The XCKU035-1FBVA676I is a high-performance Xilinx FPGA from the Kintex® UltraScale™ family, manufactured by AMD (formerly Xilinx). Built on an advanced 20nm architecture, it delivers the industry-leading price-to-performance ratio required for demanding applications in networking, wireless infrastructure, medical imaging, and video processing.

Whether you are an engineer sourcing components for a new design or a procurement specialist comparing mid-range FPGAs, this guide covers everything you need to know about the XCKU035-1FBVA676I — including full technical specifications, key features, pin configuration, supported applications, and ordering details.

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What Is the XCKU035-1FBVA676I?

The XCKU035-1FBVA676I belongs to AMD’s Kintex UltraScale FPGA product line. The device is based on the UltraScale architecture, which uses ASIC-like clocking and routing to minimize power consumption while maximizing logic throughput. It is packaged in a 676-pin FCBGA (Flip-Chip Ball Grid Array) format, making it suitable for compact, high-density PCB designs.

The suffix breakdown in the part number reveals key ordering attributes:

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XCKU035-1FBVA676I Key Technical Specifications

The table below summarizes the core electrical and logic specifications of the XCKU035-1FBVA676I as sourced from AMD’s official documentation and authorized distributor listings.

Core Logic Resources

Memory Resources

DSP and Processing Resources

I/O and Connectivity

Power and Electrical Characteristics

Package and Physical Dimensions

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XCKU035-1FBVA676I Speed Grade and Temperature Grade Explained

Speed Grade: -1

The -1 speed grade is the standard (entry-level) speed grade in the Kintex UltraScale family. Devices with higher speed grades (e.g., -2, -3) support higher operating frequencies, but the -1 grade still delivers excellent performance for most industrial and communications applications. If your design requires maximum clock frequencies, consider the -2FBVA676E (extended temperature commercial) or -2FBVA676C (commercial temperature) variants.

Temperature Grade: Industrial (I)

The “I” suffix designates the Industrial temperature grade, meaning the device is rated to operate reliably from -40°C to +100°C. This makes the XCKU035-1FBVA676I suitable for deployment in harsh environments such as outdoor wireless base stations, industrial automation systems, and military-adjacent applications.

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XCKU035-1FBVA676I vs. Comparable Kintex UltraScale Devices

The table below compares the XCKU035-1FBVA676I to other variants and closely related parts to help you select the right device for your design.

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Key Features and Benefits of the Kintex UltraScale XCKU035

#### 20nm UltraScale Architecture

The Kintex UltraScale family leverages TSMC’s 20nm planar process, delivering a step-change improvement in performance-per-watt compared to the previous-generation Kintex-7 (28nm) devices. The architecture features ASIC-like clocking — eliminating dedicated clock buffers and routing congestion — which allows timing closure at high frequencies with less engineering effort.

#### High DSP and Block RAM Density

With 1,700 DSP48E2 slices and nearly 19,456 Kbits of block RAM, the XCKU035-1FBVA676I is optimized for compute-intensive workloads. The high DSP-to-logic ratio makes it especially well-suited for:

• Wireless baseband processing (LTE, 5G NR)
• FFT and FIR filter acceleration
• Software-defined radio (SDR)
• Digital front-end (DFE) signal processing

#### Next-Generation GTH Transceivers

The device integrates 16 GTH transceivers capable of running at speeds up to 16.3 Gb/s per lane. These transceivers support common high-speed serial protocols including PCIe Gen3, 10GbE, CPRI, JESD204B, and Interlaken, enabling high-bandwidth data movement in networking and communications applications.

#### Low-Cost FCBGA-676 Package

The 676-pin FCBGA package is among the most cost-effective options in the Kintex UltraScale lineup. The compact footprint reduces PCB area requirements and enables lower-cost board designs, making the XCKU035-1FBVA676I one of the most economical mid-range FPGAs for volume production.

#### Up to 40% Lower Power vs. Previous Generation

Compared to 28nm Kintex-7 devices, the Kintex UltraScale architecture achieves up to 40% lower total power consumption through fine-grained clock gating, improved routing efficiency, and process technology scaling. This dramatically reduces thermal management requirements and extends battery life in portable or embedded applications.

#### Integrated Hard IP Blocks

The XCKU035-1FBVA676I includes hardened IP blocks that eliminate the need for costly soft implementations in fabric:

• PCIe Gen3 x8 (hardened)
• 100G Ethernet MAC (hardened)
• Interlaken (hardened)
• CMACUs for high-speed Ethernet

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Target Applications for XCKU035-1FBVA676I

The XCKU035-1FBVA676I is engineered to address a broad range of demanding applications across several industries.

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Development Tools and Design Flow

#### Vivado Design Suite (Recommended)

AMD’s Vivado Design Suite is the primary design environment for the XCKU035-1FBVA676I. It provides:

• RTL synthesis and implementation
• Timing analysis and closure
• IP integrator for block design
• Simulation support (XSIM, ModelSim, Questa)
• On-chip debug via Integrated Logic Analyzer (ILA)

Vivado ML Edition (formerly Vivado HLx) also supports high-level synthesis (HLS) via Vitis HLS, enabling C/C++ to RTL design flows.

#### Vitis Unified Software Platform

For applications requiring embedded software alongside FPGA logic, Vitis provides an integrated environment for developing and accelerating software-defined hardware.

#### Supported IP Cores

The XCKU035-1FBVA676I is compatible with AMD’s full portfolio of Kintex UltraScale IP cores, including:

• AXI4 Interconnect
• MIG (Memory Interface Generator) for DDR4/DDR3
• Aurora 8B/10B and 64B/66B serial protocols
• JESD204B for high-speed ADC/DAC interfaces
• Video processing cores (VHDL / IP integrator)

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Ordering Information

Note: Pricing and availability are subject to change. Contact your authorized AMD/Xilinx distributor for current lead times and volume pricing.

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Frequently Asked Questions (FAQ)

What is the XCKU035-1FBVA676I used for?

The XCKU035-1FBVA676I is a mid-range industrial-grade FPGA used in wireless communications, data center networking, medical imaging, video processing, and defense applications. Its combination of high DSP density, block RAM, and GTH transceivers makes it ideal for signal processing and high-bandwidth connectivity.

What is the difference between XCKU035-1FBVA676I and XCKU035-1FBVA676C?

The only difference between the two is the temperature grade. The “I” suffix designates Industrial grade (-40°C to +100°C), while the “C” suffix designates Commercial grade (0°C to +85°C). All other specifications — logic resources, I/O count, package, and speed grade — are identical.

What design tool should I use for the XCKU035-1FBVA676I?

AMD’s Vivado Design Suite is the recommended and supported tool for designing with all Kintex UltraScale devices, including the XCKU035-1FBVA676I. The legacy ISE tool does not support UltraScale devices.

Does the XCKU035-1FBVA676I support DDR4 memory interfaces?

Yes. The XCKU035-1FBVA676I supports DDR4 and DDR3L external memory interfaces through the Xilinx Memory Interface Generator (MIG) IP core.

What transceiver protocols does the XCKU035-1FBVA676I support?

The GTH transceivers in the XCKU035-1FBVA676I support PCIe Gen3, 10GbE, CPRI, eCPRI, JESD204B, Interlaken, and other high-speed serial standards at speeds up to 16.3 Gb/s per lane.

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Summary

The XCKU035-1FBVA676I is one of the most capable mid-range FPGAs available in the Kintex UltraScale family. It combines 444,343 logic cells, 1,700 DSP slices, 19,456 Kbits of block RAM, and 16 high-speed GTH transceivers in a compact 676-pin FCBGA package — all rated for Industrial temperature operation from -40°C to +100°C.

With AMD’s Vivado design environment, broad IP core support, and hardened PCIe Gen3 and 100G Ethernet blocks, the XCKU035-1FBVA676I is an ideal choice for engineers designing next-generation wireless, networking, imaging, and signal processing systems.