CPRI, JESD204B, and interlaken — all essential for modern networking and data center applications.
Memory Interfaces
| Interface |
Support |
| DDR4 / DDR3L |
Yes |
| LPDDR3 |
Yes |
| QDR-IV / RLDRAM3 |
Yes |
| Max Memory Data Rate |
2,666 Mb/s (DDR4) |
XCKU035-2SFVA784E Part Number Decoder
Understanding the part number is essential when selecting the correct variant for your design. Here is a breakdown of each segment:
| Segment |
Code |
Meaning |
| Family |
XC |
Xilinx Commercial Device |
| Series |
KU |
Kintex UltraScale |
| Device Size |
035 |
Mid-range density (355K+ logic cells) |
| Speed Grade |
2 |
Standard commercial speed |
| Package |
SFVA |
Super Fine Pitch (FC-BGA) |
| Pin Count |
784 |
784 total pins |
| Temp Range |
E |
Extended: 0°C to +100°C |
Why Choose the XCKU035-2SFVA784E?
Best Price/Performance/Watt at 20nm
Kintex UltraScale devices provide the best price/performance/watt at 20nm and include the highest signal processing bandwidth in a mid-range device, next-generation transceivers, and low-cost packaging for an optimum blend of capability and cost-effectiveness. This makes the XCKU035-2SFVA784E an ideal choice when budget constraints exist alongside high-performance requirements.
High DSP and Memory Bandwidth
With 1,920 DSP slices and nearly 22.5 Mb of on-chip block RAM, the XCKU035-2SFVA784E handles demanding DSP-intensive tasks without relying heavily on external memory. This directly reduces board complexity and bill-of-materials (BOM) cost.
Next-Generation UltraScale Architecture
Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.
16 GTH Transceivers for Multi-Protocol Connectivity
The integrated GTH transceivers support up to 16.3 Gb/s per lane, enabling the XCKU035-2SFVA784E to handle multiple high-speed serial standards simultaneously — a critical advantage for networking and wireless applications.
Target Applications for the XCKU035-2SFVA784E
The Kintex UltraScale family is perfect for DSP-intensive processing required in next-generation medical imaging, 8K4K video, and heterogeneous wireless infrastructure, as well as packet processing in 100G networking and data center applications.
The following table outlines the primary application domains where the XCKU035-2SFVA784E excels:
| Application Domain |
Use Case |
| 100G Networking |
Packet processing, switching, OTN framing |
| Wireless Infrastructure |
Remote Radio Head (RRH), massive MIMO, LTE/5G baseband |
| Medical Imaging |
MRI reconstruction, CT processing, ultrasound systems |
| 8K/4K Video Processing |
Real-time encoding, format conversion, broadcast |
| Data Center Acceleration |
FPGA-based SmartNIC, hardware offload |
| Radar & Defense |
Signal processing, beamforming |
| Test & Measurement |
Protocol analysis, signal generation |
Vivado Design Suite Compatibility
The XCKU035-2SFVA784E is fully supported by AMD’s Vivado Design Suite, the industry-standard FPGA design environment. Vivado provides synthesis, place-and-route, simulation, and power analysis tools optimized for UltraScale devices. Designers benefit from:
- High-Level Synthesis (HLS) — design in C/C++ and synthesize to RTL
- IP Integrator — rapid block-level design using pre-verified IP cores
- Xilinx Power Estimator (XPE) — accurate power modeling before hardware bring-up
- Partial Reconfiguration — dynamically reprogram sections of the FPGA at runtime
XCKU035-2SFVA784E vs. Similar Devices
Choosing the right FPGA variant requires comparing density, package size, and temperature range. The table below compares the XCKU035-2SFVA784E to closely related alternatives.
| Part Number |
Logic Cells |
I/O |
Package |
Pins |
Temp Range |
| XCKU035-2SFVA784E |
355,474 |
468 |
SFVA |
784 |
Extended (E) |
| XCKU035-2SFVA784I |
355,474 |
468 |
SFVA |
784 |
Industrial (I) |
| XCKU035-2FBVA900E |
355,474 |
468 |
FBVA |
900 |
Extended (E) |
| XCKU035-2FFVA1156E |
355,474 |
468 |
FFVA |
1156 |
Extended (E) |
| XCKU040-2SFVA784E |
530,250 |
468 |
SFVA |
784 |
Extended (E) |
The XCKU035-2SFVA784E occupies the sweet spot for designs that require mid-range density in a smaller 784-pin footprint without the added cost of industrial-grade screening.
Ordering and Availability
| Detail |
Information |
| Manufacturer Part Number |
XCKU035-2SFVA784E |
| Manufacturer |
AMD (Xilinx) |
| DigiKey Part Number |
122-1819-ND |
| Product Status |
Active |
| Package Quantity |
Tray |
| Minimum Order Quantity |
1 |
| RoHS Compliance |
Yes |
Frequently Asked Questions (FAQ)
What is the XCKU035-2SFVA784E used for?
The XCKU035-2SFVA784E is used in high-performance embedded system designs including 100G networking, 5G wireless infrastructure, medical imaging, video processing, and data center acceleration. Its combination of logic density, DSP slices, and high-speed transceivers makes it versatile across many industries.
What is the operating temperature range of the XCKU035-2SFVA784E?
The “E” suffix in the part number indicates an Extended temperature range, meaning the device operates from 0°C to +100°C junction temperature. For industrial applications requiring –40°C to +100°C, the XCKU035-2SFVA784I is the appropriate alternative.
What design software supports the XCKU035-2SFVA784E?
AMD’s Vivado Design Suite is the primary design tool for all UltraScale FPGAs. The XCKU035-2SFVA784E is not supported by the legacy ISE design tool.
How many I/O pins does the XCKU035-2SFVA784E have?
The device provides 468 user I/O pins within its 784-pin FC-BGA package. The remaining pins are used for power, ground, configuration, and transceiver connections.
What high-speed protocols do the GTH transceivers support?
The 16 GTH transceivers on the XCKU035-2SFVA784E support PCIe Gen3, 10G Ethernet, 100G Ethernet (with multiple lanes), CPRI, JESD204B, Interlaken, and other industry-standard serial protocols.
Summary
The XCKU035-2SFVA784E is a powerful, cost-effective mid-range FPGA that delivers exceptional signal processing performance in a 784-pin FC-BGA package. With 355,474 logic cells, 1,920 DSP slices, 16 GTH transceivers, and broad memory interface support — all built on 20nm process technology — this device addresses a wide range of demanding applications. It is an outstanding choice for engineering teams seeking to deploy high-performance, power-efficient digital systems at scale.
