The XCKU035-1FBVA900I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, belonging to the Kintex® UltraScale™ family. Built on cutting-edge 20nm process technology, this device delivers an exceptional balance of signal processing power, DSP bandwidth, and power efficiency — making it a premier choice for 100G networking, medical imaging, video processing, and wireless infrastructure applications.

Whether you are designing for industrial environments or high-throughput data centers, the XCKU035-1FBVA900I provides the flexibility, logic density, and I/O capability your design demands. For a broader selection of configurable logic solutions, explore our full range of Xilinx FPGA products.

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What Is the XCKU035-1FBVA900I?

The XCKU035-1FBVA900I is a member of AMD’s Kintex UltraScale FPGA family — a mid-range device line engineered to maximize price-per-performance-per-watt at 20nm. The part number breaks down as follows:

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Key Specifications at a Glance

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XCKU035-1FBVA900I Architecture Overview

UltraScale Architecture

The XCKU035-1FBVA900I is built on Xilinx’s UltraScale architecture, which delivers ASIC-like performance and power management capabilities. This architecture uses a next-generation interconnect fabric that eliminates traditional routing bottlenecks found in earlier FPGA generations, enabling predictable timing closure and higher operating frequencies.

The UltraScale architecture also introduces ASIC-like clocking with fine-granular clock gating, which directly contributes to the device’s class-leading power reduction — up to 40% lower power versus previous-generation Kintex FPGAs.

Logic Resources

DSP and Signal Processing

With 1,440 DSP48E2 slices, the XCKU035-1FBVA900I delivers substantial signal processing throughput suited for:

• FIR Filtering in communications and radar
• FFT / IFFT operations for spectrum analysis
• Matrix multiplication in AI inference pipelines
• Wireless baseband processing in LTE/5G systems
• Medical imaging reconstruction and real-time ultrasound

Transceiver Capabilities

These next-generation GTH transceivers support multi-protocol operation across PCIe Gen3, CPRI, JESD204B, SRIO, and 10G/40G/100G Ethernet, making the XCKU035-1FBVA900I ideal for high-bandwidth line-card and backplane designs.

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XCKU035-1FBVA900I Pin and Package Details

Package: 900-Pin FCBGA

The Flip-Chip Ball Grid Array (FCBGA) package used by the XCKU035-1FBVA900I provides a compact 31mm × 31mm footprint with 0.8mm ball pitch. This package is footprint-compatible with other Kintex UltraScale devices, allowing for straightforward design migration.

I/O Standards Supported

The XCKU035-1FBVA900I supports a wide range of single-ended and differential I/O standards:

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Power Specifications

Supply Voltages

Power Efficiency Highlights

The -1 speed grade of the XCKU035 operates at a VCCINT of 0.95V, delivering a strong balance between performance and power consumption. The UltraScale architecture features:

• Fine-granular clock gating reducing dynamic power
• Low-power standby modes
• Up to 40% total power reduction vs. Kintex-7 FPGAs
• Optimized SSI (Stacked Silicon Interconnect) power delivery

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Target Applications for XCKU035-1FBVA900I

The XCKU035-1FBVA900I is purpose-built for performance-critical, mid-range FPGA applications. Its combination of DSP density, transceiver bandwidth, and industrial temperature rating makes it a preferred solution in:

Networking and Data Center

• 100G Ethernet packet processing and line-rate forwarding
• Network Function Virtualization (NFV) offload engines
• OTN (Optical Transport Network) framing and switching
• Data center interconnect and switching fabrics

Wireless Infrastructure

• 4G LTE / 5G NR Remote Radio Head (RRH) digital front-end
• Massive MIMO beamforming and signal aggregation
• Heterogeneous network baseband processing
• CPRI / eCPRI fronthaul interfaces

Defense and Aerospace

• Radar signal processing and target tracking
• Electronic warfare and signals intelligence
• Software-Defined Radio (SDR) platforms
• Secure communications and encryption acceleration

Medical Imaging

• High-resolution ultrasound signal chain processing
• CT / MRI image reconstruction pipelines
• 8K×4K video acquisition and real-time processing
• DICOM image streaming and transfer

Industrial and Test Equipment

• High-speed data acquisition systems
• Machine vision processing pipelines
• Industrial automation real-time control
• Protocol analysis and test instrumentation

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Software Development: Vivado Design Suite

The XCKU035-1FBVA900I is fully supported by AMD’s Vivado™ Design Suite, which provides:

Vivado is available in free WebPACK and full-featured paid editions. The XCKU035 is supported from Vivado 2014.1 onwards.

Additionally, AMD’s Vitis™ Unified Software Platform enables high-level synthesis (HLS) for accelerating algorithm development targeting the XCKU035 device fabric.

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Part Number Decoder: XCKU035 Speed Grades and Variants

The XCKU035 device is available in multiple speed grades and package options. The table below shows common variants:

Temperature Range Key:

The XCKU035-1FBVA900I specifically targets industrial-grade applications where reliable operation across wide temperature excursions is mandatory.

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Compliance and Certifications

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Comparison: XCKU035 vs. Adjacent Kintex UltraScale Devices

The XCKU035 occupies the sweet spot in the Kintex UltraScale lineup, offering significantly more DSP capacity and logic than the XCKU025 while maintaining a cost advantage over the larger XCKU040 and XCKU060.

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Frequently Asked Questions (FAQ)

What is the XCKU035-1FBVA900I used for?

The XCKU035-1FBVA900I is used in high-performance applications requiring DSP-intensive processing, including 100G networking, medical imaging, wireless infrastructure (4G/5G), and defense signal processing systems.

What is the difference between -1, -2, and -3 speed grades?

The speed grade indicates the maximum switching performance of the device. The -3 speed grade is the fastest, while -1 is the slowest (but lower power) within the Kintex UltraScale family. All speed grades of the XCKU035 operate at VCCINT = 0.95V in standard operation.

Is the XCKU035-1FBVA900I RoHS compliant?

Yes, the XCKU035-1FBVA900I is fully RoHS compliant and lead-free.

What development tools are supported?

The XCKU035-1FBVA900I is supported by AMD Vivado Design Suite (v2014.1 and later), Vitis HLS for C/C++ design entry, and the Xilinx Power Estimator (XPE) for power analysis.

What temperature range does the XCKU035-1FBVA900I support?

The “I” suffix designates an Industrial temperature range, meaning the device is specified for operation from –40°C to +100°C junction temperature.

Can this device be used for PCIe applications?

Yes. The XCKU035-1FBVA900I integrates a PCIe Gen3 x8 hard block, enabling high-bandwidth PCI Express connectivity without consuming additional logic resources.

What package is used and what is the pin pitch?

The XCKU035-1FBVA900I uses a 900-ball Flip-Chip BGA (FCBGA) package with 0.8mm ball pitch and a 31mm × 31mm body size.

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Summary

The XCKU035-1FBVA900I from AMD Xilinx is a robust, industrial-grade FPGA that delivers:

• 355,474 logic cells for complex design implementation
• 1,440 DSP slices for high-throughput signal processing
• 20 GTH transceivers at up to 16.3 Gb/s for multi-protocol connectivity
• 468 user I/Os in a compact 900-pin FCBGA package
• Industrial temperature range (–40°C to +100°C) for demanding environments
• 20nm low-power process for optimal performance-per-watt

With its industry-leading price-performance-per-watt ratio and broad ecosystem support through Vivado Design Suite, the XCKU035-1FBVA900I remains one of the most versatile mid-range FPGAs available for design engineers today.